- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Patent holdings for IPC class H01L 21/48
Total number of patents in this class: 13205
10-year publication summary
1047
|
1299
|
1321
|
1280
|
1392
|
1242
|
1304
|
1236
|
1387
|
809
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 42945 |
2056 |
Intel Corporation | 47033 |
932 |
Samsung Electronics Co., Ltd. | 146811 |
544 |
Texas Instruments Incorporated | 19443 |
427 |
Advanced Semiconductor Engineering, Inc. | 1657 |
381 |
Infineon Technologies AG | 8224 |
285 |
STATS ChipPAC Pte. Lte. | 1554 |
255 |
Qualcomm Incorporated | 85833 |
244 |
International Business Machines Corporation | 61305 |
235 |
Micron Technology, Inc. | 26264 |
209 |
Semiconductor Components Industries, L.L.C. | 5255 |
197 |
Shinko Electric Industries Co., Ltd. | 1209 |
183 |
Amkor Technology Singapore Holding Pte. Ltd | 415 |
179 |
Siliconware Precision Industries Co., Ltd. | 594 |
166 |
NXP USA, Inc. | 4304 |
151 |
Mitsubishi Electric Corporation | 46197 |
148 |
Invensas Corporation | 613 |
143 |
Fuji Electric Co., Ltd. | 5160 |
119 |
Rohm Co., Ltd. | 6471 |
117 |
Renesas Electronics Corporation | 6006 |
101 |
Other owners | 6133 |