An inorganic fiber mat produced by a method including a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat, a defibrating step of defibrating the first inorganic fiber molding to obtain defibrated inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p. ex. par la réorientation des fibres les fibres étant disposées au hasard
D21B 1/12 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par procédés humidesMatières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par l'emploi de vapeur
2.
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM USED FOR IMPLEMENTING THE METHOD
A laminating system includes a laminating device including a laminating roll device that applies a dry film onto a seed layer formed on a surface of a resin insulating layer, and a pressure application device positioned such that the pressure application device applies heat and pressure to the dry film.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
H05K 3/14 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur
A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming opening through the protective film and insulating layer, removing the film, cleaning the surface of the insulating layer, forming a second conductor layer on the surface of the insulating layer; and forming a via conductor connecting the first and second conductor layers in the opening. The insulating layer includes resin and inorganic particles having spherical shapes, the cleaning includes selectively removing the resin such that the particles include first particles partially embedded and second particles completely embedded in the resin. The forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.
A wiring substrate includes a core substrate including a resin substrate, a glass substrate in opening of the resin substate, and filling resin between the resin and glass substrates, and a build-up part on the core substrate and including conductor layers and resin insulating layers. The glass substrate has first through-hole conductors including main material including copper, the resin substrate has second through-hole conductors including main material including copper, and the first and second through-hole conductors are formed in the glass and resin substrates respectively such that density of the first through-hole conductors is greater than density of the second through-hole conductors, where the density of the first through-hole conductors is number of the first through-hole conductors per unit area of surface of the glass substrate, and the density of the second through-hole conductors is number of the second through-hole conductors per unit area of surface of the resin substrate.
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas formed on surface, and forming a build-up part including conductor layers and insulating layers on the surface of the substrate across the product areas. The product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that each insulating layer has elongation rate of 7% or more, the laminating the conductor layers includes forming a resist layer having a resist pattern and forming a conductor pattern including wirings according to the pattern such that the wirings have minimum width of 2 μm or less and minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
C03C 17/40 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement avec au moins deux revêtements ayant des compositions différentes un revêtement au moins étant un métal tous les revêtements étant métalliques
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas on a surface, and forming a build-up part on the surface across the product area. The one or more product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that difference in thermal expansion coefficient between the substrate and insulating layers is 13 ppm/° C. or less, the laminating the conductor layers includes forming a resist layer having resist pattern and forming conductor pattern including wirings according to the pattern such that the wirings have the minimum width of 2 μm or less and the minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas on first surface, and forming a build-up part including conductor layers and insulating layers on the first surface across the one or more product areas. The glass substrate has a support body attached to second surface. The one or more product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers, the laminating the conductor layers includes forming a resist layer having pattern and forming conductor pattern including wirings according to the pattern. The wirings have the minimum width of 2 μm or less and the minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
Provided are: a heat transfer suppression sheet that has excellent sheet strength and makes it possible to inhibit inorganic particles from falling off, maintain excellent thermal insulation performance, and mitigate stresses from impacts, pressing force, and the like; and a battery pack having the heat transfer suppression sheet. The heat transfer suppression sheet (10) includes inorganic particles (4) and organic fibers (11) and has, on at least one of the front surface and the back surface thereof, a fiber aggregate section (2) formed by intertwining a plurality of the organic fibers (11), and a recess (3) recessed from the fiber aggregate section (2). In addition, the battery pack includes a plurality of battery cells and the heat transfer suppression sheet (10), and the plurality of battery cells are connected in series or in parallel.
Provided is a battery pack that can quickly discharge a high-temperature gas emitted from an abnormal battery cell during thermal runaway and prevent a thermal runaway cascade caused by backflow of the high-temperature gas to an adjacent battery cell. This battery pack comprises a module that includes a plurality of battery cells that each have a safety valve, a case that accommodates the module, and a heat insulation material that is provided between the module and the case. The battery pack is characterized in that the heat insulation material includes a first heat insulation sheet that, as seen in plan view, comprises a plurality of covering parts that respectively cover the plurality of safety valves and a body part that is outside the covering parts, each of the covering parts being positioned so as to overlap at least a portion of one safety valve and having a first slit part that is formed along the outline of the covering part and a second slit part that is at least partially formed inside the outline of the covering part, the outline of the covering part including at least two connection parts that connect the covering part and the body part where the first slit part is not formed.
H01M 50/367 - Passages internes d’évacuation des gaz dans le couvercle ou le boîtier de la batterieSystèmes d’évent à double couvercle
H01M 50/35 - Évacuation des gaz comprenant des passages allongés, tortueux ou en forme de labyrinthe
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
The present invention provides a thermal insulation material for a battery pack, said thermal insulation material being thin but yet exhibiting excellent thermal insulation properties. This thermal insulation material for a battery pack includes a layered inorganic material sheet formed by laminating a plurality of layered inorganic material papers, said thermal insulation material characterized in that the layered inorganic material papers are impregnated with a resin, and the layered inorganic material sheet is expanded by heating at 500°C so as to create voids in the layered inorganic material sheet.
The present invention provides a thermal insulation material (40) for a battery pack, said thermal insulation material being thin but yet exhibiting excellent thermal insulation properties. This thermal insulation material (40) for a battery pack includes a layered inorganic material sheet (42) obtained by laminating layered inorganic material papers (43), said thermal insulation material characterized by comprising voids, the size of which in the thickness direction is 10-100 μm inclusive, at least between the layered inorganic material papers.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p. ex. rapports, tailles ou concentrations
A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming an opening through the film and the resin insulating layer, removing the film, treating the surface of the insulating layer, forming a second conductor layer on the surface of the resin insulating layer, and forming a via conductor connecting the first and second conductor layers. The insulating layer includes resin and inorganic particles including first and second particles. The surface of the insulating layer includes a surface of the resin and substantially flat exposed portions of the first particles, and the forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.
A wiring substrate includes a build-up part including a conductor layer and an insulating layer, a solder resist layer formed in contact with a surface of the build-up part, and a metal post formed on the build-up part and protruding from the solder resist layer. The build-up part includes conductor layers including the conductor layer and insulating layers including the insulating layer such that the conductor layer includes a conductor pad, is formed on a surface of the solder resist layer and is in contact with a surface of the insulating layer forming the surface of the build-up part, and the metal post includes a base plating layer connected to the conductor pad of the conductor layer in the build-up part such that the base plating layer includes a penetrating portion formed in an opening of the solder resist layer and a pad portion protruding from the solder resist layer.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
This mat material includes a laminated mat including at least one layer of an alignment layer made of inorganic fibers and having the alignment directions of the inorganic fibers aligned, and at least one layer of a random layer made of inorganic fibers and having random orientation directions of the inorganic fibers. The laminated mat includes a binder.
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
15.
COMPOSITE MEMBER, METHOD FOR MANUFACTURING SAME, AND POWER STORAGE DEVICE
Provided is a composite member having an insulation film that is capable of maintaining excellent insulation and heat resistance for a long period of time, does not require operation such as winding a tape or the like, and is free from problems such as occurrence of winding unevenness or a gap and detachment. A composite member (1) has a base material (2) and an insulation film (3) covering at least a portion of the surface of the base material (2). The insulation film (3) has: an inner layer (4) comprising a first film material which has a matrix (8) including a compound having a siloxane bond and an inorganic material (9) dispersed in the matrix (8) and having a squamous, plate, flake, or fibrous shape; and an outer layer (5) comprising a second film material which has a matrix (8) including a compound having a siloxane bond and an inorganic material dispersed in the matrix (8) and having a squamous, plate, flake, or fibrous shape. In the inner layer (4) and the outer layer (5), the respective alignments of the inorganic materials (9) with respect to the surface of the base material (2) are different from each other.
H01B 3/02 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances inorganiques
C09D 7/61 - Adjuvants non macromoléculaires inorganiques
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
Provided is a heat transfer suppression sheet which has excellent heat insulation properties, can absorb pressing force even when the pressing force is applied to the heat transfer suppression sheet, and thereby being able to suppress powder drop and maintain the excellent heat insulation properties, and also provided is a battery pack having the heat transfer suppression sheet. A heat transfer suppression sheet (10) contains heat insulating particles (5) and organic fibers (3). The heat-insulating particles (5) include large-diameter inorganic particles (1) having an average primary particle diameter of 0.1 μm or more and silica nanoparticles (2). One part of the principal surface (10a) of the heat transfer suppression sheet (10) orthogonal to the thickness direction has a first region (11) in which the large-diameter inorganic particles (1) are eccentrically located, and the other part of the principal surface (10a) has a second region (12) in which the large-diameter inorganic particles (1), the silica nanoparticles (2), and the organic fibers (3) are dispersed.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p. ex. rapports, tailles ou concentrations
A method for manufacturing a wiring substrate includes forming a build-up part including conductor layers and insulating layers across one or more product areas on a support substrate such that the one or more product areas have a rectangular shape with each side in a range of 80 mm to 240 mm. The forming the build-up part includes forming a resist layer having a resist pattern and forming a conductor pattern according to the resist pattern, and forming wirings in the conductor pattern such that the wirings have a minimum width of 2 μm or less and a minimum inter-wiring distance of 2 μm or less, and the forming the resist layer having the resist pattern includes exposing the resist layer by direct imaging exposure.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
A method for manufacturing a wiring substrate includes preparing two support substrates having one or more product areas, forming a first build-up part including first conductor and insulating layers across the one or more product areas on a first surface of each support substrate, positioning the substrates such that second surfaces of the substrates face each other, and forming a second build-up part including second conductor and insulating layers on each first build-up part. The minimum wiring width and the minimum inter-wiring distance of wirings in the first conductor layers are smaller than those of wirings in the second conductor layers. The forming the first build-up part includes forming a first resist layer having a first resist pattern and forming a conductor pattern according to the first resist pattern for each first conductor layer. The forming the first resist layer includes exposing the first resist layer by direct imaging exposure.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
Provided are: a heat transfer suppression sheet which exhibits high holding ability of a particle material and also excellent compression characteristics, is capable of preventing increase in convective heat transfer, and exhibits excellent thermal insulation performance; and a battery pack which comprises said heat transfer suppression sheet and is excellent in safety. A heat transfer suppression sheet (10) includes inorganic particles (30) and first organic fibers (20) having wide stem parts (21) in which the dimension equivalent to the width thereof is 1-100 μm, and branch parts (22) which branch from the stem parts (21). The stem parts (21) of the first organic fibers (20) are multilayered and aligned along a main surface (10a) of the heat transfer suppression sheet (10). In addition, this battery pack has: a plurality of battery cells; and the heat transfer suppression sheet (10). The plurality of battery cells are connected in series or in parallel.
This wiring board includes a build-up part which is a plurality of conductor layers and a plurality of insulating layers and which has a via conductor for interlayer connection of the plurality of conductor layers, and an optical waveguide (OPW). The build-up part is made of a first build-up part (10), a second build-up part (20), and a third build-up part (30). The first build-up part (10) includes a plurality of conductor layers (12) and insulating layers (11). The second build-up part (20) includes a plurality of conductor layers (22) and insulating layers (21). The third build-up part (30) includes a plurality of conductor layers (32) and insulating layers (31). The optical waveguide (OPW) is formed on a first surface (10F) of the first build-up part (10). The thickness (T1) of the first insulating layers, the thickness (T2) of the second insulating layers, and the thickness (T3) of the third insulating layers satisfy the relationship T1 ≠ T2 ≠ T3, and the second insulating layers (21) or the insulating layers (31) contain a core material.
An optical waveguide (1) according to an embodiment includes a lower cladding (21), a core (3) formed on the lower cladding (21), and an upper cladding (22) formed on the lower cladding (21) and the core (3). A part of the core (3) on the incident side or the exit side of the optical signal is exposed. The optical waveguide (1) comprises a region without an upper cladding and a region with an upper cladding. The region without the upper cladding has a core-exposed portion in which an upper surface (31) of the core (3) is exposed. The region with the upper cladding has a core non-exposed portion in which the upper surface (31) of the core (3) is not exposed. A corner portion (30) of the cross-sectional shape of the core (3a) in the core exposed portion is rounded.
A wiring substrate includes a conductor layer including a via land, a conductor film formed on the via land of the conductor layer, an insulating layer covering the conductor layer and the conductor film formed on the via land, and a via conductor formed in the insulating layer such that the via conductor is penetrating through the insulating layer and is connecting to the via land via the conductor film. A ratio of the shortest distance between an upper surface of the conductor film and an end surface of the via conductor on the opposite side with respect to an end surface connected to the conductor film to the shortest distance between an upper surface of the via land and the end surface of the via conductor on the opposite side with respect to the end surface connected to the conductor film is in the range of 0.4 to 0.7.
The purpose of the present invention is to provide a transformant having excellent 2,3-butanediol production capability. Provided is a transformant of a hydrogen-oxidizing bacterium that grows in the co-presence of oxygen, the transformant being used for the production of 2,3-butanediol. In the transformant, (a) a nucleic acid encoding an enzyme for synthesizing acetolactate from pyruvic acid, (b) a nucleic acid encoding an enzyme for converting acetolactate into acetoin, (c) a nucleic acid encoding an enzyme for converting acetoin into 2,3-butanediol, and (d) a regulatory sequence operably linked to the nucleic acids (a) to (c) are introduced, wherein the nucleic acid (b) is located upstream of the nucleic acid (a) and the nucleic acid (c).
Provided are a composite member that is excellent in insulation property and heat resistance and enables suppression of detachment or the like of an insulating coating film at a corner part which is especially likely to be damaged by collision between the composite members or between the composite member and another component, and a method for manufacturing the same. The composite member (20) comprises a base material (25) and an insulating coating film (10) that covers at least a part of the surface of the base material (25). The base material (25) includes a pair of opposing main surface parts (25a), a plurality of end surface parts (25b) that connect the pair of main surface parts (25a) to each other, and a corner part (25c) between the main surface part (25a) and the end surface part (25b). Porosity P1 of the insulating coating film (10) formed on the corner part (25c) of the base material (25) is smaller than porosity P2 of the insulating coating film (10) formed on the main surface part (25a) of the base material (25).
C23C 26/00 - Revêtements non prévus par les groupes
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
The present invention provides a heat transfer suppression sheet in which it is possible to accurately align the positions of a heat insulation material and an elastic sheet, and with which it is possible to suppress destruction of a battery case and deterioration of the battery performance due to deformation of a battery cell, to further suppress propagation of heat between battery cells when an abnormality occurs, and to reduce the starting material cost. This heat transfer suppression sheet (50) has: a heat insulation material (10) which contains inorganic particles; elastic sheets (51a, 51b) which are superposed on a first surface (10a) and a second surface (10b) of the heat insulation material (10), the first and second surfaces being orthogonal to the thickness direction of the heat insulation material; and joining parts (55a, 55b) which join the heat insulation material (10) and the elastic sheets (51a, 51b) to each other. Facing regions (45a, 45b) in which the heat insulating material (10) and the elastic sheets (51a, 51b) face each other have joining regions (44a, 44b) in which the joining parts (55a, 55b) are present, and non-joining regions (41a, 41b) in which the joining parts (55a, 55b) are not present.
222 adsorbent carried on the surface of the partition wall. The partition wall and the outer peripheral wall are made of silicon carbide, and have an opening ratio of 65-86%. The surface area of the partition wall is 20-36 cm2per 1 cm32222 in the air is captured.
B01D 53/14 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par absorption
B01D 53/04 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par adsorption, p. ex. chromatographie préparatoire en phase gazeuse avec adsorbants fixes
Provided is a composite member that has a high-strength insulating coating film formed at a desired region of the surface of a substrate and can thereby prevent reductions in insulating properties caused by partial damage to an insulating coating film. A composite member (20) includes a substrate (25) and an insulating coating film (10) that covers at least a portion of the surface of the substrate (25). The substrate (25) has a first region (41) and a second region (42) that have different surface roughnesses. The surface roughness Ra1 of the first region (41) is at least 1 μm, and the ratio (Ra1/Ra2) of the surface roughness Ra1 of the first region (41) to the surface roughness Ra2 of the second region (42) is 1.5–60.
C23C 26/00 - Revêtements non prévus par les groupes
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape and that a cylindricity of an outer circumferential surface is greater than 0.0 mm and equal to or less than 0.3 mm.
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
(wherein, R1 is a straight or branched alkylene group with 6 to 12 carbon atoms, and optionally comprises one or more double bonds, R2 is an alkyl group with 2 to 8 carbon atoms, and optionally comprises one or more branches and/or double bonds) or a salt or an ester thereof.
A01N 37/42 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un halogène, p. ex. acides carboxyliques contenant dans le même squelette carboné un groupe carboxylique ou un thio-analogue, ou un de leurs dérivés, et un atome de carbone ne comportant que deux liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p. ex. acides cétocarboxyliques
30.
FLAMEPROOF MATERIAL, METHOD FOR PRODUCING FLAMEPROOF MATERIAL, AND BATTERY MODULE
A flameproof material contains a heat insulation material containing an inorganic fiber or an infusible fiber, and an inorganic fiber cloth. The heat insulation material and the inorganic fiber cloth are integrated to each other by physical means. The physical means may be at least one of needling, a resin staple, a resin tag pin, or thread sewing.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
D04H 1/413 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles contenant des granulés autres que les substances absorbantes
D04H 1/498 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles les voiles ou couches étant renforcées par des moyens mécaniques, p. ex. par roulage par aiguilletage ou opérations similaires pour provoquer l'enchevêtrement des fibres enchevêtrement des couches de non-tissés
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
A connection structure includes an electrical wiring part, an optical element having a light receiving or light emitting surface, and an optical waveguide including a core part, a first cladding layer in contact with a first surface of the core part, and a second cladding layer in contact with a second surface of the core part on the opposite side. The waveguide has a first end surface and a second end surface formed such that the core part and first cladding layer are substantially flush on the first end surface and the second cladding layer has the second end surface extending from the first end surface, the core part has a light transmitting surface that is exposed on the first end surface and faces the light receiving or light emitting surface of the optical element, and the optical element is positioned on the second end surface of the optical waveguide.
A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape, and the coils are formed such that a space factor of the coils in a cross section of the motor coil substrate is in a range of 50% to 99%.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre constitués par des conducteurs imprimés
33.
HEAT TRANSFER SUPPRESSION SHEET, METHOD FOR PRODUCING SAME, AND BATTERY PACK
Provided is a heat transfer suppression sheet having desired strength and heat insulation properties and capable of flexibly adapting to various designs such as size and heat insulation properties. A heat transfer suppression sheet (50) is formed by coupling a plurality of pieces of heat insulation material (10) containing inorganic particles. The heat insulation material (10) has a pair of main surfaces (10a, 10b), and a connection surface (10c) that connects the pair of main surfaces (10a, 10b). The connection surfaces (10c) of the plurality of pieces of heat insulation material (10) are disposed facing each other, and a coupling surface (61) for coupling the pieces of heat insulation material (10) together is formed. In a cross-sectional view orthogonal to the pair of main surfaces (10a, 10b) and parallel to a direction in which the pieces of the heat insulation material (10) are adjacent to each other, the length of the coupling surface (61) is longer than the thickness of the heat insulation material (10) in a region in which the coupling surface (61) is formed.
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
A penetration promoter for an organic substance for plants, containing at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof. An agricultural composition containing: (a) at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof; and (b) at least one organic substance for plants.
An optical waveguide includes a core part, a first cladding layer formed on the core part such that the first cladding layer is in contact with a first surface of the core part, and a second cladding layer formed on the core part such that the second cladding layer is in contact with a second surface of the core part. The core part, first cladding layer and second cladding layer form an end portion of the optical waveguide such that the core part and first cladding layer form a first end surface of the optical waveguide on which the core part is exposed and the core part and the first cladding layer are flush with respect to each other, and a second end surface of the optical waveguide including a portion of the second cladding layer extending from the first end surface at the end portion of the optical waveguide.
A method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat, a firing step of firing the first inorganic fiber molding prepared in the preparing step, a defibrating step of defibrating the first inorganic fiber molding fired in the firing step to obtain defibrated inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p. ex. par la réorientation des fibres les fibres étant disposées au hasard
D21B 1/12 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par procédés humidesMatières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par l'emploi de vapeur
A wiring substrate includes a first wiring substrate including first insulating layers, first conductor layers, and first via conductors, and a second wiring substrate mounted on the first substrate and including second insulating layers, second conductor layers, and second via conductors. The second substrate is formed such that the minimum wiring width of wirings in the second conductor layers is smaller than the minimum wiring width of wirings in the first conductor layers, the minimum inter-wiring distance of the wirings in the second conductor layers is smaller than the minimum inter-wiring distance of the wirings in the first conductor layers, the wiring widths of the wirings in the second conductor layers are 3 μm or less, the inter-wiring distances of the wirings in the second conductor layer are 3 μm or less, and aspect ratio of the wirings in the second conductor layer is in range of 2.0 to 4.0.
Provided is a plant activator with which it is possible to safely, stably, and effectively promote an increase in fruiting by appropriately spraying the activator onto plants or using the same for irrigation. The plant activator contains: at least one compound selected from an oxo fatty acid or a derivative thereof or a salt thereof; and a terpene.
A01G 7/06 - Traitement des arbres ou des plantes en cours de croissance, p. ex. pour prévenir la décomposition du bois, pour teinter les fleurs ou le bois, pour prolonger la vie des plantes
39.
FLAMEPROOF SHEET, MANUFACTURING METHOD THEREFOR, AND BATTERY PACK
A flameproof sheet contains a flameproof material and an elastic member, and the flameproof material is laminated with the elastic member so that a joint surface of the flameproof material with the elastic member and a joint surface of the elastic member with the flameproof material are movable along the joint surface.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
B32B 7/08 - Liaison entre couches par des moyens mécaniques
B32B 25/04 - Produits stratifiés composés essentiellement de caoutchouc naturel ou synthétique comprenant du caoutchouc comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 25/10 - Produits stratifiés composés essentiellement de caoutchouc naturel ou synthétique adjacent à une couche fibreuse ou filamenteuse
40.
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN WIRING BOARD
A component built-in wiring board includes a core substrate having an opening, electronic components positioned in the opening of the substrate such that the electronic components are spaced apart with respect to each other, a build-up part formed on the substrate such that the build-up part is covering the electronic components in the opening of the substrate, and a resin part formed in the opening of the substrate and including a first resin part and a second resin part such that the second resin part is connecting the electronic components in the opening of the substrate and the first resin part is filling a space formed between the core substrate and the second resin part in the opening of the 10 substrate. The second resin part of the resin part is connecting the electronic components having different heights such that terminal surfaces of the electronic components are flush with each other.
H01L 23/538 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre la structure d'interconnexion entre une pluralité de puces semi-conductrices se trouvant au-dessus ou à l'intérieur de substrats isolants
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/13 - Supports, p. ex. substrats isolants non amovibles caractérisés par leur forme
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
41.
AGENT FOR INCREASING POLYPHENOL CONTENT IN LEAVES OF PLANT OF FAMILY THEACEAE, AND AGENT FOR INCREASING THEANINE CONTENT
Provided are an agent for increasing polyphenol content and an agent for increasing theanine content in leaves of a plant of the family Theaceae, these agents making it possible to safely increase the amount of polyphenols, such as catechins, and/or theanine contained in the tea tree by appropriately spraying or irrigating the plant without adversely affecting the biological tissue of the plant. The agent for increasing the polyphenol content and/or the theanine content in leaves of a plant of the family Theaceae contains at least one compound selected from the group consisting of oxo fatty acids or salts thereof and fatty acid hydroxides or salts thereof.
A01N 37/36 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un halogène, p. ex. acides carboxyliques contenant au moins un groupe carboxylique ou un thio-analogue, ou d'un de leurs dérivés, et un atome d'oxygène ou de soufre lié par une liaison simple, liés au même squelette carboné, cet atome d'oxygène ou de soufre ne faisant pas partie d'un groupe carboxylique ou d'un thio-analogue, ou d'une de leurs dérivés, p. ex. acides hydroxycarboxyliques
A01G 7/06 - Traitement des arbres ou des plantes en cours de croissance, p. ex. pour prévenir la décomposition du bois, pour teinter les fleurs ou le bois, pour prolonger la vie des plantes
A01N 37/42 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un halogène, p. ex. acides carboxyliques contenant dans le même squelette carboné un groupe carboxylique ou un thio-analogue, ou un de leurs dérivés, et un atome de carbone ne comportant que deux liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p. ex. acides cétocarboxyliques
A01P 21/00 - Régulateurs de croissance des végétaux
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part positioned on a surface of the electrical wiring part and including a support substrate and an optical waveguide such that the optical wiring part has a component region configured to position a component on the optical wiring part and the optical waveguide includes a core part and a cladding part. The support substrate in the optical wiring part has a thermal expansion coefficient lower than a thermal expansion coefficient of the optical waveguide and includes a conductor region and a non-conductor region such that the optical waveguide is formed on a surface of the support substrate in the non-conductor region and the optical wiring part includes one or more penetrating conductors penetrating through the support substrate in the conductor region.
A printed wiring board includes an uppermost conductor layer having an electrode that mounts an electronic component, an upper build-up part including conductor layers and resin insulating layers such that the uppermost conductor layer is formed on the upper build-up part, and a lower build-up part including conductor layers and resin insulating layers and formed such that the lower build-up part is formed below the upper build-up part. The upper build-up part is formed such that each of the conductor layers includes a seed layer formed by sputtering, and an electrolytic plating layer formed below the seed layer, and the lower build-up part is formed such that each of the conductor layers includes a seed layer formed by electroless plating, and an electrolytic plating layer formed below the seed layer.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.
[Problem] To provide a wiring board having a novel configuration. [Solution] A wiring board 10 has a substrate 20 having a conductor layer 26, and has disposed on the substrate 20: an optical element region 30; and a plurality of optical waveguides 40 each having lower cladding 41, a core 42, and upper cladding 43. The optical element region 30 includes an electric connection material 50 for electrically connecting the conductor layer 26 and the optical element region 30. The optical waveguides 40 are arranged and have the cores 42, which are optically coupled to the optical element region 30, exposed therefrom.
G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
A coil substrate includes a flexible substrate including a first substrate and a second substrate extending from the first substrate, and coils formed on the flexible substrate. The coils are positioned substantially in a row and include an m-th coil, an (m+1)-th coil, an (m+2)-th coil, an (m+3)-th coil, and an (m+4)-th coil. The (m+1)-th coil is positioned next to the m-th coil, the (m+2)-th coil is positioned next to the (m+1)-th coil, the (m+3)-th coil is positioned next to the (m+2)-th coil, the (m+4)-th coil is positioned next to the (m+3)-th coil, the m-th coil, the (m+1)-th coil, and the (m+2)-th coil partially overlap, and the m-th coil and the (m+4)-th coil do not overlap, where m is a natural number.
Provided is a battery pack capable of preventing a chain of thermal runaway caused by a high-temperature gas generated from an abnormal battery cell during thermal runaway. This battery pack comprises a module that has a plurality of battery cells each provided with a safety valve, a case that accommodates the module, and a heat insulating material that is provided between the module and the case, the battery pack being characterized in that: the heat insulating material includes a first heat insulating sheet, and a second heat insulating sheet laminated on the first heat insulating sheet; the heat insulating material is disposed such that the first heat insulating sheet is positioned on the module side and the second heat insulating sheet is positioned on the case side; a plurality of openings penetrating the second heat insulating sheet are formed in the second heat insulating sheet; the plurality of openings each have a covering piece that covers at least a portion of the opening; the covering pieces are bonded to the first heat insulating sheet and/or the second heat insulating sheet by an adhesive layer; and when the second heat insulating sheet is seen in a perspective plan view, one of the openings is positioned so as to overlap at least a portion of one of the safety valves.
Provided is a battery pack in which the chain of thermal runaway due to high-temperature gas from an abnormal battery cell generated during a thermal runaway can be prevented. The battery pack according to the present invention comprises: a module having a plurality of battery cells each provided with a safety valve; a case accommodating the module; and a heat insulating material provided between the module and the case. The battery pack is characterized in that: the heat insulating material includes a first heat insulating sheet; the first heat insulating sheet has a plurality of openings formed through the first heat insulating sheet; a cover piece is disposed at each of the plurality of openings, the cover piece covering at least a part of the opening; the cover piece is bonded to the first heat insulating sheet by an adhesive; and when the first heat insulating sheet is viewed in a planar transparent view, one of the openings is positioned so as to overlap at least a part of one of the safety valves.
A method for producing a heat transfer suppression sheet contains processing a mixture containing an inorganic particle, a binder fiber having a core-sheath structure, and a hot melt powder into a sheet. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion and a melting point of a third organic material constituting the hot melt powder.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/213 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules ayant une section transversale courbée, p. ex. ronde ou elliptique
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
This mat material comprises: a laminated mat in which a plurality of mats including inorganic fibers and each having a rectangular shape in a plan view are laminated; and a fixing member for fixing the laminated mat. The mat material is characterized in that: the plurality of mats include a first mat and a second mat; and, regarding a sagging amount measured through a sagging test by laminating and fixing two mats of the same type, the sagging amount of the first mat is larger than the sagging amount of the second mat, and the sagging amount of the mat material measured with the second mat below and the first mat up is 60 mm or less.
B32B 5/06 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments caractérisés par une couche fibreuse imbriquée ou cousue avec une autre couche, p. ex. de fibres, de papier
B32B 5/26 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse un autre couche également étant fibreuse ou filamenteuse
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
0
A mat material including: inorganic fibers; and multiple entanglement points formed by needling at least one of a front surface or a back surface of the mat material, wherein a density p of the entanglement points is in a range of 0.5 pcs/cm2≤ρ<18 pcs/cm2, at least one of a 4 mm×4 mm first region without the entanglement points or a 3 mm×8 mm second region without the entanglement points is arranged in a 25 mm×25 mm region, and the mat material contains an inorganic binder and has a shear modulus of 0.20 or more and a post-firing surface pressure of 50 kPa or more.
D04H 1/488 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles les voiles ou couches étant renforcées par des moyens mécaniques, p. ex. par roulage par aiguilletage ou opérations similaires pour provoquer l'enchevêtrement des fibres en combinaison avec au moins une autre méthode de consolidation en combinaison avec des agents de liage
D04H 1/587 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles par application, incorporation ou activation de liages chimiques ou thermoplastiques, p. ex. adhésifs caractérisé par les agents de liage utilisés
An electronic component mounting substrate includes an electronic component, a printed wiring board that mounts the electronic component thereon, and a cover that accommodates and seals the electronic component mounted on the printed wiring board. The cover has an upper portion and a support portion supporting the upper portion such that the upper portion has a thickness of 2 mm or more, and the printed wiring board includes an upper build-up part and a lower build-up part such that the upper build-up part mounts the electronic component thereon and includes an uppermost resin insulating layer not containing a reinforcing material and that the lower build-up part includes a lowermost resin insulating layer including a reinforcing material.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/367 - Refroidissement facilité par la forme du dispositif
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
The purpose of the present invention is to provide a sustained release plant activator from which an appropriate elution amount of an active component is eluted. This plant activator contains plant charcoal and at least one compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof. The compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof, is held in the plant charcoal. This plant activator contains a particle-like carbide, a binder resin, and at least one compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof. The compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof, is held in the particle-like carbide.
A01N 37/36 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un halogène, p. ex. acides carboxyliques contenant au moins un groupe carboxylique ou un thio-analogue, ou d'un de leurs dérivés, et un atome d'oxygène ou de soufre lié par une liaison simple, liés au même squelette carboné, cet atome d'oxygène ou de soufre ne faisant pas partie d'un groupe carboxylique ou d'un thio-analogue, ou d'une de leurs dérivés, p. ex. acides hydroxycarboxyliques
A01G 7/06 - Traitement des arbres ou des plantes en cours de croissance, p. ex. pour prévenir la décomposition du bois, pour teinter les fleurs ou le bois, pour prolonger la vie des plantes
A01N 25/08 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, caractérisés par leurs formes, ingrédients inactifs ou modes d'applicationSubstances réduisant les effets nocifs des ingrédients actifs vis-à-vis d'organismes autres que les animaux nuisibles contenant des solides comme supports ou diluants
A01N 37/42 - Biocides, produits repoussant ou attirant les animaux nuisibles, ou régulateurs de croissance des végétaux, contenant des composés organiques comportant un atome de carbone possédant trois liaisons à des hétéro-atomes, avec au plus deux liaisons à un halogène, p. ex. acides carboxyliques contenant dans le même squelette carboné un groupe carboxylique ou un thio-analogue, ou un de leurs dérivés, et un atome de carbone ne comportant que deux liaisons à des hétéro-atomes, avec au plus une liaison à un halogène, p. ex. acides cétocarboxyliques
A01P 21/00 - Régulateurs de croissance des végétaux
A heat transfer suppression sheet contains a first inorganic fiber having a glass transition point of 800° C. or lower and/or a first inorganic particle having a glass transition point of 800° C. or lower; a second inorganic fiber having a glass transition point of 1000° C. or higher; a second inorganic particle having a glass transition point of 1000° C. or higher; and an organic binder.
A method for producing a heat transfer suppression sheet contains processing a mixture into a sheet by a dry method, the mixture containing an inorganic particle and a binder fiber having a core-sheath structure. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion.
A wiring substrate includes a first build-up part including a first conductor layer, a first insulating layer, and first via conductors penetrating through the first insulating layer, a second build-up part including second conductor layers, second insulating layers, and second via conductors penetrating though the second insulating layers, a third build-up part including a third conductor layer, a third insulating layer, and third via conductors penetrating through the third insulating layers such that the second built-up part is formed between the first built-up part and the third build-up part. The first, second and third build-up parts are formed such that a diameter of each of the first via conductors is smaller than a diameter of each of the second via conductors and that the diameter of each of the second via conductors is smaller than a diameter of each of the third via conductors.
A heat insulation sheet contains a first inorganic particle, a second inorganic particle composed of a nanoparticle, and an inorganic fiber. A total content of the first inorganic particle and the second inorganic particle is 30 mass % or more and 90 mass % or less with respect to a total mass of the heat insulation sheet, D50 is 1 μm or more and 100 μm or less, and a ratio (D90/D10) is 10 or more and 1000 or less in a volume-based cumulative distribution of the first inorganic particle.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p. ex. rapports, tailles ou concentrations
A heat transfer suppression sheet contains inorganic particles, and an organic fiber. At least a part of the organic fiber has a branched structure containing a base portion and branch portions extending from the base portion in at least three directions. The base portion may be a fused portion in which a plurality of the organic fibers are fused with each other. The heat transfer suppression sheet may have a plurality of empty holes.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p. ex. rapports, tailles ou concentrations
H01M 10/6555 - Barres ou plaques disposées entre les éléments
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer and including organic material, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the adhesive layer on the conductor layer formed on the insulating layer. The resin insulating layer includes resin and inorganic particles dispersed in the resin, and the adhesive layer has a smooth film part and a protruding part including protrusions protruding from the smooth film part such that a number of the inorganic particles in spaces between the protrusions with respect to a predetermined area is smaller than a number of the inorganic particles outside the spaces between the protrusions with respect to the predetermined area.
Provided is a battery pack with a mica plate that is resistant to damage and is lightweight. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case for accommodating the module, and a mica plate disposed between the module and the case and having a first main surface and a second main surface facing the first main surface, characterized in that: the battery pack further includes a fixing member for fixing the mica plate; the mica plate has a first fixing member hole part formed therein penetrating from the first main surface to the second main surface; the module and/or the case has a second fixing member hole part formed therein; the fixing member includes a head part and a body part connected to the head part; the fixing member fixes the mica plate with the body part passing through the first fixing member hole part and inserted into the second fixing member hole part; in a planar transparent view of the mica plate, the head part covers at least a part of the contour of the first fixing member hole part and overlaps the mica plate; and an area S1 of the portion where the head part and the mica plate overlap is 5.8 × 10-6 times or more of an area S2 of the mica plate.
H01M 50/271 - Couvercles des boîtiers secondaires, des bâtis ou des blocs
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
Provided is a battery pack comprising a lightweight mica plate that is unlikely to be broken. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case accommodating the module, and a mica plate disposed between the module and the case and having a first main surface and a second main surface facing the first main surface. The battery pack is characterized by further including a fixing member for fixing the mica plate and by that a first hole for the fixing member that penetrates from the first main surface to the second main surface is formed in the mica plate, a connection member having a second hole for the fixing member is provided in the module and/or the case, the fixing member has a head part and a body part connected to the head part, the head part of the fixing member is positioned on the first main surface side of the mica plate, the body part of the fixing member passes through the first hole for the fixing member and is inserted into the second hole for the fixing member to fix the mica plate, the head part covers at least a part of the contour of the first hole for the fixing member and overlaps with the mica plate when the mica plate is viewed in a plan view, and the area S1 of the portion where the head part and the mica plate overlap is 5.8 × 10-6 times or more of the area S2 of the mica plate.
H01M 50/271 - Couvercles des boîtiers secondaires, des bâtis ou des blocs
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
Provided is a battery pack with a mica plate which is resistant to damage and is lightweight. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case that houses the module, and a mica plate that is disposed between the module and the case and has a first main surface and a second main surface facing the first main surface, the battery pack being characterized in that: the battery pack further includes an adhesive member that is disposed on a surface of the mica plate and fixes the mica plate; and, in a planar view of the mica plate, an area S1 of the adhesive member is 5.8 × 10-6 times or more of an area S2 of the mica plate.
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 10/647 - Éléments prismatiques ou plans, p. ex. éléments de type poche
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
An inorganic fiber mat is produced by a method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat, a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated 10 inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/70 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p. ex. par la réorientation des fibres
D04H 1/46 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes à partir de voiles ou couches composés de fibres ne possédant pas des propriétés cohésives réelles ou potentielles les voiles ou couches étant renforcées par des moyens mécaniques, p. ex. par roulage par aiguilletage ou opérations similaires pour provoquer l'enchevêtrement des fibres
D21B 1/12 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par procédés humidesMatières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par l'emploi de vapeur
D21B 1/32 - Triturage par d'autres moyens de vieux papiers
Provided is a composite member which exhibits excellent heat resistance in addition to excellent insulating properties, which does not require a winding operation that is necessary in the case of a ceramic tape, which does not have problems such as uneven winding, gap generation, and separation, and which can be easily suited to a conductive base material that has a complicated shape. This composite member (1) has a base material (2), and an insulating coating film (3) that covers at least a part of the surface of the base material (2) and has a film thickness of 150 μm or more. The insulating coating film (3) has a matrix (10) that contains a compound having a siloxane bond, and an inorganic material (20) that is dispersed in the matrix (10). If a cross-section of the insulating coating film (3), the cross-section being parallel to the film thickness direction, is observed, the ratio (P1/P2) of the porosity P1 in a region R1 in the range from the interface with the base material (2) to 100 μm to the porosity P2 in a region R2 in the range from the surface of the insulating coating film (3) to 100 μm is 0.3 to 3.0 inclusive. The regions R1 and R2 are each 75 μm in the film thickness direction and 300 μm in a direction that is orthogonal to the film thickness.
H01B 3/00 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
To provide a method for producing a composite member, with which it is possible to easily form an insulating film having sufficient strength for a base material of a complex shape, tightly adhering to a base material without peeling even when heated at a high temperature, and having excellent insulation property and heat resistance, without needing to wrap a tape or the like and without problems such as uneven winding, gaps, or peeling. A method for producing a composite member (1) having a base material (2) and an insulating film (3) that covers at least a part of the surface of the base material (2), the method comprising: a coating step for applying a first coating material containing a material of a matrix (10) containing a compound having a siloxane bond, and an inorganic material (20) to at least a part of the surface of the base material (2); and a first coating material curing step for curing the first coating material. An insulating film containing a first layer (11) and a second layer (12) is formed by repeating at least the coating step multiple times.
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
B05D 1/18 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par immersion
B05D 1/36 - Applications successives de liquides ou d'autres matériaux fluides, p. ex. sans traitement intermédiaire
B05D 7/00 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers
C09D 5/25 - Peintures ou laques électriquement isolantes
C09D 7/61 - Adjuvants non macromoléculaires inorganiques
H01B 3/46 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques matières plastiquesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques résinesIsolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques composés principalement de substances organiques cires silicones
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
The present invention provides a composite member which is excellent in terms of heat resistance, and is particularly excellent in terms of insulation properties, and which does not require winding work that is necessary for a ceramic tape and can be easily suited to a complicated shape without causing winding unevenness or a gap. This composite member is able to maintain excellent insulation properties and excellent heat resistance even if heated at high temperatures. This composite member (1) has a base material (2) and an insulating coating film (3) that covers at least a part of the surface of the base material (2). The insulating coating film (3) is obtained by alternately stacking a plurality of first coating films (11) and a plurality of second coating films (12) in this order from the base material (2) side. The first coating films (11) each have a matrix (10) that contains a compound having a siloxane bond, and an inorganic material (20) that is dispersed in the matrix (10). The second coating films are formed of the material of the matrix (10).
H01B 3/00 - Isolateurs ou corps isolants caractérisés par le matériau isolantEmploi de matériaux spécifiés pour leurs propriétés isolantes ou diélectriques
H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
Provided is a composite member which does not require winding work, can easily handle complex shapes, can suppress the occurrence of burning and peeling of an insulating film even when heated at high temperatures, and can maintain excellent insulation and heat resistance. A composite member (1) has a metal base material (2) and an insulating coating (3) that covers at least a portion of the surface of the base material (2). The insulating coating (3) has: a matrix (10) containing a compound with a siloxane bond; and an inorganic material (20) dispersed in the matrix. At normal temperature, the base material (2) and the insulation coating (3) are in contact with each other. When heated to a temperature equal to or higher than the oxidation initiation temperature of the metal constituting the base material (2), an adhesive layer (8) is formed between the base material (2) and the insulation coating (3). The adhesive layer (8) has a metal element included in the base material (2), a metal oxide of a metal element, an inorganic material (20), and at least one selected from silicone and silica.
C23C 26/00 - Revêtements non prévus par les groupes
H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
H01M 50/526 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par le matériau ayant une structure en couches
H01R 4/58 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation caractérisées par la forme ou le matériau des organes de contact
In an optical waveguide (1) according to an embodiment, a lower cladding (21), a core (3), and an upper cladding (22) are stacked in this order, and a part of the core (3) on the side where an optical signal is incident and a part of the core (3) on the side where the optical signal is emitted are exposed. The optical waveguide (1) comprises an upper cladding non-formation region (1a) and an upper cladding formation region (1b). The upper cladding non-formation region (1a) has a core-exposed portion (3a) in which an upper surface (31) of the core (3) is exposed at at least one end (11) of the optical waveguide (1). The upper cladding formation region (1b) has a core-unexposed portion (3b) in which the upper surface (31) of the core (3) is not exposed. The width (W1) of the core (3) of the core-exposed portion (3a) and the width (W2) of the core (3) of the core-unexposed portion (3b) satisfy the relationship of W1 > W2.
Provided is a heat transfer suppression sheet that is capable of effectively suppressing heat transfer of high heat from a battery cell in which thermal runaway has occurred, and is excellent in adapting to battery cell expansion and contraction. Also provided is a highly safe battery pack comprising said heat transfer suppression sheet. In the heat transfer suppression sheet (1), an insulating layer (10) and heat conduction layers (30) are laminated with organic elastic layers (20) interposed therebetween. A heat transfer suppression sheet (60) with a pedestal is formed by providing, in an integrated manner on one surface or both surfaces of the heat transfer suppression sheet (1), a battery cell pedestal (70) made of an insulating material on which battery cells (40) are to be placed. In a battery pack (100), a plurality of battery cells (40) have the heat conduction layers (30) of the heat transfer suppression sheet (1) interposed therebetween so at to be in contact with main surfaces of the battery cells (40), and the battery cells (40) are connected in series or in parallel. In the battery pack (100), the battery cells (40) are placed on the battery cell pedestal (70) of the heat transfer suppression sheet (60) with a pedestal.
Provided is a heat transfer suppression sheet capable of maintaining a heat transfer suppression effect even when a resin substrate is burned out by high heat or flame from a battery cell-caused thermal runaway. Also, provided is a battery pack having higher safety, capable of maintaining a heat transfer suppression effect even when a resin substrate is burned out by high heat or flame from a thermal runaway battery cell. A heat transfer suppression sheet (1) includes a resin substrate (10), first inorganic particles (20), and second inorganic particles (30) having a melting point lower than that of the first inorganic particles (20). A heat transfer suppression member (60) has a heat insulation layer (50) on the surface of the heat transfer suppression sheet (1). A battery pack (100) comprises the heat transfer suppression sheet (1) or the heat transfer suppression member (60) interposed between battery cells (110), wherein the battery cells (110) are connected in series or in parallel.
A wiring substrate includes an insulating layer having through holes, a first conductor layer, a second conductor layer, interlayer conductors formed in the through holes. The interlayer conductors are connecting the first and second conductor layers and include first interlayer conductors formed in first region of the insulating layer and second interlayer conductors formed in second region of the insulating layer at density higher than density of the first interlayer conductors formed in the first region. A thickness of each first interlayer conductor is larger than a thickness of each second interlayer conductor. The insulating layer is formed such that the through holes includes first through holes having the first interlayer conductors formed therein and second through holes having the second interlayer conductors formed therein and that an inner diameter of each of the first through holes is larger than an inner diameter of each of the second through holes.
A printed wiring board includes an uppermost resin insulating layer, an uppermost conductor layer, a solder resist layer, a dam conductor connected to the upper most conductor layer, and a metal dam formed on and connected to the dam conductor. The uppermost conductor layer includes electrodes and a conductor circuit that are positioned to mount an electronic component in a mounting area in the solder resist layer. The metal dam is surrounding the mounting area. The solder resist layer has first openings reaching to the electrodes of the uppermost conductor layer and a second opening reaching to the conductor circuit of the uppermost conductor layer. The dam conductor is formed in the second opening of the solder resist layer. The conductor circuit in the uppermost conductor layer is a ground circuit or power supply circuit such that the conductor circuit is connected to the metal dam via the dam conductor.
Provided is a flameproof sheet composed of a combination of a heat insulating material and an elastic body, in which there is no problem of powder falling from the heat insulating material, the elastic body is hardly broken, a hole is hardly opened, and the elastic body can be made thin. The flameproof sheet (1) has a heat insulating sheet (50), and an elastic coating (60) comprising a foam of a thermosetting resin. The elastic coating (60) covers the entire heat insulating sheet (50) without having a joint part.
B32B 5/18 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches contient un matériau sous forme de mousse ou essentiellement poreux
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
A heat transfer suppression sheet contains a first organic fiber having no glass transition point at a temperature lower than 120° C., a first inorganic particle, and a resin binder. The first organic fiber may be a crystalline organic fiber having a glass transition point of 120° C. or higher and/or an organic fiber having no glass transition point.
H01M 50/24 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p. ex. dimensions adaptés pour protéger les batteries de leur environnement, p. ex. de la corrosion
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
A heat transfer suppression sheet contains a fiber component and a particle component. A main component of a first inorganic fiber contained in the fiber component is the same kind as a main component of a first inorganic particle contained in the particle component, and a content of the main component of the first inorganic particle is larger than a content of the main component of the first inorganic fiber.
H01M 10/651 - Moyens de commande de la température associés de façon structurelle avec les éléments caractérisés par des paramètres spécifiés par une valeur numérique ou une formule mathématique, p. ex. rapports, tailles ou concentrations
77.
PLATE-SHAPED HEAT INSULATOR, COMBUSTION CHAMBER, BOILER AND WATER HEATER
A plate-shaped heat insulator including a plate-shaped papermaking product containing inorganic fibers, and one or more grooves in at least one of its surfaces. The plate-shaped heat insulator is intended to be disposed in a combustion chamber.
F23M 5/02 - ArmaturesEnveloppesParois caractérisées par la forme des briques ou des blocs utilisés
F22B 21/34 - Chaudières à tubes d'eau du type vertical ou semi-vertical, c.-à-d. où les faisceaux de tubes d'eau sont disposés verticalement ou pratiquement à la verticale composées de tubes d'eau groupés en forme d'écrans entourant la chambre de combustion, c.-à-d. chaudières à rayonnement
F24H 1/00 - Appareils de chauffage de l’eau, p. ex. chauffe-eau, chauffe-eau instantanés en continu ou chauffe-eau à accumulation
F24H 9/02 - EnveloppesCouvercles de protectionPanneaux décoratifs
A heat transfer suppression sheet contains an inorganic particle uniformly dispersed, a first inorganic fiber uniformly dispersed and oriented in one direction parallel to a main surface of the sheet, and a second inorganic fiber intertwined with the first inorganic fiber to form a three-dimensional web structure. The first inorganic fiber may have an average fiber diameter larger than an average fiber diameter of the second inorganic fiber.
A heat transfer suppression sheet contains a first inorganic particle, a resin binder; and an organic fiber, in which the organic fiber has a glass transition point higher than a glass transition point of the resin binder. At least a part of the organic fiber may be fused each other to form a three-dimensional framework.
A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer includes resin and inorganic particles including first particles and second particles such that the first particles have flat exposed portions, the second particles are embedded in the resin, and the surface of the resin insulating layer includes the resin and the flat exposed portions of the first particles.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A battery protection sheet contains a papermaking sheet layer containing a first inorganic fiber; and a cross layer made of a second inorganic fiber. The first inorganic fiber may have an average fiber length of 0.5 mm to 10 mm, the papermaking sheet layer may further contain an inorganic particle, the papermaking sheet layer may further contain a binding material.
H01M 50/242 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p. ex. dimensions adaptés pour protéger les batteries contre les vibrations, les collisions ou le gonflement
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor, a resin insulating layer having an opening extending through the resin insulating layer, a conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor formed in the opening such that the via conductor electrically connects to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The resin insulating layer includes resin and inorganic particles including first and second particles such that the first particles are partially embedded in the resin and that the second particles are embedded in the resin, the first particles have first portions protruding from the resin and second portions embedded in the resin respectively, the surface includes the resin and exposed surfaces of the first portions exposed from the resin.
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
H05K 3/26 - Nettoyage ou polissage du parcours conducteur
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
Provided are: a heat transfer suppression member capable of suppressing destruction of a battery case and deterioration of battery performance due to deformation of battery cells while ensuring an interval between the battery cells, and capable of suppressing propagation of heat between the battery cells at the time of abnormality; and a battery pack capable of suppressing destruction of the battery case and deterioration of battery performance while suppressing propagation of heat between the battery cells. The heat transfer suppression member (50) has: a frame body (53) that surrounds the outer periphery in a plan view; and a sheet-like heat insulation material (10) that is disposed inside the frame body (53) and is provided with a pair of main surfaces (10s). In a cross-sectional view orthogonal to the plan view of the heat transfer suppression member (50), the thickness of the heat insulation material (10) is thinner than the thickness of the frame body (53).
H01M 50/291 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par leur forme
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
Provided are: a heat transfer suppression sheet capable of further suppressing propagation of heat between battery cells when an abnormality occurs and capable of suppressing destruction of a battery case and reduction in battery performance due to deformation of a battery cell; and a battery pack that can be easily designed and assembled and that is capable of suppressing the destruction of the battery case and the reduction in the battery performance while suppressing the propagation of heat between the battery cells. A heat transfer suppression sheet (50) has: a heat insulating material (10) that has inorganic particles (4) and organic fibers (1) or inorganic fibers (15); and an elastic sheet (51) laminated on at least one of a first surface (10a) and a second surface (10b), which are orthogonal to the thickness direction of the heat insulating material (10). A battery pack (100) includes: a plurality of battery cells (20a, 20b, 20c); and the heat transfer suppression sheet (50). The plurality of battery cells (20a, 20b, 20c) are connected in series or in parallel.
H01M 10/658 - Moyens de commande de la température associés de façon structurelle avec les éléments par isolation ou protection thermique
F16L 59/02 - Forme ou configuration de matériaux isolants, avec ou sans revêtement formant un tout avec les matériaux isolants
H01M 10/613 - Refroidissement ou maintien du froid
H01M 50/202 - Boîtiers ou cadres autour du boîtier primaire d’une seule cellule ou d’une seule batterie
H01M 50/293 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par des éléments d’espacement ou des moyens de positionnement dans les racks, les cadres ou les blocs caractérisés par le matériau
An inorganic fiber mat includes inorganic fibers, a particle obtained by firing an inorganic binder, and a mixture of an unfired inorganic binder and an organic binder.
D04H 1/72 - Non-tissés formés uniquement ou principalement de fibres coupées ou autres fibres similaires relativement courtes caractérisés par la méthode de formation des voiles ou couches, p. ex. par la réorientation des fibres les fibres étant disposées au hasard
D21B 1/12 - Matières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par procédés humidesMatières premières fibreuses ou leur traitement mécanique par division des matières premières en petites particules, p. ex. fibres par l'emploi de vapeur
86.
COMPOSITION, RAW MATERIAL COMPOSITION OF COSMETIC, VIRUS PROLIFERATION SUPPRESSING AGENT, USE OF COMPOSITION FOR SUPPRESSING VIRUS PROLIFERATION, METHOD FOR SUPPRESSING VIRUS PROLIFERATION, AND SEALED BODY
Provided is a 2,3-BDO composition capable of appropriately exhibiting an effect of suppressing virus proliferation. A composition according to the present invention contains at least (2R,3R)-2,3-butanediol and/or (2S,3S)-2,3-butanediol, and does not contain (meso)-2,3-butanediol.
Provided is a composition capable of appropriately exhibiting an virus proliferation inhibition effect. This composition is characterized by containing at least (2R,3R)-2,3-butanediol and/or (2S,3S)-2,3-butanediol and (meso)-2,3-butanediol, wherein the weight-based proportion of the content of the (meso)-2,3-butanediol is not more than twice the total content of the (2R,3R)-2,3-butanediol and the (2S,3S)-2,3-butanediol.
A printed wiring board includes a first insulating layer, a connection conductor having a connection wiring, a second insulating layer formed on the connection conductor layer, a mounting conductor layer including a first electrode that mounts a first electronic component and a second electrode that mounts a second electronic component, and connection via conductors including a first connection via conductor that electrically connects the first electrode and the connection wiring and a second connection via conductor that electrically connects the second electrode and the connection wiring. The first insulating layer includes resin and inorganic particles including first particles and second particles such that each first particle has a first portion protruding from the resin and a second portion embedded in the resin, and the surface of the first insulating layer includes a surface of the resin and exposed surfaces of the first portions exposed from the surface of the resin.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
A printed wiring board includes a first insulating layer, a connection conductor layer including wiring, a second insulating layer covering the connection conductor layer, a conductor layer including first and second electrodes such that the first electrode mounts a first electronic component and the second electrode mounts a second electronic component, and via conductors including first and second via conductors. The first via conductor connects the first electrode and wiring. The second via conductor connects the second electrode and wiring. The conductor layer includes a seed layer and an electrolytic plating layer. The seed layer includes a first layer formed on the first insulating layer and a second layer formed on the first layer, a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer of the seed layer.
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
A coil substrate includes a flexible substrate, terminals formed on one side of the flexible substrate such that the terminals are positioned in a longitudinal direction of the flexible substrate, coils each comprising a first wiring formed on a first surface and a second wiring formed on a second surface on the opposite side with respect to the first surface, and connection wirings formed on the flexible substrate such that the connection wirings include wirings connecting the terminals and the coils respectively and wirings connecting two of the coils respectively and that the connection wirings extend obliquely with respect to the longitudinal direction of the flexible substrate. The coil substrate is wound along the longitudinal direction of the flexible substrate around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the coil substrate is formed into a cylindrical shape.
H02K 3/04 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre
H02K 5/22 - Parties auxiliaires des enveloppes non couvertes par les groupes , p. ex. façonnées pour former des boîtes à connexions ou à bornes
H02K 7/00 - Dispositions pour la mise en œuvre d'énergie mécanique associées structurellement aux machines dynamo-électriques, p. ex. association structurelle avec des moteurs mécaniques d'entraînement ou des machines dynamo-électriques auxiliaires
[Problem] The objective of the present invention is to reduce the stray capacitance that is generated between a side surface of a land and a side surface of a solid pattern. [Solution] A wiring board according to the present disclosure comprises a first conductive layer, an insulating layer that covers the first conductive layer, a second conductive layer that is formed on the insulating layer, and a via conductor that penetrates the insulating layer and connects the first conductive layer and the second conductive layer to each other. The first conductive layer is provided with a pad that is connected to the via conductor, and a solid pattern that has an opening in which the pad is contained. A gap is provided between the side surface of the pad and the insulating layer, or between the inner surface of the opening of the solid pattern and the insulating layer.
A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 3/16 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la vaporisation pour appliquer le matériau conducteur par pulvérisation cathodique
93.
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Provided are a coil substrate capable of reducing the influence of wiring resistance and eddy current, a coil substrate for a motor, and a motor. A coil substrate according to an embodiment includes a resin substrate having a first surface and a second surface, and coil wiring formed on the first surface and the second surface of the resin substrate. The coil wiring comprises a first conductor layer and an additional plating layer. The first conductor layer comprises a metal foil layer, a chemical plating layer formed on the metal foil layer, and an electrolytic plating layer formed on the chemical plating layer. The cross-sectional shape of the first conductor layer is a substantially trapezoidal shape having a lower base facing the resin substrate and an upper base opposite the lower base. The additional plating layer covers an upper surface and a side surface of the first conductor layer.
H01F 5/04 - Dispositions des connexions électriques aux bobines, p. ex. fils de connexion
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
Provided are a coil substrate capable of reducing the influence of wiring resistance and eddy current, a coil substrate for a motor, and a motor. A coil substrate according to an embodiment includes a resin substrate having a first surface and a second surface, and coil wiring formed on the first surface and the second surface of the resin substrate. The coil wiring is composed of a first conductor layer and an additional plating layer. The first conductor layer is composed of a metal foil layer, a chemical plating layer formed on the metal foil layer, and an electrolytic plating layer formed on the chemical plating layer. The additional plating layer covers an upper surface and a side surface of the first conductor layer. The cross-sectional shape of a side-surface part of the additional plating layer that covers the side surface of the first conductor layer does not follow the cross-sectional shape of the side surface of the first conductor layer.
H01F 5/04 - Dispositions des connexions électriques aux bobines, p. ex. fils de connexion
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre constitués par des conducteurs imprimés
H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
The present invention keeps the intense heat from a battery cell that has undergone thermal runaway from being transmitted via a cooling plate. The present invention also provides a high-safety battery pack that keeps the intense heat from a battery cell that has undergone thermal runaway from being transmitted via a cooling plate. A battery cell pedestal (3) is to be interposed between a cooling plate (1) and a battery cell (20) and comprises a thermal expansion material. A battery pack (100) comprises a plurality of battery cells (20) that are installed on battery cell pedestals (3), the battery cells (20) being connected to each other in series or in parallel.
H01M 50/204 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules
H01M 50/249 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports spécialement adaptés aux aéronefs ou aux véhicules, p. ex. aux automobiles ou aux trains
96.
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A printed wiring board includes an insulating layer, and a conductor layer formed on the insulating layer and having degas holes formed such that the degas holes are penetrating through the conductor layer and exposing portions of the insulating layer. The conductor layer is formed such that each of the degas holes is a polygon shape having at least one inner angle of 100 degrees or more.
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, and coils including first wirings and second wirings such that the first wirings are formed on the first surface of the flexible substrate and that the second wirings are formed on the second surface of the flexible substrate. The flexible substrate has one or more recesses formed on one or more longitudinal sides of the flexible substrate and is formed to be wound in a circumferential direction around an axis extending in the width direction of the flexible substrate orthogonal to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A coil substrate includes a flexible substrate and coils including first wirings and second wirings. The first wirings are formed on a first surface of the substrate. The second wirings are formed on a second surface of the substrate. The flexible substrate has a first end in a longitudinal direction of the substrate and is wound from the first end in a circumferential direction around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the substrate is formed into a cylindrical shape, the first surface of the substrate is positioned on an inner circumferential side of the cylindrical shape, and the second surface of the substrate is positioned on an outer circumferential side of the cylindrical shape, and the substrate has a first region adjacent to the first end such that the first region includes the second wirings and does not include the first wirings.
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre constitués par des conducteurs imprimés
A motor coil substrate includes a coil substrate including a flexible substrate and coils such that the coils include first wirings formed on a first surface of the flexible substrate and second wirings formed on a second surface of the flexible substrate on the opposite side. The coil substrate is wound N turns where N is an integer of 2 or more in a circumferential direction such that the first surface of the flexible substrate is positioned on an inner circumferential side of the coil substrate, the second surface of the flexible substrate is positioned on an outer circumferential side of the coil substrate, and a gap is formed between an M-th layer where M is an integer equal to or larger than 1 and less than N and an (M+1)-th layer from an inner side of N circumferential layers formed by winding the coil substrate N turns.
H02K 3/28 - Schémas d'enroulements ou de connexions entre enroulements
H02K 3/26 - Enroulements caractérisés par la configuration, la forme ou le genre de construction du conducteur, p. ex. avec des conducteurs en barre constitués par des conducteurs imprimés
100.
PAPERMAKING MAT AND METHOD FOR MANUFACTURING PAPERMAKING MAT
Provided is a papermaking mat which has a high initial surface pressure and can maintain a surface pressure even when subjected to repeated compression. This papermaking mat is composed of inorganic fibers, and characterized in that the inorganic fibers include alumina fibers (AF) and refractory ceramic fibers (RCF), and in that when 100 of the inorganic fibers are randomly extracted and it is determined whether the inorganic fibers are alumina fibers or refractory ceramic fibers, the number of alumina fibers is 30% or more and the number of refractory ceramic fibers is less than 70%.
D01F 9/08 - Filaments, ou similaires, faits par l’homme, formés d’autres substancesLeur fabricationAppareils spécialement adaptés à la fabrication de filaments de carbone de matière inorganique
D06M 11/45 - Oxydes ou hydroxydes d'éléments des groupes 3 ou 13 du tableau périodiqueAluminates
D06M 11/79 - Traitement des fibres, fils, filés, tissus ou des articles fibreux faits de ces matières, avec des substances inorganiques ou leurs complexesUn tel traitement combiné avec un traitement mécanique, p. ex. mercerisage avec du silicium ou ses composés avec du dioxyde de silicium, des acides siliciques ou leurs sels
D06M 15/233 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'hydrocarbures, ou de leurs produits de réaction, p. ex. posthalogénés ou sulfochlorés aromatiques, p. ex. de styrène
D06M 15/263 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'acides carboxyliques non saturésLeurs sels ou esters
D06M 15/333 - Composés macromoléculaires obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone d'alcools non saturés ou de leurs esters d'acétate de vinyleAlcool polyvinylique
D06M 15/693 - Traitement des fibres, fils, filés, tissus ou articles fibreux faits de ces matières, avec des composés macromoléculairesUn tel traitement combiné avec un traitement mécanique avec du caoutchouc naturel ou synthétique ou leurs dérivés
