- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/283 - Deposition of conductive or insulating materials for electrodes
Patent holdings for IPC class H01L 21/283
Total number of patents in this class: 1079
10-year publication summary
|
189
|
110
|
86
|
69
|
33
|
26
|
18
|
23
|
32
|
11
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47211 |
145 |
| International Business Machines Corporation | 62182 |
77 |
| GLOBALFOUNDRIES U.S. Inc. | 6398 |
48 |
| Texas Instruments Incorporated | 19615 |
33 |
| Samsung Electronics Co., Ltd. | 153573 |
31 |
| Intel Corporation | 46638 |
28 |
| United Microelectronics Corp. | 4440 |
25 |
| Micron Technology, Inc. | 27266 |
21 |
| Applied Materials, Inc. | 19999 |
18 |
| Infineon Technologies Austria AG | 2291 |
18 |
| Institute of Microelectronics, Chinese Academy of Sciences | 1422 |
16 |
| Adeia Semiconductor Solutions LLC | 757 |
16 |
| Renesas Electronics Corporation | 5871 |
15 |
| Infineon Technologies AG | 8383 |
14 |
| Boe Technology Group Co., Ltd. | 42901 |
14 |
| Fuji Electric Co., Ltd. | 5383 |
13 |
| Semiconductor Energy Laboratory Co., Ltd. | 11670 |
12 |
| SK Hynix Inc. | 12134 |
12 |
| Toshiba Corporation | 12693 |
11 |
| Mitsubishi Electric Corporation | 47556 |
10 |
| Other owners | 502 |