Taiwan Semiconductor Manufacturing Company, Ltd.
Taïwan, Province de Chine
Nouveaux brevets et marques déposées la semaine dernière
Dernière mise à jour : 2026-03-28
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Commandez votre montre hebdomadaire Taiwan Semiconductor Manufacturing Company, Ltd.
1
Viewing 1 - 80 of 80
marques
brevets
| # | ID | Juridiction | Title |
|---|---|---|---|
| 1 | 18895825 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 2 | 19406952 |
|
MAGNETIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF |
| 3 | 19080163 |
|
MULTI-GATE DEVICE STRUCTURE AND METHODS THEREOF |
| 4 | 18891624 |
|
SEMICONDUCTOR STRUCTURES WITH ROUTING PATH IN DUMMY REGION |
| 5 | 18893808 |
|
SEMICONDUCTOR DEVICE AND FORMING METHOD OF THE SAME |
| 6 | 18890798 |
|
CAPACITOR STRUCTURE, IMAGE SENSOR STRUCTURE, AND METHOD FOR FORMING IMAGE SENSOR STRUCTURE |
| 7 | 19410170 |
|
DUMMY THROUGH VIAS FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME |
| 8 | 18896491 |
|
SEMICONDUCTOR DEVICE HAVING HIGH DENSITY AND HIGH PERFORMANCE |
| 9 | 19348055 |
|
PHOTONIC AND ELECTRONIC INTEGRATED CIRCUITS AND METHODS |
| 10 | 19409648 |
|
CRACK DETECTOR UNITS AND THE RELATED SEMICONDUCTOR DIES AND METHODS |
| 11 | 18898617 |
|
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME |
| 12 | 19032877 |
|
STACKED TRANSISTORS HAVING SOURCE/DRAIN CONTACTS AND GATE STRUCTURES WITH LEVEL TOP SURFACES |
| 13 | 19408389 |
|
SEMICONDUCTOR DEVICE |
| 14 | 19404368 |
|
GAP FILLING METHOD IN SEMICONDUCTOR MANUFACTURING PROCESS |
| 15 | 19409831 |
|
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE |
| 16 | 19407213 |
|
METHODS TO IMPROVE MECHANICAL PROPERTIES OF PELLICLE MEMBRANE |
| 17 | 19029820 |
|
SEMICONDUCTOR DEVICE WITH COMPLEMENTARY FIELD-EFFECT TRANSISTORS AND NANOSTRUCTURE FIELD-EFFECT TRANSISTORS AND METHODS OF FORMING |
| 18 | 18893799 |
|
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF |
| 19 | 18892212 |
|
INNER DIE HAVING ESD PROTECTION DEVICE IN 3D PACKAGING |
| 20 | 18891129 |
|
CLEANING APPARATUS AND METHOD FOR CLEANING ITEMS USED IN SEMICONDUCTOR FABRICATION |
| 21 | 19405558 |
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME |
| 22 | 19405302 |
|
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 23 | 18891770 |
|
ISOLATION INTERFACES AT THE ENDS OF FIN ISOLATION REGIONS |
| 24 | 19178211 |
|
STACKED SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME |
| 25 | 19404836 |
|
Semiconductor Package and Method of Manufacture |
| 26 | 18896187 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 27 | 19404616 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 28 | 19399659 |
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME |
| 29 | 19405179 |
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
| 30 | 19409322 |
|
Selective Formation Of Titanium Silicide And Titanium Nitride Byhydrogen Gas Control |
| 31 | 19408459 |
|
MEMORY DEVICE |
| 32 | 18896552 |
|
SEMICONDUCTOR DEVICE HAVING A HIGH BREAKDOWN VOLTAGE AND A LOW ON RESISTANCE, AND METHOD FOR MANUFACTURING THE SAME |
| 33 | 18897436 |
|
DEVICES AND METHODS FOR DEPOSITION |
| 34 | 18927013 |
|
METHOD AND PROCESSING DEVICE FOR NUMERICAL DATA QUANTIZATION OR NUMERICAL DATA DE-QUANTIZATION |
| 35 | 18893083 |
|
MULTI-DIE CMOS IMAGE SENSOR INTEGRATED CIRCUIT DEVICE WITH REDUCED CAPACITANCE FLOATING DIFFUSION NODE STRUCTURE |
| 36 | 18894342 |
|
TEST SYSTEM WITH IMPROVED CONTACT BLADE DESIGN AND METHODS OF USING THE SAME |
| 37 | 19033005 |
|
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION |
| 38 | 19404028 |
|
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE |
| 39 | 19403190 |
|
ROBOT GRIPPER FOR MOVING WAFER CARRIERS AND PACKING MATERIALS AND METHOD OF OPERATING THE SAME |
| 40 | 18893477 |
|
SOIC NOVEL STRUCTURE FOR INNER DIE EDGE PROTECTION LAYER |
| 41 | 18894569 |
|
LOCAL SILICON INTERPOSER DIE WITH METALLIC VIAS, HAVING A BARRIER STRUCTURE AND METHODS OF FORMING THE SAME |
| 42 | 19406946 |
|
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 43 | 19377045 |
|
SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME |
| 44 | 19406981 |
|
METHOD FOR FORMING OPTICAL WAVEGUIDE STRUCTURE |
| 45 | 19405650 |
|
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION |
| 46 | 19059556 |
|
SYSTEMS AND METHODS FOR CONVERSON BETWEEN DIGITAL AND ANALOG FOR PHOTONIC NEURAL NETWORKS |
| 47 | 19025339 |
|
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICES AND METHODS OF FORMING |
| 48 | 19404583 |
|
Gate Dielectric Having A Non-Uniform Thickness Profile |
| 49 | 19407608 |
|
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE |
| 50 | 19013176 |
|
IMAGE SENSOR AND METHOD OF MANFUACTURING THE SAME |
| 51 | 19401452 |
|
THERMAL DISPERSION LAYER IN PROGRAMMABLE METALLIZATION CELL |
| 52 | 19006661 |
|
DESIGN FLOW OF INTEGRATED CIRCUIT (IC) WITH THERMAL SENSING RESISTOR |
| 53 | 18890763 |
|
SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR DIE |
| 54 | 19405299 |
|
Multigate Device Having Reduced Contact Resistivity |
| 55 | 19398458 |
|
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME |
| 56 | 19033773 |
|
SEMICONDUCTOR DEVICE AND METHOD OF COMMUNICATION BY SEMICONDUCTOR DEVICE |
| 57 | 18894028 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 58 | 18894494 |
|
SYSTEMS AND METHODS FOR MULTI-PUMPING MEMORY WITH FLIP-FLOP INTERFACE |
| 59 | 19011985 |
|
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION |
| 60 | 18894007 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 61 | 18897932 |
|
VOLTAGE COMPARATOR CIRCUIT WITH OFFSET CORRECTION |
| 62 | 18893336 |
|
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION |
| 63 | 19405289 |
|
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 64 | 19047976 |
|
INTEGRATED CIRCUIT PACKAGE AND METHOD |
| 65 | 18891311 |
|
SEMICONDUCTOR DEVICE GATE STRUCTURE AND RELATED METHODS |
| 66 | 19033028 |
|
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION |
| 67 | 19036561 |
|
METHODS OF MANUFACTURING A NANOIMPRINT LITHOGRAPHY REPLICA MOLD, A NANOIMPRINT LITHOGRAPHY REPLICA, AND A SEMICONDUCTOR DEVICE |
| 68 | 18892861 |
|
MEMORY DEVICES WITH DIFFERENT CONDUCTIVE TYPES AND METHODS FOR MANUFACTURING THE SAME |
| 69 | 19238101 |
|
EPITAXIAL FEATURES OF SEMICONDUCTOR DEVICES |
| 70 | 18898158 |
|
SEMICONDUCTOR STRUCTURE INCLUDING BONDING PART WITH HEAT-DISSIPATING UNIT AND METHOD FOR MANUFACTURING THE SAME |
| 71 | 19005406 |
|
PSEUDO CFET STRUCTURES AND THE METHODS OF FORMING THE SAME |
| 72 | 18981788 |
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 73 | 18891949 |
|
GATE CONTACT STRUCTURES IN SEMICONDUCTOR DEVICES |
| 74 | 18898126 |
|
SEMICONDUCTOR STRUCTURE WITH ISOLATION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 75 | 18896315 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 76 | 19409356 |
|
SEMICONDUCTOR STRUCTURE |
| 77 | 18895432 |
|
IMAGE ENCRYPTION CIRCUIT AND METHOD FOR OPERATING THE SAME |
| 78 | 18895433 |
|
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME |
| 79 | 18895437 |
|
ELECTRONIC ASSEMBLY AND METHOD OF FABRICATING THE SAME |
| 80 | 19405337 |
|
MEMORY DEVICE |
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