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2025
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Invention
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Apparatus and method for implementing a scalable digital infrastructure for measuring ring oscill... |
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Invention
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Die to wafer bonding method and apparatus with thermal contactless die shape control. Aspects of ... |
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Invention
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Die to wafer bonding method and apparatus with thermal contact die shape control. Aspects of the ... |
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Invention
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Eccentricity based wafer shape control. Aspects of the present disclosure provide an apparatus fo... |
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Invention
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Multipatterning with crosslinkable overcoat. An example method of processing a substrate includes... |
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Invention
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Using laser based system for mean of shaping of unsingulated & singulated dies by substrate latti... |
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Invention
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Apparatus and method for detecting and monitoring objects in a fluid bath and adjusting the fluid... |
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Invention
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Photoresist patterning using planar trim layer. A method includes forming a photoresist layer ove... |
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Invention
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High-performance adaptable sampling system. According to an embodiment, a plasma processing syste... |
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Invention
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X-ray methods and systems for semiconductor substrate alignment. X-rays are directed to a first s... |
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Invention
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Method for patterning mask layer using metal-containing resist. 44, HBr, or hydrogen. |
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Invention
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Method for patterning for chemical mechanical polishing (cmp) iso-dense bias compensation using z... |
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Invention
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Autocatalytic acid amplification for photoselective acid diffusion. An embodiment method of proce... |
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Invention
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Method for removing metal-containing materials in small pitch structures. Undesired metal-contain... |
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Invention
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Method and wafer processing system for wet etching a semiconductor wafer. A method and wafer proc... |
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Invention
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Etching bi-metal oxides with alkaline earth metals. An example method for etching a barium contai... |
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Invention
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Gap filling by atomic layer deposition (ald). A method of manufacturing a semiconductor device is... |
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Invention
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Metallization and planarization. A method of defect detection includes providing a wafer includin... |
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Invention
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Hard mask protection of metal interconnects. A method for protecting metal interconnects includes... |
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Invention
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Methods for wet atomic layer etching of tungsten. Various embodiments of methods are provided for... |
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Invention
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Selective in-situ carbon-based mask protection. A method of etching an underlying layer includes ... |
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Invention
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Method for protecting graphene layer during metal etching. A method for making a semiconductor de... |
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Invention
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Method of hybrid bonding using die distribution model. A method of hybrid bonding includes access... |
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Invention
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Ceramic heater assembly with internal and external heating functionality useful in the fabricatio... |
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Invention
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Wet processing systems having novel wafer chuck designs for retaining a processing liquid on a su... |
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Invention
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Methods and compositions for trench formation using advanced track-based patterning processes. A ... |
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Invention
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Method for semiconductor manufacturing. A method of processing a substrate includes forming a rec... |
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Invention
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Methods for wet atomic layer etching of silicon dioxide. i2i22 layer and form a silicate passivat... |
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Invention
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Controlling etch edge effects. A method for controlling an etch edge effect in a partial plasma e... |
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Invention
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System and method of pulse scoring. A method of pulse scoring is provided. The method includes ex... |
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Invention
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System and method for adjusting etch selectivity of etchant solution. An apparatus includes a fir... |
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Invention
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Die shape control for die to wafer bond enhancement. Aspects of the present disclosure provide a ... |
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Invention
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Vertical feature growth using fluorine-containing gas. A method of vertically growing a material,... |
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Invention
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In situ removable blocking layer formation. A method of etching a target material of a substrate ... |
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Invention
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Radio frequency sensor calibration by virtual metrology. A method of chamber matching is provided... |
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Invention
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Bottom-up directional atomic layer deposition (ald). A method of film deposition is provided. The... |
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Invention
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3) solution. 332333 etch solution onto the silicon surface. |
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Invention
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Selective etching of silicon adjacent to silicon-germanium. A process for forming at least portio... |
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Invention
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Method for semiconductor processing. A method of processing a substrate includes forming a recess... |
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Invention
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Bonding energy measurement. A method of determining a bonding energy of a bonded wafer includes r... |
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Invention
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Plasma etch-deposition processes and systems. A method of processing a substrate in a plasma proc... |
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Invention
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Cyclic etch/deposition plasma processes using tungsten based precursor gas. A method of plasma et... |
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Invention
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Etch stop layer in all-in-one harc etch. A method of forming a device includes receiving, in a pr... |
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2024
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Invention
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Protection structure for liner removal. A method of etching a liner formed between a patterned la... |
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Invention
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Direct current superposition (dcs) for protection of organic mandrel during spacer deposition. Me... |
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Invention
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In-situ metal deposition for reduced charging during dielectric etch. A method of etching a diele... |
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Invention
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Harc etch chemistry for seminconductors. 4333. Therefore, increased selectivity between the mask ... |
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Invention
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Plasma potential adjustment circuit. A method of adjusting sheath potential of a plasma at a subs... |
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Invention
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Resonant phase-controlled oscillator. A resonant oscillator circuit includes an amplifier that in... |
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Invention
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Plasma adjustment using source-less resonant structure. A plasma processing apparatus includes a ... |
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2019
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P/S
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Semiconductor manufacturing support services, namely, repair
or maintenance of semiconductor man... |
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P/S
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Semiconductor manufacturing support services, namely, technical support services in the nature of... |
