Taiwan Semiconductor Manufacturing Company, Ltd.
Taiwan, Province of China
New patents and trademarks in the last week
Last updated : 2026-04-11
Summary
Patents |
Trademarks |
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Create a watch for Taiwan Semiconductor Manufacturing Company, Ltd.
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Viewing 1 - 62 of 62
trademarks
patents
| # | ID | Jurisdiction | Title |
|---|---|---|---|
| 1 | 18892574 |
|
STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 2 | 19404541 |
|
METHOD AND DEVICE FOR BOOSTING PERFORMANCE OF FINFETS VIA STRAINED SPACER |
| 3 | 19404536 |
|
FORMING SEAMS WITH DESIRABLE DIMENSIONS IN ISOLATION REGIONS |
| 4 | 18910056 |
|
DYNAMIC OFFSET CALIBRATION CIRCUIT AND METHOD FOR OPERATING THE SAME |
| 5 | 18910039 |
|
SEMICONDUCTOR DEVICE WITH ISOLATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 6 | 19404553 |
|
Metal Gate Structure And Methods Of Fabricating Thereof |
| 7 | 18910022 |
|
SEMICONDUCTOR DEVICE WITH ISOLATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 8 | 19017719 |
|
TIME-TO-DIGITAL CONVERSION DEVICE |
| 9 | 18907514 |
|
TRANSISTOR STRUCTURE HAVING INCREASED SOURCE/DRAIN CURRENT AND METHOD OF MANUFACTURING THEREOF |
| 10 | 19050140 |
|
CAPACITOR-LESS LOW-DROPOUT REGULATOR WITH DYNAMIC FREQUENCY COMPENSATION |
| 11 | 19416954 |
|
Source/Drain Epitaxial Structures For High Voltage Transistors |
| 12 | 19414305 |
|
METHOD FOR SEMICONDUCTOR MANUFACTURING AND SYSTEM FOR ARRANGING A LAYOUT |
| 13 | 19049338 |
|
SEMICONDUCTOR MEMORY DEVICES WITH EMBEDDED POWER STRUCTURE AND METHODS OF MANUFACTURING THEREOF |
| 14 | 18908893 |
|
INTEGRATED CIRCUIT PACKAGES AND METHODS |
| 15 | 19273668 |
|
Contact Formation Method and Related Structure |
| 16 | 19053550 |
|
ISOLATION STRUCTURE HAVING LAYOUT TO INCREASE IMAGE SENSOR PERFORMANCE |
| 17 | 19417096 |
|
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF |
| 18 | 19406331 |
|
STACKING VIA CONFIGURATION FOR ADVANCED SILICON NODE PRODUCTS AND METHODS FOR FORMING THE SAME |
| 19 | 19044025 |
|
DIPOLE DOPING FOR CFETS WITH REDUCED LOADING |
| 20 | 19171553 |
|
COMPUTE-IN-MEMORY CIRCUITS AND METHODS FOR OPERATING THE SAME |
| 21 | 19382582 |
|
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME |
| 22 | 19393631 |
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME |
| 23 | 19415105 |
|
DEVICE AND METHOD TO PROMOTE THICKNESS UNIFORMITY IN SPIN-COATING |
| 24 | 19404442 |
|
SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP |
| 25 | 19047694 |
|
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME |
| 26 | 19053754 |
|
INSPECTION APPARATUS AND INSPECTION METHOD |
| 27 | 18905428 |
|
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION |
| 28 | 18908937 |
|
BACK-SIDE POWER RAIL DEVICE AND METHOD OF MAKING SAME |
| 29 | 18905637 |
|
MEMORY CIRCUITS WITH TRACKING CELLS AND METHODS FOR OPERATING THE SAME |
| 30 | 19389993 |
|
MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS |
| 31 | 19403746 |
|
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING TOOL |
| 32 | 19407388 |
|
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME |
| 33 | 19052596 |
|
METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR INTEGRATED CIRCUIT DESIGN |
| 34 | 19010563 |
|
NON-OXIDE DIELECTRIC SPACERS FOR RESISTIVE RANDOM-ACCESS MEMORY |
| 35 | 19050825 |
|
INTEGRATED CIRCUIT WITH P/N GAA TRANSISTORS OF DIFFERENT CHANNEL MATERIALS |
| 36 | 18910402 |
|
SEMICONDUCTOR PACKAGES AND METHODS OF FORMATION |
| 37 | 19417619 |
|
SEMICONDUCTOR DEVICE FABRICATION METHODS AND DEVICES FOR FORMING THE SAME |
| 38 | 19040914 |
|
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME |
| 39 | 18910043 |
|
DUTY CYCLE CORRECTION CIRCUIT AND METHOD FOR OPERATING THE SAME |
| 40 | 18910024 |
|
SEMICONDUCTOR DEVICE WITH ISOLATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 41 | 19415836 |
|
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE |
| 42 | 19404947 |
|
SEMICONDUCTOR STRUCTURES AND METHODS FOR MANUFACTURING THE SAME |
| 43 | 18822401 |
|
COMPOSITE PACKAGES FOR ENHANCING THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME |
| 44 | 19415603 |
|
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME |
| 45 | 19042484 |
|
BACKSIDE SOURCE/DRAIN CONTACTS AND METHODS OF MAKING SAME |
| 46 | 18817210 |
|
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE |
| 47 | 19037097 |
|
HEAT DISSIPATION THROUGH REDISTRIBUTION STRUCTURE |
| 48 | 19392173 |
|
PACKAGE STRUCTURE |
| 49 | 19417002 |
|
Semiconductor Device |
| 50 | 19058371 |
|
CFET SRAM DEVICE, LAYOUT, AND METHOD |
| 51 | 19008088 |
|
SEMICONDUCTOR DEVICE AND METHOD OF GENERATING LAYOUT PLAN FOR SEMICONDUCTOR DEVICE |
| 52 | 18911009 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 53 | 18906717 |
|
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 54 | 18906378 |
|
BRIDGE DETECTION TEST PATTERN AND RELATED METHODS |
| 55 | 18910621 |
|
LDMOS TRANSISTOR, SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 56 | 18905488 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 57 | 18910231 |
|
PIXEL SENSOR AND METHODS FOR MANUFACTURING PIXEL SENSOR AND DEEP TRENCH ISOLATION STRUCTURE THEREOF |
| 58 | 18908373 |
|
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE AND EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY SYSTEMS |
| 59 | 19054173 |
|
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF |
| 60 | 18909234 |
|
FILTER CLEANING METHODS AND APPARATUSES |
| 61 | 19037816 |
|
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME |
| 62 | 19406486 |
|
PHOTORESIST, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND METHOD OF EXTREME ULTRAVIOLET LITHOGRAPHY |
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