- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
Patent holdings for IPC class B23K 26/06
Total number of patents in this class: 3694
10-year publication summary
|
228
|
282
|
338
|
300
|
351
|
337
|
313
|
264
|
263
|
49
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1919 |
125 |
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
120 |
| Hamamatsu Photonics K.K. | 4584 |
102 |
| Samsung Display Co., Ltd. | 37467 |
88 |
| Panasonic Intellectual Property Management Co., Ltd. | 33168 |
64 |
| Corning Incorporated | 10405 |
62 |
| Mitsubishi Electric Corporation | 47449 |
57 |
| General Electric Company | 13804 |
52 |
| IPG Photonics Corporation | 569 |
42 |
| Applied Materials, Inc. | 19849 |
40 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6111 |
39 |
| Electro Scientific Industries, Inc. | 365 |
34 |
| Precitec GmbH & Co. KG | 198 |
34 |
| Robert Bosch GmbH | 43385 |
30 |
| FANUC Corporation | 6984 |
30 |
| Nikon Corporation | 7263 |
29 |
| Bystronic Laser AG | 276 |
27 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 533 |
27 |
| EO Technics Co., Ltd. | 108 |
26 |
| Gigaphoton Inc. | 1291 |
26 |
| Other owners | 2640 |