Abstract

The present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper alloy layer wherein the underlayer comprises or consists of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof and the top layer comprises or consists of a precious metal selected from the group consisting of Au, Ag, Pd, Rh, Ru, Pt and alloys thereof. The underlayer and the top layer are separated by a barrier diffusion layer comprising or consisting of Indium or an alloy of Indium. This barrier layer prevents the interdiffusion between the underlayer and the top layer. Moreover, the present invention also refers to an electroplated product obtainable by such a method.

IPC Classes  ?

• C25D 5/10 - Electroplating with more than one layer of the same or of different metals
• C25D 7/00 - Electroplating characterised by the article coated
• C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
• C25D 3/46 - ElectroplatingBaths therefor from solutions of silver
• C25D 3/48 - ElectroplatingBaths therefor from solutions of gold
• C25D 3/54 - ElectroplatingBaths therefor from solutions of metals not provided for in groups

Abstract

The present invention refers to an electrolytic treatment device having an anodic compartment comprising a non‐chromium(VI) etching solution to be treated and immersed therein an anode. The anodic compartment is separated by a membrane from a cathodic compartment comprising a cathodic solution comprising an inorganic acid, wherein the anode and the cathode are used comprising or consisting of a ternary or higher Pb alloy with Sn and at least one further metal selected from the group consisting of Sb, Ag, Co, Bi and combinations thereof. Moreover, a method for etching plastic parts is provided as well.

IPC Classes  ?

• C23C 18/24 - Roughening, e.g. by etching using acid aqueous solutions
• C25B 1/24 - Halogens or compounds thereof
• C25B 1/28 - Per-compounds
• C25B 11/04 - ElectrodesManufacture thereof not otherwise provided for characterised by the material
• C25B 9/19 - Cells comprising dimensionally-stable non-movable electrodesAssemblies of constructional parts thereof with diaphragms

Abstract

The present invention refers to an electroplating bath for electroplating a chromium or chromium alloy layer, the bath comprising trivalent chromium ions, organic carboxylic acid, sulfate ions, sodium conductive ions, and additives in the form of inorganic sulfur compound and boric acid as well as a process using such an electroplating bath.

IPC Classes  ?

• C25D 3/06 - ElectroplatingBaths therefor from solutions of chromium from solutions of trivalent chromium

Abstract

The present invention refers to a composition for the protection of precious metal substrates as well as a process for obtaining an organic protective nanolayer on precious metal substrates. Moreover, the present invention refers to a precious metal substrate having an Organic Protective nanolayer.

IPC Classes  ?

• C25D 9/02 - Electrolytic coating other than with metals with organic materials
• C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
• C23F 11/14 - Nitrogen-containing compounds
• C23F 11/16 - Sulfur-containing compounds
• C25D 13/12 - Electrophoretic coating characterised by the process characterised by the article coated

Abstract

The present invention relates to an electroplating bath for depositing a black alloy, a method for the electrochemical deposition of a black alloy on a substrate, a black alloy and an article at least partly coated with the black alloy.

IPC Classes  ?

• C25D 7/00 - Electroplating characterised by the article coated
• C25D 3/48 - ElectroplatingBaths therefor from solutions of gold
• C25D 3/62 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of gold
• C22C 5/02 - Alloys based on gold

Abstract

The present invention relates to electroplated products having a combination of layers used to provide a diffusion barrier layer under a precious metal top layer on a substrate comprising a copper based material and/or a copper based underlayer, such that the layer or combination of layers prevents or retards the migration of copper into the precious metal layer or the opposite. The diffusion barrier layer comprises indium or an indium alloy. Moreover, the present invention refers a method for preparing such an electroplated product.

IPC Classes  ?

• C25D 7/00 - Electroplating characterised by the article coated
• C25D 3/54 - ElectroplatingBaths therefor from solutions of metals not provided for in groups
• C25D 3/56 - ElectroplatingBaths therefor from solutions of alloys
• C25D 3/62 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of gold
• C25D 5/10 - Electroplating with more than one layer of the same or of different metals

Abstract

The present invention relates to a method for increasing the corrosion resistance of a chrome‐plated substrate wherein at least one part of a chrome‐plated surface of a chrome-plated substrate is dipped into an electrolyte comprising trivalent chromium ions, at least one conducting salt and at least one reducing agent, and afterwards, a trivalent chromium oxide film is formed on the at least one part of the chrome‐plated surface by applying a pulse reverse current between the chrome‐plated surface and a counter electrode electrically connected with the chrome‐plated surface through the electrolyte. Furthermore, the present invention relates to a chrome‐plated substrate obtainable by this method.

IPC Classes  ?

• C25D 3/06 - ElectroplatingBaths therefor from solutions of chromium from solutions of trivalent chromium
• C25D 5/18 - Electroplating using modulated, pulsed or reversing current
• C25D 5/48 - After-treatment of electroplated surfaces
• C25D 9/04 - Electrolytic coating other than with metals with inorganic materials
• C25D 9/06 - Electrolytic coating other than with metals with inorganic materials by anodic processes
• C25D 11/38 - Chromatising

Abstract

The invention refers to a process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath.

IPC Classes  ?

• C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
• C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
• C23C 18/24 - Roughening, e.g. by etching using acid aqueous solutions
• C23C 18/30 - Activating

Abstract

The invention provides an electroplating bath for electrochemical deposition of a novel Cu-Sn-Zn-Pd alloy on a substrate. The novel alloy is characterized by exceptional corrosion resistance and the commonly used precious metal intermediate layer (e.g. a Pd-layer) between the substrate and the finishing layer is no longer necessary which allows a substantial reduction of the production costs of the plated substrates.

IPC Classes  ?

• C25D 3/58 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of copper
• C25D 3/60 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of tin
• C25D 5/10 - Electroplating with more than one layer of the same or of different metals
• C25D 7/00 - Electroplating characterised by the article coated
• C23C 18/48 - Coating with alloys

Abstract

This invention provides an electroplated product with a precious metal finishing layer that has an improved corrosion and abrasion resistance. The electroplated product comprises two electroplated copper alloy layers having a different copper concentration (e.g. white bronze and yellow bronze). The electroplated product is especially suitable for use in jewelry, fashion, leather, watch, eyewear, trinkets and/or lock industry. Another advantage of the electroplated product is that the use of allergenic nickel or expensive palladium intermediate layers against copper migration can be dispensed with. This means that the electroplated product can be non-allergenic (nickel-free) and be provided in a more economical and environment-friendly manner. A method for the production of the inventive electroplated product is presented. Furthermore, the use of the inventive electroplated product in the jewelry, fashion, leather, watch, eyewear, trinkets and/or lock industry is suggested.

IPC Classes  ?

• C25D 7/00 - Electroplating characterised by the article coated
• C25D 5/10 - Electroplating with more than one layer of the same or of different metals
• C25D 5/48 - After-treatment of electroplated surfaces
• C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic

Abstract

The present invention refers to an electroplating bath for depositing chromium which comprises at least one trivalent chromium salt, at least one complexing agent, at least one halogen salt and optionally further additives. Moreover, the invention refers to a process for depositing chromium on a substrate using the mentioned electroplating bath.

IPC Classes  ?

• C25D 3/06 - ElectroplatingBaths therefor from solutions of chromium from solutions of trivalent chromium
• C25D 9/08 - Electrolytic coating other than with metals with inorganic materials by cathodic processes

Abstract

The invention relates to a substrate with a corrosion resistant coating comprising at least one nickel layer and at least one chromium layer as finish. Between these layers, at least one tin-nickel alloy layer is deposited for suppression of corrosion reactions determined by CASS and Russian mud tests. The invention relates also to a method for producing such substrates with corrosion resistant coating.

IPC Classes  ?

• C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers

Abstract

The present invention relates to cyanide-free electrolytes for the electrochemical deposition of binary and polynary alloys of gold, which contain an alkaline solution of anionic thiolate complexes of gold and metals which form alloys with gold. These electrolytes can be produced in a simple, environmentally friendly and economical way from commercially available aqueous solutions of sulphite complexes of gold and a number of salts of the corresponding alloy-forming metals, by addition of the thiols and setting of an alkaline pH of the electrolytic bath. The electrolytes display long-term stability and can be used for the electrochemical deposition of gold alloys. The present invention likewise relates to a process for producing the electrolytes mentioned.

IPC Classes  ?

• C25D 3/62 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of gold

Abstract

The invention relates to a cyanide-free electrolyte for galvanic deposition of gold or alloys thereof, which has a neutral or alkaline aqueous solution of at least one gold complex and possibly of a complex of an alloy former for gold, the complexes being present in anionic form. The electrolyte according to the invention is used in galvanic deposition, in particular for coatings made of gold and alloys thereof.

IPC Classes  ?

• C25D 3/48 - ElectroplatingBaths therefor from solutions of gold
• C25D 3/62 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of gold