- All sections
- C - Chemistrymetallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatingselectroformingjoining workpieces by electrolysisapparatus therefor
- C25D 3/60 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of tin
Patent holdings for IPC class C25D 3/60
Total number of patents in this class: 189
10-year publication summary
|
18
|
19
|
19
|
19
|
13
|
11
|
5
|
8
|
5
|
5
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Materials Corporation | 2470 |
26 |
| DuPont Electronic Materials International, LLC | 429 |
15 |
| BASF SE | 21039 |
13 |
| The Boeing Company | 20139 |
7 |
| Novellus Systems, Inc. | 476 |
7 |
| Atotech Deutschland GmbH | 554 |
6 |
| Senju Metal Industry Co., Ltd. | 684 |
6 |
| Dr.-Ing. Max Schlotter GmbH & Co. KG | 32 |
4 |
| Umicore Galvanotechnik GmbH | 57 |
4 |
| JFE Steel Corporation | 6974 |
3 |
| Rohm and Haas Electronic Materials LLC | 154 |
3 |
| Sumitomo Electric Industries, Ltd. | 15659 |
2 |
| Robert Bosch GmbH | 42826 |
2 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43854 |
2 |
| Sumitomo Wiring Systems, Ltd. | 10494 |
2 |
| Lam Research Corporation | 5320 |
2 |
| Ebara Corporation | 2199 |
2 |
| AutoNetworks Technologies, Ltd. | 6688 |
2 |
| DIPSOL Chemicals Co., Ltd. | 62 |
2 |
| Ishihara Chemical Co., Ltd. | 64 |
2 |
| Other owners | 77 |