- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
Patent holdings for IPC class H01L 23/14
Total number of patents in this class: 2169
10-year publication summary
|
147
|
144
|
190
|
183
|
189
|
184
|
173
|
157
|
191
|
155
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43628 |
225 |
| Intel Corporation | 47221 |
98 |
| Samsung Electronics Co., Ltd. | 147787 |
75 |
| Murata Manufacturing Co., Ltd. | 24813 |
50 |
| Kyocera Corporation | 13962 |
39 |
| Resonac Corporation | 2917 |
36 |
| Semiconductor Components Industries, L.L.C. | 5272 |
34 |
| Infineon Technologies AG | 8255 |
33 |
| Rohm Co., Ltd. | 6508 |
33 |
| Invensas Corporation | 613 |
32 |
| Applied Materials, Inc. | 18932 |
31 |
| Mitsubishi Electric Corporation | 46547 |
31 |
| Mitsubishi Materials Corporation | 2469 |
30 |
| Shinko Electric Industries Co., Ltd. | 1216 |
28 |
| Qualcomm Incorporated | 86648 |
27 |
| Texas Instruments Incorporated | 19462 |
26 |
| Fuji Electric Co., Ltd. | 5206 |
25 |
| Siliconware Precision Industries Co., Ltd. | 610 |
23 |
| Micron Technology, Inc. | 26235 |
22 |
| Advanced Semiconductor Engineering, Inc. | 1668 |
22 |
| Other owners | 1249 |