- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/55 - Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
Patent holdings for IPC class B23K 26/55
Total number of patents in this class: 103
10-year publication summary
|
6
|
15
|
11
|
6
|
12
|
10
|
7
|
11
|
2
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Corning Incorporated | 10421 |
14 |
| Carl Zeiss SMT GmbH | 3235 |
7 |
| Disco Corporation | 1934 |
7 |
| Agc, Inc. | 5337 |
7 |
| SCHOTT AG | 1735 |
6 |
| Hamamatsu Photonics K.K. | 4613 |
3 |
| Corning Laser Technologies GmbH | 8 |
3 |
| East China Normal University | 197 |
3 |
| IPG Photonics Corporation | 579 |
3 |
| Roland DG Corporation | 395 |
3 |
| 4JET Microtech GmbH | 53 |
3 |
| Chongqing Institute of East China Normal University | 49 |
3 |
| Applied Materials, Inc. | 20085 |
2 |
| BSH Hausgeräte GmbH | 5596 |
2 |
| Hirosaki University | 152 |
2 |
| ROI Optoelectronics Technology CO, LTD. | 35 |
2 |
| General Electric Company | 13808 |
1 |
| LG Chem, Ltd. | 17846 |
1 |
| Sony Corporation | 30368 |
1 |
| The Boeing Company | 20094 |
1 |
| Other owners | 29 |