- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/70 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereofManufacture of integrated circuit devices or of specific parts thereof
Patent holdings for IPC class H01L 21/70
Total number of patents in this class: 1426
10-year publication summary
|
164
|
120
|
89
|
72
|
60
|
48
|
24
|
21
|
11
|
7
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42288 |
204 |
| Samsung Electronics Co., Ltd. | 144675 |
87 |
| GLOBALFOUNDRIES U.S. Inc. | 6427 |
72 |
| Micron Technology, Inc. | 26221 |
52 |
| International Business Machines Corporation | 61144 |
50 |
| Texas Instruments Incorporated | 19481 |
45 |
| United Microelectronics Corp. | 4239 |
41 |
| Renesas Electronics Corporation | 6050 |
35 |
| Semiconductor Components Industries, L.L.C. | 5252 |
24 |
| Intel Corporation | 46833 |
22 |
| Infineon Technologies AG | 8210 |
22 |
| SK Hynix Inc. | 11265 |
18 |
| Qualcomm Incorporated | 84760 |
17 |
| Kioxia Corporation | 10288 |
17 |
| Macronix International Co., Ltd. | 2564 |
16 |
| Boe Technology Group Co., Ltd. | 40728 |
14 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1378 |
14 |
| National Semiconductor Corporation | 1103 |
12 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1773 |
12 |
| Texas Instruments Japan, Ltd. | 1656 |
11 |
| Other owners | 641 |