- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
Patent holdings for IPC class B23K 26/06
Total number of patents in this class: 3576
10-year publication summary
219
|
228
|
282
|
338
|
300
|
347
|
336
|
313
|
262
|
182
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Disco Corporation | 1873 |
121 |
TRUMPF Laser- und Systemtechnik GmbH | 533 |
121 |
Hamamatsu Photonics K.K. | 4464 |
101 |
Samsung Display Co., Ltd. | 35374 |
81 |
Corning Incorporated | 10320 |
79 |
Panasonic Intellectual Property Management Co., Ltd. | 32052 |
63 |
Mitsubishi Electric Corporation | 46547 |
54 |
General Electric Company | 13858 |
52 |
IPG Photonics Corporation | 540 |
42 |
Applied Materials, Inc. | 18932 |
40 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6116 |
39 |
Precitec GmbH & Co. KG | 196 |
34 |
Electro Scientific Industries, Inc. | 368 |
32 |
FANUC Corporation | 6787 |
30 |
Robert Bosch GmbH | 42815 |
28 |
TRUMPF Werkzeugmaschinen GmbH + Co. KG | 542 |
28 |
Bystronic Laser AG | 270 |
27 |
Toyota Motor Corporation | 32956 |
25 |
Nikon Corporation | 7271 |
25 |
Coherent, Inc. | 317 |
25 |
Other owners | 2529 |