Shinko Electric Industries Co., Ltd.

Japon


 
Quantité totale PI 1 207
Rang # Quantité totale PI 1 115
Note d'activité PI 3,4/5.0    473
Rang # Activité PI 1 520
Symbole boursier
ISIN JP3375800004
Capitalisation 642742584210.0  (JPY)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

1 187 15
1 0
4 0
0
 
Dernier brevet 2025 - Interconnect substrate and metho...
Premier brevet 1979 - Method of making a take-carrier ...
Dernière marque 2013 - I-THOP
Première marque 1984 - SD

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Semiconductor device. A semiconductor device includes a wiring substrate, a semiconductor elemen...
Invention Interconnect substrate and method of making the same. An interconnect substrate includes a first...
Invention Optical waveguide device and substrate with optical waveguides. An optical waveguide device incl...
Invention Semiconductor device. A semiconductor device includes a semiconductor element, a first organic s...
Invention Wiring board and semiconductor device. A wiring board has a first interconnect structure includi...
Invention Optical waveguide device. An optical waveguide device has a first optical waveguide, a second op...
Invention Interconnect substrate. An interconnect substrate includes n insulating layers (n≥2), two opposi...
Invention Ceramic substrate, electrostatic chuck and substrate fixing device. A ceramic substrate includes...
Invention Adhesive sheet and heat dissipation member. This adhesive sheet has a pair of adhesive layers and...
Invention Electrostatic chuck and substrate fixing device. An electrostatic chuck includes a base body hav...
Invention Electronic component-incorporating substrate. An electronic component-incorporating substrate in...
Invention Optical waveguide device. An optical waveguide device includes a substrate and an optical wavegu...
Invention Optical waveguide device and optical waveguide-mounted substrate. An optical waveguide device in...
Invention Wiring board. A wiring board includes a layered structure and a waveguide. The layered structure...
Invention Lead frame and semiconductor device. A lead frame has inner leads arranged in a first direction,...
Invention Substrate fixing device. A substrate fixing device includes a ceramic base plate, a ceramic elec...
Invention Wiring board and semiconductor device. A wiring board includes a first interconnect structure in...
Invention Wiring board, semiconductor device, and method of manufacturing wiring board. A wiring board inc...
Invention Interconnect substrate and method of making interconnect substrate. An interconnect substrate in...
Invention Optical waveguide device. An optical waveguide device includes a substrate, a first waveguide di...
Invention Semiconductor device. A semiconductor device includes a first substrate, a second substrate spac...
Invention Wiring board. A wiring board includes a first insulating layer, a first interconnect layer forme...
Invention Semiconductor device. A semiconductor device includes a wiring substrate and a semiconductor ele...
Invention Wiring substrate and semiconductor device. A wiring substrate includes an insulating layer and a...
Invention Wiring board and laminated wiring board. A wiring board includes a first wiring structure and a ...
Invention Stacked wiring substrate and semiconductor device. A stacked wiring substrate includes a first w...
Invention Heat storage device, power generator, and heat generator. A heat storage device includes a ceram...
Invention Semiconductor apparatus. A semiconductor apparatus includes three or more semiconductor devices ...
Invention Wiring board and semiconductor device. A wiring board includes an insulating layer and a connect...
Invention Wiring substrate. A wiring substrate includes a first wiring layer, a first insulating layer, an...
Invention Lead frame, semiconductor device, and lead frame manufacturing method. A lead frame includes a l...
Invention Wiring substrate and semiconductor device. A wiring substrate includes a first wiring layer, a f...
Invention Latent heat storage unit. A latent heat storage unit includes a ceramic part made of a polycryst...
Invention Substrate fixing device. A substrate fixing device includes a base plate, an adhesive layer prov...
Invention Electrostatic chuck and substrate fixing device. An electrostatic chuck includes a first base bo...
Invention Optical module. An optical module includes a first cladding layer formed on a substrate, a first...
Invention Wiring substrate, electronic device, and method of manufacturing the wiring substrate. A wiring ...
Invention Wiring board. A wiring board includes a first insulating layer provided on an interconnect layer...
Invention Ceramic substrate, method of manufacturing the same, electrostatic chuck, substrate fixing device...
Invention Leadframe and semiconductor device. A leadframe includes a die pad having a surface that include...
Invention Terminal structure and wiring substrate. A terminal structure includes a first wiring layer, an ...
Invention Optical waveguide device. An optical waveguide device includes a first cladding layer, a core la...
Invention Wiring board, semiconductor device, and wiring board manufacturing method. A wiring board includ...
Invention Optical waveguide device. An optical waveguide device includes an interconnect substrate, a firs...
Invention Optical waveguide device. An optical waveguide device includes an optical waveguide substrate, a...
2023 Invention Semiconductor device. A semiconductor device includes a semiconductor element provided on a wiri...
2013 P/S multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-...
2007 P/S Circuit boards; Packages for integrated circuits; Circuit board with electronic device embedded; ...
P/S Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit
2004 P/S Computer program for the purpose of determining exposing conditions, and determining the pattern ...
P/S Computer program for the purpose of determining exposing conditions, pattern data of mask less ex...
2000 P/S Lead frames for semiconductor devices
1997 P/S Compact discs pre-recorded computer programs for data conversion and/or verification of IC layout...
1992 P/S [ lamps for electronic equipment ] components for semiconductor and electronic devices; namely, c...
P/S components for semiconductor and electronic devices; namely, caps [ lamps for liquid crystal disp...
P/S components for the manufacture of semiconductors and electronic devices;, namely, glass to metal ...
P/S components for the manufacture of semiconductors and electronic devices; namely, glass to metal s...
1985 P/S ELECTRICAL AND ELECTRONIC MACHINERY, APPARATUS AND MATERIALS, NAMELY, HERMETIC SEAL HEADERS, CAPS...