- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/54 - Providing fillings in containers, e.g. gas fillings
Patent holdings for IPC class H01L 21/54
Total number of patents in this class: 140
10-year publication summary
|
21
|
36
|
19
|
10
|
6
|
14
|
11
|
4
|
7
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42288 |
17 |
| Infineon Technologies AG | 8210 |
14 |
| Mitsubishi Electric Corporation | 45899 |
6 |
| International Business Machines Corporation | 61144 |
5 |
| Micron Technology, Inc. | 26221 |
5 |
| Raytheon Company | 8389 |
5 |
| Intel Corporation | 46833 |
4 |
| InvenSense, Inc. | 1046 |
4 |
| General Electric Company | 13838 |
3 |
| Applied Materials, Inc. | 18475 |
3 |
| Invensas Corporation | 614 |
3 |
| Siliconware Precision Industries Co., Ltd. | 585 |
3 |
| Hitachi, Ltd. | 15462 |
2 |
| Texas Instruments Incorporated | 19481 |
2 |
| Samsung Electro-mechanics Co., Ltd. | 5560 |
2 |
| Advanced Semiconductor Engineering, Inc. | 1637 |
2 |
| Niko Semiconductor Co., Ltd. | 35 |
2 |
| STMicroelectronics International N.V. | 3083 |
2 |
| Super Group Semiconductor Co., Ltd. | 45 |
2 |
| Amkor Technology Singapore Holding Pte. Ltd | 408 |
2 |
| Other owners | 52 |