- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
Patent holdings for IPC class B23K 26/06
Total number of patents in this class: 3703
10-year publication summary
|
235
|
290
|
343
|
308
|
358
|
330
|
298
|
257
|
266
|
126
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1957 |
126 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
118 |
| Hamamatsu Photonics K.K. | 4695 |
99 |
| Samsung Display Co., Ltd. | 38914 |
89 |
| Panasonic Intellectual Property Management Co., Ltd. | 34335 |
64 |
| Corning Incorporated | 10518 |
62 |
| Mitsubishi Electric Corporation | 48236 |
57 |
| General Electric Company | 13938 |
52 |
| IPG Photonics Corporation | 591 |
44 |
| Applied Materials, Inc. | 20514 |
39 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6110 |
39 |
| Precitec GmbH & Co. KG | 203 |
34 |
| Electro Scientific Industries, Inc. | 345 |
33 |
| Nikon Corporation | 7229 |
31 |
| Robert Bosch GmbH | 44252 |
30 |
| FANUC Corporation | 7314 |
29 |
| EO Technics Co., Ltd. | 116 |
28 |
| Bystronic Laser AG | 278 |
27 |
| Gigaphoton Inc. | 1329 |
27 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 517 |
27 |
| Other owners | 2648 |