- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Patent holdings for IPC class H01L 21/301
Total number of patents in this class: 1937
10-year publication summary
80
|
116
|
84
|
132
|
167
|
126
|
123
|
126
|
124
|
124
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Lintec Corporation | 2001 |
358 |
Hamamatsu Photonics K.K. | 4462 |
157 |
Nitto Denko Corporation | 8346 |
128 |
The Furukawa Electric Co., Ltd. | 3701 |
119 |
Resonac Corporation | 2926 |
73 |
Hitachi Chemical Company, Ltd. | 2334 |
63 |
Applied Materials, Inc. | 19005 |
57 |
Tokyo Seimitsu Co., Ltd. | 375 |
57 |
Towa Corporation | 311 |
51 |
Tokyo Electron Limited | 13008 |
36 |
Mitsui Chemicals Tohcello, Inc. | 244 |
34 |
Disco Corporation | 1876 |
31 |
Yamaha Hatsudoki Kabushiki Kaisha | 2160 |
30 |
Mitsuboshi Diamond Industrial Co., Ltd. | 147 |
29 |
Showa Denko Materials Co., Ltd. | 624 |
29 |
Denki Kagaku Kogyo Kabushiki Kaisha | 624 |
26 |
Sumitomo Bakelite Co., Ltd. | 1511 |
24 |
Denka Company Limited | 2631 |
23 |
Mitsubishi Electric Corporation | 46618 |
21 |
Rohm Co., Ltd. | 6520 |
21 |
Other owners | 570 |