- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
Patent holdings for IPC class H01L 23/48
Total number of patents in this class: 16344
10-year publication summary
|
1176
|
1074
|
991
|
956
|
993
|
905
|
924
|
989
|
1149
|
1019
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
2600 |
| Samsung Electronics Co., Ltd. | 149087 |
1358 |
| Intel Corporation | 46460 |
847 |
| Micron Technology, Inc. | 26558 |
527 |
| International Business Machines Corporation | 61721 |
409 |
| Infineon Technologies AG | 8287 |
262 |
| Mitsubishi Electric Corporation | 46926 |
262 |
| STATS ChipPAC Pte. Lte. | 1546 |
261 |
| Rohm Co., Ltd. | 6560 |
245 |
| Renesas Electronics Corporation | 5928 |
222 |
| Qualcomm Incorporated | 87585 |
220 |
| Texas Instruments Incorporated | 19495 |
218 |
| GLOBALFOUNDRIES U.S. Inc. | 6418 |
214 |
| SK Hynix Inc. | 11676 |
210 |
| Kioxia Corporation | 10452 |
197 |
| Advanced Semiconductor Engineering, Inc. | 1679 |
173 |
| Invensas Corporation | 611 |
146 |
| Nanya Technology Corporation | 2660 |
143 |
| Fuji Electric Co., Ltd. | 5253 |
125 |
| Changxin Memory Technologies, Inc. | 4928 |
125 |
| Other owners | 7580 |