- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
Patent holdings for IPC class B23K 26/359
Total number of patents in this class: 303
10-year publication summary
|
26
|
26
|
43
|
45
|
33
|
27
|
38
|
28
|
22
|
12
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1866 |
19 |
| Corning Incorporated | 10275 |
13 |
| View Operating Corporation | 525 |
10 |
| Samsung Electronics Co., Ltd. | 146811 |
8 |
| Siltectra GmbH | 88 |
8 |
| JENOPTIK Automatisierungstechnik GmbH | 48 |
7 |
| Nikon Corporation | 7177 |
6 |
| Trinity Industrial Corporation | 110 |
6 |
| Sumitomo Rubber Industries, Ltd. | 4653 |
5 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
5 |
| Gentex Corporation | 1891 |
4 |
| IPG Photonics Corporation | 530 |
4 |
| POSCO Co., Ltd. | 1568 |
4 |
| LG Energy Solution, Ltd. | 15119 |
4 |
| The Procter & Gamble Company | 22043 |
3 |
| Samsung Display Co., Ltd. | 34907 |
3 |
| Ricoh Company, Ltd. | 13283 |
3 |
| Hamamatsu Photonics K.K. | 4426 |
3 |
| Nichia Corporation | 3713 |
3 |
| Rogers Germany GmbH | 142 |
3 |
| Other owners | 182 |