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Nouveaux brevets et marques déposées la semaine dernière

Dernière mise à jour : 2026-04-04

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brevets

# ID Juridiction Title
1 19413022 VALVE DEVICE AND LEAK DETECTION METHOD
2 18902673 STEP RAMP GRADING YIELD ENHANCEMENT FOR HYBRID BONDING
3 18903802 METHOD FOR PATTERNING SUBSTRATE USING METAL OXIDE RESIST
4 18899263 LOW-TEMPERATURE ETCHING OF CARBON-CONTAINING LAYERS
5 19042196 METHODS FOR WET ATOMIC LAYER ETCHING OF TITANIUM NITRIDE USING HALOGENATION
6 19371540 PROBER, METHOD FOR CONTROLLING PROBER, INSPECTION SYSTEM, AND METHOD FOR CONTROLLING INSPECTION SYSTEM
7 JP2025032040 PLASMA PROCESSING DEVICE
8 US2025033326 METHOD FOR PROCESSING SUBSTRATE
9 US2025043177 IN-SITU WAFER MONITORING WITH DYNAMIC BACKSIDE GAS FEEDBACK CONTROL AS WAFER BOW COUNTERMEASURE
10 JP2025033996 METHOD FOR FORMING THERMAL SPRAYING FILM AND METHOD FOR PRODUCING THERMAL SPRAYING MATERIAL
11 JP2025032466 SCREW HOLDING DEVICE AND SCREW FASTENING DEVICE
12 JP2025032468 PLASMA PROCESSING DEVICE AND PLASMA CONTROL METHOD
13 JP2025033334 COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE
14 JP2025032887 INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND COMPUTER PROGRAM
15 JP2025032886 COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, LEARNING DATA GENERATION METHOD, LEARNING MODEL GENERATION METHOD, AND INFORMATION PROCESSING DEVICE
16 JP2025032392 SUBSTRATE PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND COMPUTER PROGRAM
17 US2025033448 LOW-TEMPERATURE ETCHING OF CARBON-CONTAINING LAYERS
18 JP2025032791 SUBSTRATE PROCESSING SYSTEM AND CONVEYANCE METHOD
19 JP2025032590 PLASMA PROCESSING DEVICE AND ETCHING METHOD
20 18903784 METHODS FOR FORMING LOW-RESISTIVITY INTERCONNECT STRUCTURES COMPRISING RUTHENIUM
21 19414325 SYSTEM OF PROCESSING SUBSTRATE, TRANSFER METHOD, TRANSFER PROGRAM, AND HOLDER
22 19333444 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
23 19413273 FILM FORMING METHOD
24 19333364 INFORMATION PROCESSING METHOD, COMPUTER PROGRAM, AND INFORMATION PROCESSING APPARATUS
25 18900130 METHOD FOR PROCESSING SUBSTRATE
26 18904348 MASK MODIFICATION METHOD
27 19331966 Plasma Processing Apparatus
28 19412929 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
29 JP2025032269 SUBSTRATE PROCESSING SYSTEM
30 JP2025033064 TEMPERATURE CONTROL METHOD AND INSPECTION SYSTEM
31 JP2025032437 SUBSTRATE PROCESSING APPARATUS
32 US2025033167 PATTERNING SEMICONDUCTOR MATERIALS USING SURFACE MODIFICATION TECHNIQUES
33 JP2025032579 ETCHING METHOD AND PLASMA PROCESSING DEVICE
34 JP2025032464 INFORMATION PROCESSING METHOD, EXPERIMENT METHOD, AND COMPUTER PROGRAM
35 JP2025032474 COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, AND INFORMATION PROCESSING DEVICE
36 US2025040626 METHODS FOR DETERMINING A TEMPERATURE ACHIEVED BY A HEATING PROCESS
37 US2025032911 METHODS FOR WET ATOMIC LAYER ETCHING OF TUNGSTEN USING HALOGENATION
38 US2025033702 STEP RAMP GRADING YIELD ENHANCEMENT FOR HYBRID BONDING
39 JP2025032759 SUBSTRATE CONVEYANCE MODULE AND METHOD FOR OPERATING SUBSTRATE CONVEYANCE MODULE
40 JP2025032880 COMPUTER PROGRAM, INFORMATION PROCESSING METHOD, LEARNING MODEL GENERATION METHOD, AND INFORMATION PROCESSING DEVICE
41 JP2025032773 SUBSTRATE PROCESSING DEVICE
42 JP2025032917 INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, AND COMPUTER PROGRAM