- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/18 - Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
Patent holdings for IPC class B23K 26/18
Total number of patents in this class: 304
10-year publication summary
27
|
31
|
24
|
21
|
22
|
23
|
21
|
17
|
10
|
9
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Corning Incorporated | 10258 |
13 |
Disco Corporation | 1851 |
12 |
Electro Scientific Industries, Inc. | 374 |
7 |
Siemens AG | 24518 |
6 |
Robert Bosch GmbH | 42647 |
6 |
Hamamatsu Photonics K.K. | 4411 |
6 |
Ferro Corporation | 243 |
6 |
Panduit Corp. | 1003 |
6 |
Tokyo Electron Limited | 12681 |
5 |
Nitto Denko Corporation | 8217 |
5 |
ArcelorMittal | 2275 |
5 |
Samsung Display Co., Ltd. | 34595 |
4 |
Bayer AG | 3332 |
4 |
Applied Materials, Inc. | 18565 |
4 |
Rtx Corporation | 9352 |
4 |
Aledia | 346 |
3 |
EO Technics Co., Ltd. | 95 |
3 |
Corning Research & Development Corporation | 1172 |
3 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6112 |
3 |
Apple Inc. | 54714 |
2 |
Other owners | 197 |