- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
Patent holdings for IPC class H01L 23/24
Total number of patents in this class: 650
10-year publication summary
|
46
|
67
|
62
|
31
|
42
|
38
|
21
|
39
|
53
|
17
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 47625 |
75 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47419 |
53 |
| Fuji Electric Co., Ltd. | 5394 |
47 |
| Infineon Technologies AG | 8383 |
32 |
| Samsung Electronics Co., Ltd. | 154120 |
25 |
| Intel Corporation | 46681 |
17 |
| Micron Technology, Inc. | 27310 |
14 |
| Semiconductor Components Industries, L.L.C. | 5269 |
13 |
| Apple Inc. | 58122 |
8 |
| Siemens AG | 24199 |
8 |
| Toshiba Corporation | 12695 |
8 |
| Rohm Co., Ltd. | 6757 |
8 |
| Texas Instruments Incorporated | 19638 |
7 |
| Robert Bosch GmbH | 43631 |
7 |
| Nichia Corporation | 3836 |
7 |
| Advanced Semiconductor Engineering, Inc. | 1706 |
6 |
| STATS ChipPAC Pte. Lte. | 983 |
6 |
| Murata Manufacturing Co., Ltd. | 25552 |
5 |
| Powertech Technology Inc. | 166 |
5 |
| Shenzhen Xinguodu Technology Co., Ltd. | 2072 |
5 |
| Other owners | 294 |