Taiwan Semiconductor Manufacturing Company, Ltd.
Taïwan, Province de Chine
Nouveaux brevets et marques déposées la semaine dernière
Dernière mise à jour : 2026-10-10
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Viewing 1 - 100 of 299
marques
brevets
| # | ID | Juridiction | Title |
|---|---|---|---|
| 1 | 19715968 |
|
VOLTAGE REGULATORS WITH SHARED DECOUPLING CAPACITOR FOR MEMORY DEVICES |
| 2 | 19709057 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 3 | 19712450 |
|
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF |
| 4 | 19711343 |
|
Methods of Forming Packages and Resulting Structures |
| 5 | 19712439 |
|
INTEGRATED CIRCUIT DEVICE |
| 6 | 19703957 |
|
WORK-FUNCTION METAL IN TRANSISTORS AND METHOD FORMING SAME |
| 7 | 19711333 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 8 | 19712428 |
|
INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME |
| 9 | 19693875 |
|
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME |
| 10 | 19714413 |
|
NOVEL PCM DEVICE |
| 11 | 19714419 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 12 | 19713328 |
|
SEGMENTED REFERENCE FOR TRACKING COLUMN LOADING |
| 13 | 19711391 |
|
NOVEL DESIGN OF AN INSPECTION TOOL FOR AN EXTREME ULTRAVIOLET RADIATION SOURCE TO OBSERVE TIN RESIDUAL |
| 14 | 19712240 |
|
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES |
| 15 | 19712481 |
|
AIR LINER FOR THROUGH SUBSTRATE VIA |
| 16 | 19714422 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 17 | 19712002 |
|
PICK-AND-PLACE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE |
| 18 | 19714406 |
|
SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT |
| 19 | 19705523 |
|
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE |
| 20 | 19714003 |
|
INTEGRATED PHOTODETECTOR WITH EMBEDDED SEMICONDUCTOR REGION |
| 21 | 19713130 |
|
PULL-UP-PULL-DOWN-INVERTER (PUDI), PUDI-BASED SYSTEM FOR CONTINUOUS-TIME LINEAR-EQUALIZATION, AND METHOD OF OPERATING SAME |
| 22 | 19713377 |
|
SEMICONDUCTOR DEVICE INCLUDING BUMP STRUCTURE |
| 23 | 19658896 |
|
PHOTONIC PACKAGE |
| 24 | 19710090 |
|
LITHOGRAPHY SYSTEM AND METHODS |
| 25 | 19712031 |
|
DYNAMIC OFFSET CALIBRATION CIRCUIT AND METHOD FOR OPERATING THE SAME |
| 26 | 19712030 |
|
SEMICONDUCTOR STRUCTURE |
| 27 | 19712035 |
|
LARGE DIMENSION METAL GATE FIELD-EFFECT TRANSISTOR (FET) WITH METAL GATE DUMMY STRUCTURES |
| 28 | 19706653 |
|
MULTI-FUNCTION ETCHING SACRIFICIAL LAYERS TO PROTECT THREE-DIMENSIONAL DUMMY FINS IN SEMICONDUCTOR DEVICES |
| 29 | 19097895 |
|
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 30 | 19171701 |
|
CURVILINEAR LITHOGRAPHY MASKS AND GEOMETRY-BASED MASK CHECK RULES FOR CURVILINEAR LITHOGRAPHY MASKS |
| 31 | 19097898 |
|
TRANSMITTER, INTEGRATED CIRCUIT AND METHOD FOR CALIBRATING OUTPUT IMPEDANCE |
| 32 | 19716464 |
|
EMBEDDED LENS STRUCTURES AND THE METHODS OF FORMING THE SAME |
| 33 | 19708600 |
|
COMPUTATION IN MEMORY FOR ANNEAL PROCESSING USING BITWISE CAPACITIVE COUPLING |
| 34 | 19714270 |
|
DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF |
| 35 | 19714021 |
|
DOPING PROFILE FOR STRAINED SOURCE/DRAIN REGION |
| 36 | 19714013 |
|
SYSTEM AND METHOD FOR DETECTING SEMICONDUCTOR PROCESSING ERROR |
| 37 | 19169652 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 38 | 19169642 |
|
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION |
| 39 | 19713099 |
|
SEMICONDUCTOR STRUCTURE INCLUDING BOTTOM ISOLATION AND METHOD FOR MANUFACTURING THE SAME |
| 40 | 19711964 |
|
SEMICONDUCTOR IMAGE-SENSING STRUCTURE |
| 41 | 19710860 |
|
CAP FOR GATE STACK OF MULTIGATE DEVICE |
| 42 | 19707471 |
|
CO-OPTIMIZATION OF FINFET DEVICES BY SOURCE/DRAIN MODULATION AND STRUCTURES THEREOF |
| 43 | 19710866 |
|
MEMORY DEVICE |
| 44 | 19711955 |
|
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME |
| 45 | 19711957 |
|
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 46 | 19715086 |
|
SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES |
| 47 | 19707445 |
|
TERNARY CONTENT-ADDRESSABLE MEMORY CELLS AND METHODS FOR FORMING THE SAME |
| 48 | 19169678 |
|
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION |
| 49 | 19711937 |
|
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE |
| 50 | 19710432 |
|
SYSTEM FOR DETECTING FLUID IN CONTAINER FOR RECEIVING SEMICONDUCTOR DEVICE |
| 51 | 19711763 |
|
METHOD OF FORMING SEMICONDUCTOR DEVICE |
| 52 | 19710437 |
|
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE |
| 53 | 19708114 |
|
CARRIER STRUCTURE FOR ETCH-BACK SILICON-ON-INSULATOR PROCESS |
| 54 | 19711510 |
|
REMOVABLE TRAY ASSEMBLY FOR CMP SYSTEMS |
| 55 | 19711509 |
|
EMBEDDED SEMICONDUCTOR REGION FOR LATCH-UP SUSCEPTIBILITY IMPROVEMENT |
| 56 | 19713929 |
|
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE |
| 57 | 19265884 |
|
INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATION |
| 58 | 19713985 |
|
EXTENDED VIA CONNECT FOR PIXEL ARRAY |
| 59 | 19709481 |
|
MAGNETIC TUNNEL JUNCTIONS AND METHODS OF FORMING THE SAME |
| 60 | 19713747 |
|
REPLACEMENT SIDEWALL SPACERS |
| 61 | 19711569 |
|
MEMORY DEVICE |
| 62 | 19709249 |
|
SEMICONDUCTOR STRUCTURE INCLUDING CAP LAYER OF TWO-DIMENSIONAL MATERIAL AND METHOD FOR MANUFACTURING THE SAME |
| 63 | 19711310 |
|
INTEGRATED CIRCUIT AND METHOD OF OPERATING SAME |
| 64 | 19713734 |
|
EPITAXIAL STRUCTURES GROWN ON MATERIAL WITH A CRYSTALLOGRAPHIC ORIENTATION OF {110} |
| 65 | 19710453 |
|
SEMICONDUCTOR STRUCTURE |
| 66 | 19713964 |
|
FORMING ISOLATION REGIONS WITH LOW PARASITIC CAPACITANCE AND REDUCED DAMAGE |
| 67 | 19711549 |
|
ROBOT BLADE FOR WAFERS AND WORKPIECES & THIN WAFERS AND WORKPIECES |
| 68 | 19714816 |
|
FLOATING DATA LINE CIRCUIT AND METHOD |
| 69 | 19460055 |
|
Wafer Transportation |
| 70 | 19711792 |
|
METHOD FOR NEURAL NETWORK WITH WEIGHT QUANTIZATION |
| 71 | 19709232 |
|
OHMIC ELECTRODE FOR TWO-DIMENSIONAL CARRIER GAS (2DCG) SEMICONDUCTOR DEVICE |
| 72 | 19713956 |
|
DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF FORMING THE SAME |
| 73 | 19710447 |
|
CURVED SEMICONDUCTOR CHIP AND METHOD FOR FORMING THE SAME |
| 74 | 19713713 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 75 | 19711539 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 76 | 19290790 |
|
NANOIMPRINT LITHOGRAPHY MOLD AND NANOIMPRINT LITHOGRAPHY USING SAME |
| 77 | 19708073 |
|
Selective Deposition of Barrier Layer |
| 78 | 19709160 |
|
IMAGE SENSOR DEVICE AND METHOD |
| 79 | 19241391 |
|
EXTREME ULTRAVIOLET LITHOGRAPHY SYSTEM |
| 80 | 19714750 |
|
DELAY CHAIN AND METHOD OF OPERATING SAME |
| 81 | 19712315 |
|
FORMING MULTIPLE TSVS WITH DIFFERENT FORMATION SCHEMES |
| 82 | 19713890 |
|
IMAGE SENSING DEVICE AND METHODS OF MANUFACTURING THE SAME |
| 83 | 19713650 |
|
STACKED MULTI-GATE DEVICE WITH DIFFUSION STOPPING LAYER |
| 84 | 19713892 |
|
SEMICONDUCTOR PACKAGE AND METHOD |
| 85 | 19714722 |
|
METHOD OF USING SEMICONDUCTOR DEVICE AND METHOD OF MAKING |
| 86 | 19712300 |
|
VIA STRUCTURE AND METHOD FOR FORMING THE SAME |
| 87 | 19461477 |
|
SEMICONDUCTOR CLEANING APPARATUS AND METHOD |
| 88 | 19712788 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 89 | 19710371 |
|
SEMICONDUCTOR PACKAGE |
| 90 | 19713468 |
|
SEMICONDUCTOR DEVICE AND METHOD |
| 91 | 19713225 |
|
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME |
| 92 | 19711291 |
|
INTEGRATED CHIPS PACKAGE STRUCTURE WITH CAPACITOR |
| 93 | 19276296 |
|
SEMICONDUCTOR DEVICE AND METHOD OF MAKING |
| 94 | 19703888 |
|
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME |
| 95 | 19713032 |
|
INTERCONNECT STRUCTURE AND METHOD OF FORMING SAME |
| 96 | 19713278 |
|
CONTROLLED DOPING IN A GATE DIELECTRIC LAYER |
| 97 | 19715427 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 98 | 19713249 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 99 | 19283873 |
|
MEMORY SHIFTING CIRCUIT |
| 100 | 19706709 |
|
LITHOGRAPHY FOCUS CONTROL METHOD |



