- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/36 - Removing material
Patent holdings for IPC class B23K 26/36
Total number of patents in this class: 1303
10-year publication summary
|
72
|
65
|
60
|
75
|
81
|
92
|
69
|
90
|
72
|
59
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18658 |
40 |
| Seurat Technologies, Inc. | 159 |
33 |
| Disco Corporation | 1860 |
24 |
| Electro Scientific Industries, Inc. | 372 |
24 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6109 |
16 |
| Corning Incorporated | 10263 |
15 |
| Tokyo Electron Limited | 12733 |
13 |
| Alltec angewandte Laserlicht Technologie GmbH | 94 |
12 |
| General Electric Company | 13793 |
10 |
| Robert Bosch GmbH | 42684 |
10 |
| Hamamatsu Photonics K.K. | 4418 |
10 |
| The Boeing Company | 20053 |
9 |
| Samsung Display Co., Ltd. | 34798 |
8 |
| Nikon Corporation | 7170 |
8 |
| Nippon Telegraph and Telephone Corporation | 17346 |
8 |
| TOYOKOH, Co., Ltd. | 25 |
8 |
| Boe Technology Group Co., Ltd. | 41217 |
7 |
| Amada Holdings Co., Ltd. | 278 |
7 |
| IPG Photonics Corporation | 529 |
7 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
7 |
| Other owners | 1027 |