- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Patent holdings for IPC class H01L 21/48
Total number of patents in this class: 13740
10-year publication summary
|
1047
|
1299
|
1321
|
1280
|
1392
|
1243
|
1307
|
1241
|
1404
|
1347
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46224 |
2246 |
| Intel Corporation | 46487 |
921 |
| Samsung Electronics Co., Ltd. | 149362 |
576 |
| Texas Instruments Incorporated | 19493 |
442 |
| Advanced Semiconductor Engineering, Inc. | 1680 |
382 |
| Infineon Technologies AG | 8290 |
295 |
| Qualcomm Incorporated | 87874 |
264 |
| STATS ChipPAC Pte. Lte. | 1548 |
264 |
| International Business Machines Corporation | 61759 |
238 |
| Micron Technology, Inc. | 26638 |
212 |
| Semiconductor Components Industries, L.L.C. | 5296 |
207 |
| Amkor Technology Singapore Holding Pte. Ltd | 441 |
186 |
| Shinko Electric Industries Co., Ltd. | 1217 |
182 |
| Siliconware Precision Industries Co., Ltd. | 628 |
179 |
| NXP USA, Inc. | 4359 |
154 |
| Mitsubishi Electric Corporation | 47014 |
150 |
| Invensas Corporation | 610 |
143 |
| Rohm Co., Ltd. | 6567 |
125 |
| Fuji Electric Co., Ltd. | 5277 |
124 |
| Renesas Electronics Corporation | 5926 |
100 |
| Other owners | 6350 |