Taiwan Semiconductor Manufacturing Company, Ltd.
Taïwan, Province de Chine
Nouveaux brevets et marques déposées la semaine dernière
Dernière mise à jour : 2026-06-27
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Viewing 1 - 76 of 76
marques
brevets
| # | ID | Juridiction | Title |
|---|---|---|---|
| 1 | 19001560 |
|
INTEGRATED CIRCUIT |
| 2 | 19549083 |
|
SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE |
| 3 | 19003556 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 4 | 19208864 |
|
SILICON-DOPED OXIDE-BASED MATERIAL FOR ADVANCED GATE ELECTRODE APPLICATIONS |
| 5 | 19004465 |
|
PRE-EMPHASIS DRIVING CIRCUIT AND METHOD |
| 6 | 19551756 |
|
RESISTIVE MEMORY DEVICE INCLUDING A SILICON OXIDE BASE SPACER AND METHODS FOR FORMING THE SAME |
| 7 | 19550440 |
|
SEMICONDUCTOR DEVICE |
| 8 | 19002260 |
|
SEMICONDUCTOR DEVICE INCLUDING SEED LAYER AND METHOD FOR MANUFACTURING THE SAME |
| 9 | 19549253 |
|
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF |
| 10 | 19548996 |
|
PACKAGE STRUCTURE INCLUDING GUIDING PATTERNS |
| 11 | 19005069 |
|
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION |
| 12 | 19001700 |
|
SERIES PHASE CHANGE MATERIAL SWITCHES WITH OFF-STATE VOLTAGE EQUALIZERS AND METHOD FOR FORMING THE SAME |
| 13 | 19549672 |
|
INTEGRATED CIRCUIT STRUCTURE |
| 14 | 19546986 |
|
Integrated Circuit Structure With A Reduced Amount Of Defects And Methods For Fabricating The Same |
| 15 | 19546504 |
|
CONNECT STRUCTURE FOR SEMICONDUCTOR PROCESSING EQUIPMENT |
| 16 | 19546774 |
|
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME |
| 17 | 19544598 |
|
SCAN CHAIN CONTROL |
| 18 | 19543421 |
|
GATE STRUCTURES FOR SEMICONDUCTOR DEVICES |
| 19 | 19002351 |
|
SEMICONDUCTOR DEVICE INCLUDING DEEP METAL CONTACT AND METHOD FOR MANUFACTURING THE SAME |
| 20 | 19543659 |
|
SENSE AMPLIFIER AND OUTPUT LATCH CIRCUIT FOR TESTING |
| 21 | 19551888 |
|
INFO-POP STRUCTURES WITH TIVS HAVING CAVITIES |
| 22 | 19203493 |
|
METAL PHOSPHIDE LAYER FOR CONTACT AND METHODS OF FORMING SAME |
| 23 | 19003468 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 24 | 19551893 |
|
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF |
| 25 | 19004127 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 26 | 19004367 |
|
METHOD OF FORMING AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING FILM AND APPARATUS FOR EFFECTING THE SAME |
| 27 | 19547792 |
|
THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROGENEOUS PACKAGES AND METHODS FOR FORMING THE SAME |
| 28 | 19545173 |
|
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION |
| 29 | 19535137 |
|
SEMICONDUCTOR STRUCTURE |
| 30 | 19547938 |
|
SEMICONDUCTOR DEVICE |
| 31 | 19001612 |
|
METHOD OF FORMING A SEMICONDUCTOR DEVICE |
| 32 | 19545796 |
|
METHOD AND APPARATUS TO ENHANCE SEMICONDUCTOR DEVICE MANUFACTURING |
| 33 | 19005757 |
|
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME |
| 34 | 19006598 |
|
SEMICONDUCTOR STRUCTURE STACKED TRANSISTORS |
| 35 | 19008582 |
|
ELECTRONIC COMPONENT INTEGRATED PHASE CHANGE MATERIAL SWITCH |
| 36 | 19008509 |
|
METHOD FOR PREVENTING VOIDS IN CONTACT PLUGS USING SELECTIVE PASSIVATION LAYERS IN SEMICONDUCTOR FABRICATION |
| 37 | 19007783 |
|
BONDED DEVICE STRUCTURES INCLUDING SLOTTED REDISTRIBUTION LAYER PADS AND METHODS OF FABRICATION THEREOF |
| 38 | 19007134 |
|
TRANSISTOR STRUCTURES HAVING IMPROVED CONTACT EPITAXIAL LAYERS AND METHOD OF MANUFACTURING THEREOF |
| 39 | 19008486 |
|
INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME |
| 40 | 19545913 |
|
BIT LINE DIRECT CHARGE |
| 41 | 19004604 |
|
HAPTIC RESPONSE INTEGRATED CIRCUIT DEVICE WITH PIEZOELECTRIC STRUCTURES |
| 42 | 19552009 |
|
SEMICONDUCTOR DEVICES WITH IMPLANTED STI REGIONS AND METHODS OF FORMING THE SAME |
| 43 | 19003796 |
|
SEMICONDUCTOR DEVICE WITH BOTTOM CHANNEL ISOLATION, AND METHOD FOR FABRICATING THE SAME |
| 44 | 19007735 |
|
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME |
| 45 | 19003122 |
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 46 | 19006371 |
|
HIGH-DENSITY LOW-K DIELECTRIC LAYER |
| 47 | 19548993 |
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME |
| 48 | 19551911 |
|
SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CAPACITOR AND VERTICAL CHANNEL TRANSISTOR AND METHODS OF FORMING THE SAME |
| 49 | 19547009 |
|
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING |
| 50 | 19547813 |
|
COMPUTE-IN-MEMORY SYSTEM, AND METHOD OF OPERATING SAME |
| 51 | 19008377 |
|
SEMICONDUCTOR DEVICE UTILIZING BIPOLAR DIPOLE METAL OXIDES FOR GE-BASED CMOS AND MANUFACTURING METHOD THEREOF |
| 52 | 19547814 |
|
STACKED TRANSISTOR ISOLATION FEATURES AND METHODS OF FORMING THE SAME |
| 53 | 19548904 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 54 | 19546998 |
|
READ-ONLY MEMORY METHOD, LAYOUT, AND DEVICE |
| 55 | 19001557 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 56 | 19002628 |
|
HOLDING MODULE, APPARATUS HAVING THE SAME, AND A METHOD OF USING THE SAME |
| 57 | 19547891 |
|
Multiband QAM Interface for Slab Waveguide |
| 58 | 19547873 |
|
INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME |
| 59 | 19002773 |
|
TESTING APPARATUS AND METHODS OF USING THE SAME |
| 60 | 19546909 |
|
CONTACT STRUCTURE MANUFACTURING METHOD |
| 61 | 19546931 |
|
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING |
| 62 | 19005622 |
|
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 63 | 19012151 |
|
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION |
| 64 | 19215058 |
|
SOURCE/DRAIN REGIONS IN STACKING TRANSISTORS AND METHODS OF FORMING THE SAME |
| 65 | 19004992 |
|
IMPRINT APPARATUS AND METHOD THEREOF |
| 66 | 19543676 |
|
CLOCK ALIGNING CIRCUIT AND METHODS FOR OPERATING THE SAME |
| 67 | 19002151 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 68 | 19548273 |
|
SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS AND FORMING METHOD THEREOF |
| 69 | 19549146 |
|
PROBE HEAD STRUCTURES FOR CIRCUIT PROBE TEST SYSTEMS AND METHODS OF FORMING THE SAME |
| 70 | 19546686 |
|
SEMICONDUCTOR DEVICE INCLUDING DAISY-CHAINED DELAY CELLS AND METHOD OF FORMING THE SAME |
| 71 | 19007798 |
|
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH METAL GATE STACK |
| 72 | 19547570 |
|
ETCH MONITORING AND PERFORMING |
| 73 | 19006295 |
|
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME |
| 74 | 19006274 |
|
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME |
| 75 | 19545774 |
|
PHOTOMASK AND MANUFACTURING METHOD OF THE PHOTOMASK |
| 76 | 19546658 |
|
FIN HEIGHT AND STI DEPTH FOR PERFORMANCE IMPROVEMENT IN SEMICONDUCTOR DEVICES HAVING HIGH-MOBILITY P-CHANNEL TRANSISTORS |
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