• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/8258 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using a combination of technologies covered by , , or

Patent holdings for IPC class H01L 21/8258

Total number of patents in this class: 470

10-year publication summary

70
63
72
61
44
23
28
28
24
3
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Semiconductor Energy Laboratory Co., Ltd.
11371
60
Taiwan Semiconductor Manufacturing Company, Ltd.
42222
60
Intel Corporation
46751
52
International Business Machines Corporation
61123
33
Infineon Technologies Austria AG
2137
14
Samsung Electronics Co., Ltd.
144426
13
Semiconductor Components Industries, L.L.C.
5253
12
GLOBALFOUNDRIES U.S. Inc.
6427
12
Qualcomm Incorporated
84634
10
Raytheon Company
8388
10
IMEC VZW
1610
10
Infineon Technologies Americas Corp.
688
10
MACOM Technology Solutions Holdings, Inc.
819
10
Massachusetts Institute of Technology
10019
9
Texas Instruments Incorporated
19482
8
Semiconductor Manufacturing International (Shanghai) Corporation
1774
8
United Microelectronics Corp.
4232
7
Nanyang Technological University
1982
7
Efficient Power Conversion Corporation
130
6
Tahoe Research, Ltd.
1999
5
Other owners 114