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Nouveaux brevets et marques déposées la semaine dernière

Dernière mise à jour : 2026-10-10

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# ID Juridiction Title
1 19682723 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
2 19169621 WAVE-ASSISTED HYBRID PLASMA SOURCE
3 19577935 HEAT TREATMENT APPARATUS
4 19577059 Substrate Processing System and Substrate Transfer Method
5 19709645 APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF TRANSFERRING SUBSTRATE
6 19484092 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
7 19711331 APPARATUS AND METHOD FOR REPAIRING DEFECT OF SEMICONDUCTOR
8 19170728 STRIKER FOR WAFER BONDING
9 19170755 METHOD FOR STITCHING LINES
10 19480410 BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
11 19712720 SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD
12 19681376 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM
13 19172337 SYNCHRONIZED MULTI-ARM ROBOT
14 JP2026013168 COMMUNICATION METHOD, COMMUNICATION SYSTEM, AND COMMUNICATION DEVICE
15 US2026016226 WAVE-ASSISTED HYBRID PLASMA SOURCE
16 JP2026010602 PLASMA PROCESSING DEVICE
17 JP2026011077 ETCHING METHOD AND PLASMA TREATMENT DEVICE
18 JP2026011675 SUBSTRATE PROCESSING SYSTEM
19 US2025053450 METHODS AND SYSTEMS FOR PLASMA ETCHING PROCESS
20 JP2026010717 FILM-FORMING APPARATUS, AND METHOD FOR CLEANING FILM-FORMING APPARATUS
21 19714634 MEASURING DEVICE, MEASURING METHOD, AND VACUUM PROCESSING APPARATUS
22 19457716 ETCHING METHOD AND PLASMA PROCESSING APPARATUS
23 19465586 METHOD FOR CONTROLLING DUMMY GATE PROFILE
24 19710439 PLASMA PROCESSING APPARATUS, POWER SOURCE SYSTEM, AND PLASMA PROCESSING METHOD
25 19172450 PULSE WINDOWING OPTICAL SENSOR
26 19171818 METHODS AND SYSTEMS FOR AREA SELECTIVE PROCESSING
27 19171866 METHOD FOR FORMING PATTERNED MASK ON SUBSTRATE
28 19712744 PREDICTION DEVICE AND ETCHING CONTROL SYSTEM
29 JP2026011542 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
30 US2026010219 APPARATUS AND METHOD FOR WAFER BONDING
31 JP2026011640 INSPECTION DEVICE, JOINING DEVICE, INSPECTION METHOD, AND JOINING METHOD
32 US2026010222 STRIKER FOR WAFER BONDING
33 JP2026011832 WASTE LIQUID TREATMENT SYSTEM, WASTE LIQUID TREATMENT METHOD, AND STORAGE MEDIUM
34 JP2026011249 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
35 JP2026010597 PROCESSING METHOD AND PROCESSING DEVICE
36 JP2026010599 PROCESSING METHOD AND PROCESSING DEVICE
37 GD1151520 Cover ring