- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/36 - Removing material
Patent holdings for IPC class B23K 26/36
Total number of patents in this class: 1351
10-year publication summary
|
65
|
60
|
76
|
81
|
92
|
70
|
90
|
75
|
92
|
31
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20112 |
40 |
| Seurat Technologies, Inc. | 169 |
35 |
| Disco Corporation | 1937 |
24 |
| Electro Scientific Industries, Inc. | 359 |
24 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6110 |
17 |
| Tokyo Electron Limited | 13577 |
15 |
| Corning Incorporated | 10431 |
15 |
| Hamamatsu Photonics K.K. | 4611 |
12 |
| Alltec angewandte Laserlicht Technologie GmbH | 99 |
12 |
| Robert Bosch GmbH | 43700 |
10 |
| Nikon Corporation | 7292 |
10 |
| TOYOKOH, Co., Ltd. | 28 |
10 |
| General Electric Company | 13816 |
9 |
| Samsung Display Co., Ltd. | 37981 |
9 |
| The Boeing Company | 20094 |
9 |
| FANUC Corporation | 7068 |
9 |
| Nippon Telegraph and Telephone Corporation | 15950 |
8 |
| Samsung Electronics Co., Ltd. | 154751 |
7 |
| Amada Holdings Co., Ltd. | 268 |
7 |
| IPG Photonics Corporation | 578 |
7 |
| Other owners | 1062 |