- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
Patent holdings for IPC class B23K 26/06
Total number of patents in this class: 3729
10-year publication summary
|
235
|
290
|
343
|
308
|
359
|
343
|
313
|
265
|
268
|
89
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1932 |
126 |
| TRUMPF Laser- und Systemtechnik GmbH | 529 |
120 |
| Hamamatsu Photonics K.K. | 4601 |
102 |
| Samsung Display Co., Ltd. | 37860 |
88 |
| Panasonic Intellectual Property Management Co., Ltd. | 33507 |
65 |
| Corning Incorporated | 10422 |
62 |
| Mitsubishi Electric Corporation | 47602 |
57 |
| General Electric Company | 13831 |
52 |
| IPG Photonics Corporation | 579 |
43 |
| Applied Materials, Inc. | 20036 |
40 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6111 |
39 |
| Precitec GmbH & Co. KG | 199 |
35 |
| Electro Scientific Industries, Inc. | 362 |
33 |
| Robert Bosch GmbH | 43587 |
30 |
| FANUC Corporation | 7034 |
30 |
| Nikon Corporation | 7304 |
29 |
| EO Technics Co., Ltd. | 111 |
28 |
| Bystronic Laser AG | 273 |
27 |
| Gigaphoton Inc. | 1304 |
27 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 531 |
27 |
| Other owners | 2669 |