- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/22 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
Patent holdings for IPC class H01L 23/22
Total number of patents in this class: 127
10-year publication summary
|
7
|
7
|
10
|
8
|
12
|
3
|
3
|
3
|
4
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42288 |
12 |
| Samsung Electronics Co., Ltd. | 144675 |
10 |
| Intel Corporation | 46833 |
8 |
| Denso Corporation | 24190 |
4 |
| Mitsubishi Electric Corporation | 45899 |
4 |
| NXP USA, Inc. | 4292 |
4 |
| Siemens AG | 24552 |
3 |
| Micron Technology, Inc. | 26221 |
3 |
| Infineon Technologies AG | 8210 |
3 |
| Fuji Electric Co., Ltd. | 5122 |
3 |
| GLOBALFOUNDRIES U.S. Inc. | 6427 |
3 |
| STATS ChipPAC Pte. Lte. | 1546 |
3 |
| Toyota Motor Corporation | 31693 |
2 |
| Panasonic Corporation | 20149 |
2 |
| Renesas Electronics Corporation | 6050 |
2 |
| Mediatek Inc. | 5069 |
2 |
| The Board of Trustees of the University of Illinois | 2685 |
2 |
| Boe Technology Group Co., Ltd. | 40728 |
2 |
| Invensas Bonding Technologies, Inc. | 143 |
2 |
| Amkor Technology Singapore Holding Pte.ltd. | 509 |
2 |
| Other owners | 51 |