METHOD FOR PREPARING AN ELECTROPLATED PRODUCT BY DEPOSITING AN UNDERLAYER, DIFFUSION BARRIER LAYER AND TOP LAYER ON THE SURFACE OF A SUBSTRATE AND SUCH PREPARED ELECTROPLATED PRODUCT
The present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper alloy layer wherein the underlayer comprises or consists of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof and the top layer comprises or consists of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof. The underlayer and the top layer are separated by a barrier diffusion layer comprising or consisting of Indium or an alloy of Indium. This barrier layer prevents the interdiffusion between the underlayer and the top layer. Moreover, the present invention also refers to an electroplated product obtainable by such a method.
The present invention refers to an electrolytic treatment device having an anodic compartment comprising a non‐chromium(VI) etching solution to be treated and immersed therein an anode. The anodic compartment is separated by a membrane from a cathodic compartment comprising a cathodic solution comprising an inorganic acid, wherein the anode and the cathode are used comprising or consisting of a ternary or higher Pb alloy with Sn and at least one further metal selected from the group consisting of Sb, Ag, Co, Bi and combinations thereof. Moreover, a method for etching plastic parts is provided as well.
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
The present invention refers to an electroplating bath for electroplating a chromium or chromium alloy layer, the bath comprising trivalent chromium ions, organic carboxylic acid, sulfate ions, sodium conductive ions, and additives in the form of inorganic sulfur compound and boric acid as well as a process using such an electroplating bath.
The present invention refers to a composition for the protection of precious metal substrates as well as a process for obtaining an organic protective nanolayer on precious metal substrates. Moreover, the present invention refers to a precious metal substrate having an Organic Protective nanolayer.
C25D 9/02 - Revêtement électrolytique autrement qu'avec des métaux avec des matières organiques
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C25D 13/12 - Revêtement électrophorétique caractérisé par le procédé caractérisé par l'objet revêtu
5.
ELECTROPLATING BATH FOR DEPOSITING A BLACK ALLOY, METHOD FOR THE ELECTROCHEMICAL DEPOSITION OF A BLACK ALLOY ON A SUBSTRATE, A BLACK ALLOY AND AN ARTICLE COATED WITH SUCH BLACK ALLOY
The present invention relates to an electroplating bath for depositing a black alloy, a method for the electrochemical deposition of a black alloy on a substrate, a black alloy and an article at least partly coated with the black alloy.
The present invention relates to electroplated products having a combination of layers used to provide a diffusion barrier layer under a precious metal top layer on a substrate comprising a copper based material and/or a copper based underlayer, such that the layer or combination of layers prevents or retards the migration of copper into the precious metal layer or the opposite. The diffusion barrier layer comprises indium or an indium alloy. Moreover, the present invention refers a method for preparing such an electroplated product.
The present invention relates to a method for increasing the corrosion resistance of a chrome‐plated substrate wherein at least one part of a chrome‐plated surface of a chrome-plated substrate is dipped into an electrolyte comprising trivalent chromium ions, at least one conducting salt and at least one reducing agent, and afterwards, a trivalent chromium oxide film is formed on the at least one part of the chrome‐plated surface by applying a pulse reverse current between the chrome‐plated surface and a counter electrode electrically connected with the chrome‐plated surface through the electrolyte. Furthermore, the present invention relates to a chrome‐plated substrate obtainable by this method.
PROCESS FOR METALLIZATION OF AN ARTICLE HAVING A PLASTIC SURFACE AVOIDING THE METALLIZATION OF THE RACK WHICH FIXES THE ARTICLE WITHIN THE PLATING BATH
The invention refers to a process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C23C 18/24 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines pour rendre la surface rugueuse, p. ex. par décapage au moyen de solutions aqueuses acides
ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE
The invention provides an electroplating bath for electrochemical deposition of a novel Cu-Sn-Zn-Pd alloy on a substrate. The novel alloy is characterized by exceptional corrosion resistance and the commonly used precious metal intermediate layer (e.g. a Pd-layer) between the substrate and the finishing layer is no longer necessary which allows a substantial reduction of the production costs of the plated substrates.
This invention provides an electroplated product with a precious metal finishing layer that has an improved corrosion and abrasion resistance. The electroplated product comprises two electroplated copper alloy layers having a different copper concentration (e.g. white bronze and yellow bronze). The electroplated product is especially suitable for use in jewelry, fashion, leather, watch, eyewear, trinkets and/or lock industry. Another advantage of the electroplated product is that the use of allergenic nickel or expensive palladium intermediate layers against copper migration can be dispensed with. This means that the electroplated product can be non-allergenic (nickel-free) and be provided in a more economical and environment-friendly manner. A method for the production of the inventive electroplated product is presented. Furthermore, the use of the inventive electroplated product in the jewelry, fashion, leather, watch, eyewear, trinkets and/or lock industry is suggested.
The present invention refers to an electroplating bath for depositing chromium which comprises at least one trivalent chromium salt, at least one complexing agent, at least one halogen salt and optionally further additives. Moreover, the invention refers to a process for depositing chromium on a substrate using the mentioned electroplating bath.
The invention relates to a substrate with a corrosion resistant coating comprising at least one nickel layer and at least one chromium layer as finish. Between these layers, at least one tin-nickel alloy layer is deposited for suppression of corrosion reactions determined by CASS and Russian mud tests. The invention relates also to a method for producing such substrates with corrosion resistant coating.
C25D 5/14 - Dépôt de plusieurs couches du même métal ou de métaux différents au moins une couche étant du nickel ou du chrome plusieurs couches étant du nickel ou du chrome, p. ex. couches doubles ou triples
13.
ELECTROLYTE FOR THE ELECTROCHEMICAL DEPOSITION OF GOLD ALLOYS AND PROCESS FOR THE PRODUCTION THEREOF
The present invention relates to cyanide-free electrolytes for the electrochemical deposition of binary and polynary alloys of gold, which contain an alkaline solution of anionic thiolate complexes of gold and metals which form alloys with gold. These electrolytes can be produced in a simple, environmentally friendly and economical way from commercially available aqueous solutions of sulphite complexes of gold and a number of salts of the corresponding alloy-forming metals, by addition of the thiols and setting of an alkaline pH of the electrolytic bath. The electrolytes display long-term stability and can be used for the electrochemical deposition of gold alloys. The present invention likewise relates to a process for producing the electrolytes mentioned.
The invention relates to a cyanide-free electrolyte for galvanic deposition of gold or alloys thereof, which has a neutral or alkaline aqueous solution of at least one gold complex and possibly of a complex of an alloy former for gold, the complexes being present in anionic form. The electrolyte according to the invention is used in galvanic deposition, in particular for coatings made of gold and alloys thereof.
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