- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/08 - Preparation of the foundation plate
Patent holdings for IPC class H01L 21/08
Total number of patents in this class: 17
10-year publication summary
|
2
|
0
|
0
|
3
|
1
|
1
|
1
|
1
|
0
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47319 |
2 |
| Samsung Electronics Co., Ltd. | 153845 |
1 |
| Seiko Epson Corporation | 20013 |
1 |
| Semiconductor Energy Laboratory Co., Ltd. | 11680 |
1 |
| Applied Materials, Inc. | 20036 |
1 |
| Huawei Technologies Co., Ltd. | 120098 |
1 |
| Henkel AG & Co. KGaA | 10715 |
1 |
| Beijing Xiaomi Mobile Software Co., Ltd. | 14194 |
1 |
| Advanced Technology Materials, Inc. | 166 |
1 |
| Alpha & Omega Semiconductor, Ltd. | 8 |
1 |
| Arizona Board of Regents Acting for and on Behalf of Arizona State University | 99 |
1 |
| MaxPower Semiconductor, Inc. | 138 |
1 |
| Societe Francaise de Detecteurs Infrarouges-sofradir | 27 |
1 |
| Universal Display Corporation | 2036 |
1 |
| SK Siltron Co., Ltd. | 167 |
1 |
| Mimos Bhd. | 974 |
1 |
| Other owners | 0 |