A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape and that a cylindricity of an outer circumferential surface is greater than 0.0 mm and equal to or less than 0.3 mm.
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
(wherein, R1 is a straight or branched alkylene group with 6 to 12 carbon atoms, and optionally comprises one or more double bonds, R2 is an alkyl group with 2 to 8 carbon atoms, and optionally comprises one or more branches and/or double bonds) or a salt or an ester thereof.
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
A connection structure includes an electrical wiring part, an optical element having a light receiving or light emitting surface, and an optical waveguide including a core part, a first cladding layer in contact with a first surface of the core part, and a second cladding layer in contact with a second surface of the core part on the opposite side. The waveguide has a first end surface and a second end surface formed such that the core part and first cladding layer are substantially flush on the first end surface and the second cladding layer has the second end surface extending from the first end surface, the core part has a light transmitting surface that is exposed on the first end surface and faces the light receiving or light emitting surface of the optical element, and the optical element is positioned on the second end surface of the optical waveguide.
A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape, and the coils are formed such that a space factor of the coils in a cross section of the motor coil substrate is in a range of 50% to 99%.
A flameproof material contains a heat insulation material containing an inorganic fiber or an infusible fiber, and an inorganic fiber cloth. The heat insulation material and the inorganic fiber cloth are integrated to each other by physical means. The physical means may be at least one of needling, a resin staple, a resin tag pin, or thread sewing.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
D04H 1/413 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties containing granules other than absorbent substances
D04H 1/498 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres entanglement of layered webs
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
6.
HEAT TRANSFER SUPPRESSION SHEET, METHOD FOR PRODUCING SAME, AND BATTERY PACK
Provided is a heat transfer suppression sheet having desired strength and heat insulation properties and capable of flexibly adapting to various designs such as size and heat insulation properties. A heat transfer suppression sheet (50) is formed by coupling a plurality of pieces of heat insulation material (10) containing inorganic particles. The heat insulation material (10) has a pair of main surfaces (10a, 10b), and a connection surface (10c) that connects the pair of main surfaces (10a, 10b). The connection surfaces (10c) of the plurality of pieces of heat insulation material (10) are disposed facing each other, and a coupling surface (61) for coupling the pieces of heat insulation material (10) together is formed. In a cross-sectional view orthogonal to the pair of main surfaces (10a, 10b) and parallel to a direction in which the pieces of the heat insulation material (10) are adjacent to each other, the length of the coupling surface (61) is longer than the thickness of the heat insulation material (10) in a region in which the coupling surface (61) is formed.
An optical waveguide includes a core part, a first cladding layer formed on the core part such that the first cladding layer is in contact with a first surface of the core part, and a second cladding layer formed on the core part such that the second cladding layer is in contact with a second surface of the core part. The core part, first cladding layer and second cladding layer form an end portion of the optical waveguide such that the core part and first cladding layer form a first end surface of the optical waveguide on which the core part is exposed and the core part and the first cladding layer are flush with respect to each other, and a second end surface of the optical waveguide including a portion of the second cladding layer extending from the first end surface at the end portion of the optical waveguide.
A method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat, a firing step of firing the first inorganic fiber molding prepared in the preparing step, a defibrating step of defibrating the first inorganic fiber molding fired in the firing step to obtain defibrated inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
A penetration promoter for an organic substance for plants, containing at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof. An agricultural composition containing: (a) at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof; and (b) at least one organic substance for plants.
A wiring substrate includes a first wiring substrate including first insulating layers, first conductor layers, and first via conductors, and a second wiring substrate mounted on the first substrate and including second insulating layers, second conductor layers, and second via conductors. The second substrate is formed such that the minimum wiring width of wirings in the second conductor layers is smaller than the minimum wiring width of wirings in the first conductor layers, the minimum inter-wiring distance of the wirings in the second conductor layers is smaller than the minimum inter-wiring distance of the wirings in the first conductor layers, the wiring widths of the wirings in the second conductor layers are 3 μm or less, the inter-wiring distances of the wirings in the second conductor layer are 3 μm or less, and aspect ratio of the wirings in the second conductor layer is in range of 2.0 to 4.0.
Provided is a plant activator with which it is possible to safely, stably, and effectively promote an increase in fruiting by appropriately spraying the activator onto plants or using the same for irrigation. The plant activator contains: at least one compound selected from an oxo fatty acid or a derivative thereof or a salt thereof; and a terpene.
A component built-in wiring board includes a core substrate having an opening, electronic components positioned in the opening of the substrate such that the electronic components are spaced apart with respect to each other, a build-up part formed on the substrate such that the build-up part is covering the electronic components in the opening of the substrate, and a resin part formed in the opening of the substrate and including a first resin part and a second resin part such that the second resin part is connecting the electronic components in the opening of the substrate and the first resin part is filling a space formed between the core substrate and the second resin part in the opening of the 10 substrate. The second resin part of the resin part is connecting the electronic components having different heights such that terminal surfaces of the electronic components are flush with each other.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
13.
FLAMEPROOF SHEET, MANUFACTURING METHOD THEREFOR, AND BATTERY PACK
A flameproof sheet contains a flameproof material and an elastic member, and the flameproof material is laminated with the elastic member so that a joint surface of the flameproof material with the elastic member and a joint surface of the elastic member with the flameproof material are movable along the joint surface.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
B32B 7/08 - Interconnection of layers by mechanical means
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
B32B 25/10 - Layered products essentially comprising natural or synthetic rubber next to a fibrous or filamentary layer
14.
AGENT FOR INCREASING POLYPHENOL CONTENT IN LEAVES OF PLANT OF FAMILY THEACEAE, AND AGENT FOR INCREASING THEANINE CONTENT
Provided are an agent for increasing polyphenol content and an agent for increasing theanine content in leaves of a plant of the family Theaceae, these agents making it possible to safely increase the amount of polyphenols, such as catechins, and/or theanine contained in the tea tree by appropriately spraying or irrigating the plant without adversely affecting the biological tissue of the plant. The agent for increasing the polyphenol content and/or the theanine content in leaves of a plant of the family Theaceae contains at least one compound selected from the group consisting of oxo fatty acids or salts thereof and fatty acid hydroxides or salts thereof.
A01N 37/36 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids
A01G 7/06 - Treatment of growing trees or plants, e.g. for preventing decay of wood, for tingeing flowers or wood, for prolonging the life of plants
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part positioned on a surface of the electrical wiring part and including a support substrate and an optical waveguide such that the optical wiring part has a component region configured to position a component on the optical wiring part and the optical waveguide includes a core part and a cladding part. The support substrate in the optical wiring part has a thermal expansion coefficient lower than a thermal expansion coefficient of the optical waveguide and includes a conductor region and a non-conductor region such that the optical waveguide is formed on a surface of the support substrate in the non-conductor region and the optical wiring part includes one or more penetrating conductors penetrating through the support substrate in the conductor region.
A printed wiring board includes an uppermost conductor layer having an electrode that mounts an electronic component, an upper build-up part including conductor layers and resin insulating layers such that the uppermost conductor layer is formed on the upper build-up part, and a lower build-up part including conductor layers and resin insulating layers and formed such that the lower build-up part is formed below the upper build-up part. The upper build-up part is formed such that each of the conductor layers includes a seed layer formed by sputtering, and an electrolytic plating layer formed below the seed layer, and the lower build-up part is formed such that each of the conductor layers includes a seed layer formed by electroless plating, and an electrolytic plating layer formed below the seed layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.
[Problem] To provide a wiring board having a novel configuration. [Solution] A wiring board 10 has a substrate 20 having a conductor layer 26, and has disposed on the substrate 20: an optical element region 30; and a plurality of optical waveguides 40 each having lower cladding 41, a core 42, and upper cladding 43. The optical element region 30 includes an electric connection material 50 for electrically connecting the conductor layer 26 and the optical element region 30. The optical waveguides 40 are arranged and have the cores 42, which are optically coupled to the optical element region 30, exposed therefrom.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/42 - Coupling light guides with opto-electronic elements
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A coil substrate includes a flexible substrate including a first substrate and a second substrate extending from the first substrate, and coils formed on the flexible substrate. The coils are positioned substantially in a row and include an m-th coil, an (m+1)-th coil, an (m+2)-th coil, an (m+3)-th coil, and an (m+4)-th coil. The (m+1)-th coil is positioned next to the m-th coil, the (m+2)-th coil is positioned next to the (m+1)-th coil, the (m+3)-th coil is positioned next to the (m+2)-th coil, the (m+4)-th coil is positioned next to the (m+3)-th coil, the m-th coil, the (m+1)-th coil, and the (m+2)-th coil partially overlap, and the m-th coil and the (m+4)-th coil do not overlap, where m is a natural number.
Provided is a battery pack capable of preventing a chain of thermal runaway caused by a high-temperature gas generated from an abnormal battery cell during thermal runaway. This battery pack comprises a module that has a plurality of battery cells each provided with a safety valve, a case that accommodates the module, and a heat insulating material that is provided between the module and the case, the battery pack being characterized in that: the heat insulating material includes a first heat insulating sheet, and a second heat insulating sheet laminated on the first heat insulating sheet; the heat insulating material is disposed such that the first heat insulating sheet is positioned on the module side and the second heat insulating sheet is positioned on the case side; a plurality of openings penetrating the second heat insulating sheet are formed in the second heat insulating sheet; the plurality of openings each have a covering piece that covers at least a portion of the opening; the covering pieces are bonded to the first heat insulating sheet and/or the second heat insulating sheet by an adhesive layer; and when the second heat insulating sheet is seen in a perspective plan view, one of the openings is positioned so as to overlap at least a portion of one of the safety valves.
Provided is a battery pack in which the chain of thermal runaway due to high-temperature gas from an abnormal battery cell generated during a thermal runaway can be prevented. The battery pack according to the present invention comprises: a module having a plurality of battery cells each provided with a safety valve; a case accommodating the module; and a heat insulating material provided between the module and the case. The battery pack is characterized in that: the heat insulating material includes a first heat insulating sheet; the first heat insulating sheet has a plurality of openings formed through the first heat insulating sheet; a cover piece is disposed at each of the plurality of openings, the cover piece covering at least a part of the opening; the cover piece is bonded to the first heat insulating sheet by an adhesive; and when the first heat insulating sheet is viewed in a planar transparent view, one of the openings is positioned so as to overlap at least a part of one of the safety valves.
A method for producing a heat transfer suppression sheet contains processing a mixture containing an inorganic particle, a binder fiber having a core-sheath structure, and a hot melt powder into a sheet. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion and a melting point of a third organic material constituting the hot melt powder.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
This mat material comprises: a laminated mat in which a plurality of mats including inorganic fibers and each having a rectangular shape in a plan view are laminated; and a fixing member for fixing the laminated mat. The mat material is characterized in that: the plurality of mats include a first mat and a second mat; and, regarding a sagging amount measured through a sagging test by laminating and fixing two mats of the same type, the sagging amount of the first mat is larger than the sagging amount of the second mat, and the sagging amount of the mat material measured with the second mat below and the first mat up is 60 mm or less.
B32B 5/06 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by a fibrous layer needled to another layer, e.g. of fibres, of paper
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
0
A mat material including: inorganic fibers; and multiple entanglement points formed by needling at least one of a front surface or a back surface of the mat material, wherein a density p of the entanglement points is in a range of 0.5 pcs/cm2≤ρ<18 pcs/cm2, at least one of a 4 mm×4 mm first region without the entanglement points or a 3 mm×8 mm second region without the entanglement points is arranged in a 25 mm×25 mm region, and the mat material contains an inorganic binder and has a shear modulus of 0.20 or more and a post-firing surface pressure of 50 kPa or more.
D04H 1/488 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres in combination with at least one other method of consolidation in combination with bonding agents
D04H 1/587 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives characterised by the bonding agents used
An electronic component mounting substrate includes an electronic component, a printed wiring board that mounts the electronic component thereon, and a cover that accommodates and seals the electronic component mounted on the printed wiring board. The cover has an upper portion and a support portion supporting the upper portion such that the upper portion has a thickness of 2 mm or more, and the printed wiring board includes an upper build-up part and a lower build-up part such that the upper build-up part mounts the electronic component thereon and includes an uppermost resin insulating layer not containing a reinforcing material and that the lower build-up part includes a lowermost resin insulating layer including a reinforcing material.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
The purpose of the present invention is to provide a sustained release plant activator from which an appropriate elution amount of an active component is eluted. This plant activator contains plant charcoal and at least one compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof. The compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof, is held in the plant charcoal. This plant activator contains a particle-like carbide, a binder resin, and at least one compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof. The compound selected from oxo fatty acids, or derivatives thereof or salts thereof, and hydroxylated fatty acids, or derivatives thereof or salts thereof, is held in the particle-like carbide.
A01N 37/36 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids
A01G 7/06 - Treatment of growing trees or plants, e.g. for preventing decay of wood, for tingeing flowers or wood, for prolonging the life of plants
A01N 25/08 - Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of applicationSubstances for reducing the noxious effect of the active ingredients to organisms other than pests containing solids as carriers or diluents
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
A heat transfer suppression sheet contains a first inorganic fiber having a glass transition point of 800° C. or lower and/or a first inorganic particle having a glass transition point of 800° C. or lower; a second inorganic fiber having a glass transition point of 1000° C. or higher; a second inorganic particle having a glass transition point of 1000° C. or higher; and an organic binder.
A method for producing a heat transfer suppression sheet contains processing a mixture into a sheet by a dry method, the mixture containing an inorganic particle and a binder fiber having a core-sheath structure. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion.
A wiring substrate includes a first build-up part including a first conductor layer, a first insulating layer, and first via conductors penetrating through the first insulating layer, a second build-up part including second conductor layers, second insulating layers, and second via conductors penetrating though the second insulating layers, a third build-up part including a third conductor layer, a third insulating layer, and third via conductors penetrating through the third insulating layers such that the second built-up part is formed between the first built-up part and the third build-up part. The first, second and third build-up parts are formed such that a diameter of each of the first via conductors is smaller than a diameter of each of the second via conductors and that the diameter of each of the second via conductors is smaller than a diameter of each of the third via conductors.
A heat insulation sheet contains a first inorganic particle, a second inorganic particle composed of a nanoparticle, and an inorganic fiber. A total content of the first inorganic particle and the second inorganic particle is 30 mass % or more and 90 mass % or less with respect to a total mass of the heat insulation sheet, D50 is 1 μm or more and 100 μm or less, and a ratio (D90/D10) is 10 or more and 1000 or less in a volume-based cumulative distribution of the first inorganic particle.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
A heat transfer suppression sheet contains inorganic particles, and an organic fiber. At least a part of the organic fiber has a branched structure containing a base portion and branch portions extending from the base portion in at least three directions. The base portion may be a fused portion in which a plurality of the organic fibers are fused with each other. The heat transfer suppression sheet may have a plurality of empty holes.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
H01M 10/6555 - Rods or plates arranged between the cells
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer and including organic material, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the adhesive layer on the conductor layer formed on the insulating layer. The resin insulating layer includes resin and inorganic particles dispersed in the resin, and the adhesive layer has a smooth film part and a protruding part including protrusions protruding from the smooth film part such that a number of the inorganic particles in spaces between the protrusions with respect to a predetermined area is smaller than a number of the inorganic particles outside the spaces between the protrusions with respect to the predetermined area.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/07 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
34.
BATTERY PACK, STRUCTURE, AND METHOD FOR MANUFACTURING MICA PLATE
Provided is a battery pack with a mica plate that is resistant to damage and is lightweight. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case for accommodating the module, and a mica plate disposed between the module and the case and having a first main surface and a second main surface facing the first main surface, characterized in that: the battery pack further includes a fixing member for fixing the mica plate; the mica plate has a first fixing member hole part formed therein penetrating from the first main surface to the second main surface; the module and/or the case has a second fixing member hole part formed therein; the fixing member includes a head part and a body part connected to the head part; the fixing member fixes the mica plate with the body part passing through the first fixing member hole part and inserted into the second fixing member hole part; in a planar transparent view of the mica plate, the head part covers at least a part of the contour of the first fixing member hole part and overlaps the mica plate; and an area S1 of the portion where the head part and the mica plate overlap is 5.8 × 10-6 times or more of an area S2 of the mica plate.
Provided is a battery pack comprising a lightweight mica plate that is unlikely to be broken. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case accommodating the module, and a mica plate disposed between the module and the case and having a first main surface and a second main surface facing the first main surface. The battery pack is characterized by further including a fixing member for fixing the mica plate and by that a first hole for the fixing member that penetrates from the first main surface to the second main surface is formed in the mica plate, a connection member having a second hole for the fixing member is provided in the module and/or the case, the fixing member has a head part and a body part connected to the head part, the head part of the fixing member is positioned on the first main surface side of the mica plate, the body part of the fixing member passes through the first hole for the fixing member and is inserted into the second hole for the fixing member to fix the mica plate, the head part covers at least a part of the contour of the first hole for the fixing member and overlaps with the mica plate when the mica plate is viewed in a plan view, and the area S1 of the portion where the head part and the mica plate overlap is 5.8 × 10-6 times or more of the area S2 of the mica plate.
Provided is a battery pack with a mica plate which is resistant to damage and is lightweight. A battery pack according to the present invention comprises a module having a plurality of battery cells, a case that houses the module, and a mica plate that is disposed between the module and the case and has a first main surface and a second main surface facing the first main surface, the battery pack being characterized in that: the battery pack further includes an adhesive member that is disposed on a surface of the mica plate and fixes the mica plate; and, in a planar view of the mica plate, an area S1 of the adhesive member is 5.8 × 10-6 times or more of an area S2 of the mica plate.
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 10/647 - Prismatic or flat cells, e.g. pouch cells
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/209 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
H01M 50/291 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
An inorganic fiber mat is produced by a method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat, a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated 10 inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/70 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
D04H 1/46 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
D21B 1/32 - Defibrating by other means of waste paper
Provided is a composite member which exhibits excellent heat resistance in addition to excellent insulating properties, which does not require a winding operation that is necessary in the case of a ceramic tape, which does not have problems such as uneven winding, gap generation, and separation, and which can be easily suited to a conductive base material that has a complicated shape. This composite member (1) has a base material (2), and an insulating coating film (3) that covers at least a part of the surface of the base material (2) and has a film thickness of 150 μm or more. The insulating coating film (3) has a matrix (10) that contains a compound having a siloxane bond, and an inorganic material (20) that is dispersed in the matrix (10). If a cross-section of the insulating coating film (3), the cross-section being parallel to the film thickness direction, is observed, the ratio (P1/P2) of the porosity P1 in a region R1 in the range from the interface with the base material (2) to 100 μm to the porosity P2 in a region R2 in the range from the surface of the insulating coating film (3) to 100 μm is 0.3 to 3.0 inclusive. The regions R1 and R2 are each 75 μm in the film thickness direction and 300 μm in a direction that is orthogonal to the film thickness.
H01B 3/00 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
To provide a method for producing a composite member, with which it is possible to easily form an insulating film having sufficient strength for a base material of a complex shape, tightly adhering to a base material without peeling even when heated at a high temperature, and having excellent insulation property and heat resistance, without needing to wrap a tape or the like and without problems such as uneven winding, gaps, or peeling. A method for producing a composite member (1) having a base material (2) and an insulating film (3) that covers at least a part of the surface of the base material (2), the method comprising: a coating step for applying a first coating material containing a material of a matrix (10) containing a compound having a siloxane bond, and an inorganic material (20) to at least a part of the surface of the base material (2); and a first coating material curing step for curing the first coating material. An insulating film containing a first layer (11) and a second layer (12) is formed by repeating at least the coating step multiple times.
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
B05D 1/36 - Successively applying liquids or other fluent materials, e.g. without intermediate treatment
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
C09D 5/25 - Electrically-insulating paints or lacquers
H01B 3/46 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes silicones
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
The present invention provides a composite member which is excellent in terms of heat resistance, and is particularly excellent in terms of insulation properties, and which does not require winding work that is necessary for a ceramic tape and can be easily suited to a complicated shape without causing winding unevenness or a gap. This composite member is able to maintain excellent insulation properties and excellent heat resistance even if heated at high temperatures. This composite member (1) has a base material (2) and an insulating coating film (3) that covers at least a part of the surface of the base material (2). The insulating coating film (3) is obtained by alternately stacking a plurality of first coating films (11) and a plurality of second coating films (12) in this order from the base material (2) side. The first coating films (11) each have a matrix (10) that contains a compound having a siloxane bond, and an inorganic material (20) that is dispersed in the matrix (10). The second coating films are formed of the material of the matrix (10).
H01B 3/00 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties
H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
Provided is a composite member which does not require winding work, can easily handle complex shapes, can suppress the occurrence of burning and peeling of an insulating film even when heated at high temperatures, and can maintain excellent insulation and heat resistance. A composite member (1) has a metal base material (2) and an insulating coating (3) that covers at least a portion of the surface of the base material (2). The insulating coating (3) has: a matrix (10) containing a compound with a siloxane bond; and an inorganic material (20) dispersed in the matrix. At normal temperature, the base material (2) and the insulation coating (3) are in contact with each other. When heated to a temperature equal to or higher than the oxidation initiation temperature of the metal constituting the base material (2), an adhesive layer (8) is formed between the base material (2) and the insulation coating (3). The adhesive layer (8) has a metal element included in the base material (2), a metal oxide of a metal element, an inorganic material (20), and at least one selected from silicone and silica.
H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
H01R 4/58 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
In an optical waveguide (1) according to an embodiment, a lower cladding (21), a core (3), and an upper cladding (22) are stacked in this order, and a part of the core (3) on the side where an optical signal is incident and a part of the core (3) on the side where the optical signal is emitted are exposed. The optical waveguide (1) comprises an upper cladding non-formation region (1a) and an upper cladding formation region (1b). The upper cladding non-formation region (1a) has a core-exposed portion (3a) in which an upper surface (31) of the core (3) is exposed at at least one end (11) of the optical waveguide (1). The upper cladding formation region (1b) has a core-unexposed portion (3b) in which the upper surface (31) of the core (3) is not exposed. The width (W1) of the core (3) of the core-exposed portion (3a) and the width (W2) of the core (3) of the core-unexposed portion (3b) satisfy the relationship of W1 > W2.
Provided is a heat transfer suppression sheet that is capable of effectively suppressing heat transfer of high heat from a battery cell in which thermal runaway has occurred, and is excellent in adapting to battery cell expansion and contraction. Also provided is a highly safe battery pack comprising said heat transfer suppression sheet. In the heat transfer suppression sheet (1), an insulating layer (10) and heat conduction layers (30) are laminated with organic elastic layers (20) interposed therebetween. A heat transfer suppression sheet (60) with a pedestal is formed by providing, in an integrated manner on one surface or both surfaces of the heat transfer suppression sheet (1), a battery cell pedestal (70) made of an insulating material on which battery cells (40) are to be placed. In a battery pack (100), a plurality of battery cells (40) have the heat conduction layers (30) of the heat transfer suppression sheet (1) interposed therebetween so at to be in contact with main surfaces of the battery cells (40), and the battery cells (40) are connected in series or in parallel. In the battery pack (100), the battery cells (40) are placed on the battery cell pedestal (70) of the heat transfer suppression sheet (60) with a pedestal.
Provided is a heat transfer suppression sheet capable of maintaining a heat transfer suppression effect even when a resin substrate is burned out by high heat or flame from a battery cell-caused thermal runaway. Also, provided is a battery pack having higher safety, capable of maintaining a heat transfer suppression effect even when a resin substrate is burned out by high heat or flame from a thermal runaway battery cell. A heat transfer suppression sheet (1) includes a resin substrate (10), first inorganic particles (20), and second inorganic particles (30) having a melting point lower than that of the first inorganic particles (20). A heat transfer suppression member (60) has a heat insulation layer (50) on the surface of the heat transfer suppression sheet (1). A battery pack (100) comprises the heat transfer suppression sheet (1) or the heat transfer suppression member (60) interposed between battery cells (110), wherein the battery cells (110) are connected in series or in parallel.
A wiring substrate includes an insulating layer having through holes, a first conductor layer, a second conductor layer, interlayer conductors formed in the through holes. The interlayer conductors are connecting the first and second conductor layers and include first interlayer conductors formed in first region of the insulating layer and second interlayer conductors formed in second region of the insulating layer at density higher than density of the first interlayer conductors formed in the first region. A thickness of each first interlayer conductor is larger than a thickness of each second interlayer conductor. The insulating layer is formed such that the through holes includes first through holes having the first interlayer conductors formed therein and second through holes having the second interlayer conductors formed therein and that an inner diameter of each of the first through holes is larger than an inner diameter of each of the second through holes.
A printed wiring board includes an uppermost resin insulating layer, an uppermost conductor layer, a solder resist layer, a dam conductor connected to the upper most conductor layer, and a metal dam formed on and connected to the dam conductor. The uppermost conductor layer includes electrodes and a conductor circuit that are positioned to mount an electronic component in a mounting area in the solder resist layer. The metal dam is surrounding the mounting area. The solder resist layer has first openings reaching to the electrodes of the uppermost conductor layer and a second opening reaching to the conductor circuit of the uppermost conductor layer. The dam conductor is formed in the second opening of the solder resist layer. The conductor circuit in the uppermost conductor layer is a ground circuit or power supply circuit such that the conductor circuit is connected to the metal dam via the dam conductor.
Provided is a flameproof sheet composed of a combination of a heat insulating material and an elastic body, in which there is no problem of powder falling from the heat insulating material, the elastic body is hardly broken, a hole is hardly opened, and the elastic body can be made thin. The flameproof sheet (1) has a heat insulating sheet (50), and an elastic coating (60) comprising a foam of a thermosetting resin. The elastic coating (60) covers the entire heat insulating sheet (50) without having a joint part.
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A heat transfer suppression sheet contains a first organic fiber having no glass transition point at a temperature lower than 120° C., a first inorganic particle, and a resin binder. The first organic fiber may be a crystalline organic fiber having a glass transition point of 120° C. or higher and/or an organic fiber having no glass transition point.
H01M 50/24 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A heat transfer suppression sheet contains a fiber component and a particle component. A main component of a first inorganic fiber contained in the fiber component is the same kind as a main component of a first inorganic particle contained in the particle component, and a content of the main component of the first inorganic particle is larger than a content of the main component of the first inorganic fiber.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
50.
PLATE-SHAPED HEAT INSULATOR, COMBUSTION CHAMBER, BOILER AND WATER HEATER
A plate-shaped heat insulator including a plate-shaped papermaking product containing inorganic fibers, and one or more grooves in at least one of its surfaces. The plate-shaped heat insulator is intended to be disposed in a combustion chamber.
F23M 5/02 - CasingsLiningsWalls characterised by the shape of the bricks or blocks used
F22B 21/34 - Water-tube boilers of vertical or steeply-inclined type, i.e. the water-tube sets being arranged vertically or substantially vertically built-up from water tubes grouped in panel form surrounding the combustion chamber, i.e. radiation boilers
F24H 1/00 - Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
A heat transfer suppression sheet contains an inorganic particle uniformly dispersed, a first inorganic fiber uniformly dispersed and oriented in one direction parallel to a main surface of the sheet, and a second inorganic fiber intertwined with the first inorganic fiber to form a three-dimensional web structure. The first inorganic fiber may have an average fiber diameter larger than an average fiber diameter of the second inorganic fiber.
A heat transfer suppression sheet contains a first inorganic particle, a resin binder; and an organic fiber, in which the organic fiber has a glass transition point higher than a glass transition point of the resin binder. At least a part of the organic fiber may be fused each other to form a three-dimensional framework.
A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer includes resin and inorganic particles including first particles and second particles such that the first particles have flat exposed portions, the second particles are embedded in the resin, and the surface of the resin insulating layer includes the resin and the flat exposed portions of the first particles.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A battery protection sheet contains a papermaking sheet layer containing a first inorganic fiber; and a cross layer made of a second inorganic fiber. The first inorganic fiber may have an average fiber length of 0.5 mm to 10 mm, the papermaking sheet layer may further contain an inorganic particle, the papermaking sheet layer may further contain a binding material.
H01M 50/242 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries against vibrations, collision impact or swelling
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor, a resin insulating layer having an opening extending through the resin insulating layer, a conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor formed in the opening such that the via conductor electrically connects to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The resin insulating layer includes resin and inorganic particles including first and second particles such that the first particles are partially embedded in the resin and that the second particles are embedded in the resin, the first particles have first portions protruding from the resin and second portions embedded in the resin respectively, the surface includes the resin and exposed surfaces of the first portions exposed from the resin.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
H05K 3/26 - Cleaning or polishing of the conductive pattern
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
Provided are: a heat transfer suppression member capable of suppressing destruction of a battery case and deterioration of battery performance due to deformation of battery cells while ensuring an interval between the battery cells, and capable of suppressing propagation of heat between the battery cells at the time of abnormality; and a battery pack capable of suppressing destruction of the battery case and deterioration of battery performance while suppressing propagation of heat between the battery cells. The heat transfer suppression member (50) has: a frame body (53) that surrounds the outer periphery in a plan view; and a sheet-like heat insulation material (10) that is disposed inside the frame body (53) and is provided with a pair of main surfaces (10s). In a cross-sectional view orthogonal to the plan view of the heat transfer suppression member (50), the thickness of the heat insulation material (10) is thinner than the thickness of the frame body (53).
H01M 50/291 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
Provided are: a heat transfer suppression sheet capable of further suppressing propagation of heat between battery cells when an abnormality occurs and capable of suppressing destruction of a battery case and reduction in battery performance due to deformation of a battery cell; and a battery pack that can be easily designed and assembled and that is capable of suppressing the destruction of the battery case and the reduction in the battery performance while suppressing the propagation of heat between the battery cells. A heat transfer suppression sheet (50) has: a heat insulating material (10) that has inorganic particles (4) and organic fibers (1) or inorganic fibers (15); and an elastic sheet (51) laminated on at least one of a first surface (10a) and a second surface (10b), which are orthogonal to the thickness direction of the heat insulating material (10). A battery pack (100) includes: a plurality of battery cells (20a, 20b, 20c); and the heat transfer suppression sheet (50). The plurality of battery cells (20a, 20b, 20c) are connected in series or in parallel.
H01M 50/202 - Casings or frames around the primary casing of a single cell or a single battery
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
An inorganic fiber mat includes inorganic fibers, a particle obtained by firing an inorganic binder, and a mixture of an unfired inorganic binder and an organic binder.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
59.
COMPOSITION, RAW MATERIAL COMPOSITION OF COSMETIC, VIRUS PROLIFERATION SUPPRESSING AGENT, USE OF COMPOSITION FOR SUPPRESSING VIRUS PROLIFERATION, METHOD FOR SUPPRESSING VIRUS PROLIFERATION, AND SEALED BODY
Provided is a 2,3-BDO composition capable of appropriately exhibiting an effect of suppressing virus proliferation. A composition according to the present invention contains at least (2R,3R)-2,3-butanediol and/or (2S,3S)-2,3-butanediol, and does not contain (meso)-2,3-butanediol.
Provided is a composition capable of appropriately exhibiting an virus proliferation inhibition effect. This composition is characterized by containing at least (2R,3R)-2,3-butanediol and/or (2S,3S)-2,3-butanediol and (meso)-2,3-butanediol, wherein the weight-based proportion of the content of the (meso)-2,3-butanediol is not more than twice the total content of the (2R,3R)-2,3-butanediol and the (2S,3S)-2,3-butanediol.
A printed wiring board includes a first insulating layer, a connection conductor having a connection wiring, a second insulating layer formed on the connection conductor layer, a mounting conductor layer including a first electrode that mounts a first electronic component and a second electrode that mounts a second electronic component, and connection via conductors including a first connection via conductor that electrically connects the first electrode and the connection wiring and a second connection via conductor that electrically connects the second electrode and the connection wiring. The first insulating layer includes resin and inorganic particles including first particles and second particles such that each first particle has a first portion protruding from the resin and a second portion embedded in the resin, and the surface of the first insulating layer includes a surface of the resin and exposed surfaces of the first portions exposed from the surface of the resin.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
A printed wiring board includes a first insulating layer, a connection conductor layer including wiring, a second insulating layer covering the connection conductor layer, a conductor layer including first and second electrodes such that the first electrode mounts a first electronic component and the second electrode mounts a second electronic component, and via conductors including first and second via conductors. The first via conductor connects the first electrode and wiring. The second via conductor connects the second electrode and wiring. The conductor layer includes a seed layer and an electrolytic plating layer. The seed layer includes a first layer formed on the first insulating layer and a second layer formed on the first layer, a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer of the seed layer.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
A coil substrate includes a flexible substrate, terminals formed on one side of the flexible substrate such that the terminals are positioned in a longitudinal direction of the flexible substrate, coils each comprising a first wiring formed on a first surface and a second wiring formed on a second surface on the opposite side with respect to the first surface, and connection wirings formed on the flexible substrate such that the connection wirings include wirings connecting the terminals and the coils respectively and wirings connecting two of the coils respectively and that the connection wirings extend obliquely with respect to the longitudinal direction of the flexible substrate. The coil substrate is wound along the longitudinal direction of the flexible substrate around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the coil substrate is formed into a cylindrical shape.
H02K 3/04 - Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
H02K 5/22 - Auxiliary parts of casings not covered by groups , e.g. shaped to form connection boxes or terminal boxes
H02K 7/00 - Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
[Problem] The objective of the present invention is to reduce the stray capacitance that is generated between a side surface of a land and a side surface of a solid pattern. [Solution] A wiring board according to the present disclosure comprises a first conductive layer, an insulating layer that covers the first conductive layer, a second conductive layer that is formed on the insulating layer, and a via conductor that penetrates the insulating layer and connects the first conductive layer and the second conductive layer to each other. The first conductive layer is provided with a pad that is connected to the via conductor, and a solid pattern that has an opening in which the pad is contained. A gap is provided between the side surface of the pad and the insulating layer, or between the inner surface of the opening of the solid pattern and the insulating layer.
A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
66.
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Provided are a coil substrate capable of reducing the influence of wiring resistance and eddy current, a coil substrate for a motor, and a motor. A coil substrate according to an embodiment includes a resin substrate having a first surface and a second surface, and coil wiring formed on the first surface and the second surface of the resin substrate. The coil wiring comprises a first conductor layer and an additional plating layer. The first conductor layer comprises a metal foil layer, a chemical plating layer formed on the metal foil layer, and an electrolytic plating layer formed on the chemical plating layer. The cross-sectional shape of the first conductor layer is a substantially trapezoidal shape having a lower base facing the resin substrate and an upper base opposite the lower base. The additional plating layer covers an upper surface and a side surface of the first conductor layer.
Provided are a coil substrate capable of reducing the influence of wiring resistance and eddy current, a coil substrate for a motor, and a motor. A coil substrate according to an embodiment includes a resin substrate having a first surface and a second surface, and coil wiring formed on the first surface and the second surface of the resin substrate. The coil wiring is composed of a first conductor layer and an additional plating layer. The first conductor layer is composed of a metal foil layer, a chemical plating layer formed on the metal foil layer, and an electrolytic plating layer formed on the chemical plating layer. The additional plating layer covers an upper surface and a side surface of the first conductor layer. The cross-sectional shape of a side-surface part of the additional plating layer that covers the side surface of the first conductor layer does not follow the cross-sectional shape of the side surface of the first conductor layer.
The present invention keeps the intense heat from a battery cell that has undergone thermal runaway from being transmitted via a cooling plate. The present invention also provides a high-safety battery pack that keeps the intense heat from a battery cell that has undergone thermal runaway from being transmitted via a cooling plate. A battery cell pedestal (3) is to be interposed between a cooling plate (1) and a battery cell (20) and comprises a thermal expansion material. A battery pack (100) comprises a plurality of battery cells (20) that are installed on battery cell pedestals (3), the battery cells (20) being connected to each other in series or in parallel.
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/249 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders specially adapted for aircraft or vehicles, e.g. cars or trains
69.
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A printed wiring board includes an insulating layer, and a conductor layer formed on the insulating layer and having degas holes formed such that the degas holes are penetrating through the conductor layer and exposing portions of the insulating layer. The conductor layer is formed such that each of the degas holes is a polygon shape having at least one inner angle of 100 degrees or more.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, and coils including first wirings and second wirings such that the first wirings are formed on the first surface of the flexible substrate and that the second wirings are formed on the second surface of the flexible substrate. The flexible substrate has one or more recesses formed on one or more longitudinal sides of the flexible substrate and is formed to be wound in a circumferential direction around an axis extending in the width direction of the flexible substrate orthogonal to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape.
A coil substrate includes a flexible substrate and coils including first wirings and second wirings. The first wirings are formed on a first surface of the substrate. The second wirings are formed on a second surface of the substrate. The flexible substrate has a first end in a longitudinal direction of the substrate and is wound from the first end in a circumferential direction around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the substrate is formed into a cylindrical shape, the first surface of the substrate is positioned on an inner circumferential side of the cylindrical shape, and the second surface of the substrate is positioned on an outer circumferential side of the cylindrical shape, and the substrate has a first region adjacent to the first end such that the first region includes the second wirings and does not include the first wirings.
A motor coil substrate includes a coil substrate including a flexible substrate and coils such that the coils include first wirings formed on a first surface of the flexible substrate and second wirings formed on a second surface of the flexible substrate on the opposite side. The coil substrate is wound N turns where N is an integer of 2 or more in a circumferential direction such that the first surface of the flexible substrate is positioned on an inner circumferential side of the coil substrate, the second surface of the flexible substrate is positioned on an outer circumferential side of the coil substrate, and a gap is formed between an M-th layer where M is an integer equal to or larger than 1 and less than N and an (M+1)-th layer from an inner side of N circumferential layers formed by winding the coil substrate N turns.
Provided is a papermaking mat which has a high initial surface pressure and can maintain a surface pressure even when subjected to repeated compression. This papermaking mat is composed of inorganic fibers, and characterized in that the inorganic fibers include alumina fibers (AF) and refractory ceramic fibers (RCF), and in that when 100 of the inorganic fibers are randomly extracted and it is determined whether the inorganic fibers are alumina fibers or refractory ceramic fibers, the number of alumina fibers is 30% or more and the number of refractory ceramic fibers is less than 70%.
D01F 9/08 - Man-made filaments or the like of other substancesManufacture thereofApparatus specially adapted for the manufacture of carbon filaments of inorganic material
D06M 11/45 - Oxides or hydroxides of elements of Groups 3 or 13 of the Periodic TableAluminates
D06M 11/79 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof with silicon dioxide, silicic acids or their salts
D06M 15/233 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated aromatic, e.g. styrene
D06M 15/263 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acidsSalts or esters thereof
D06M 15/333 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated alcohols or esters thereof of vinyl acetatePolyvinylalcohol
D06M 15/693 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment with natural or synthetic rubber, or derivatives thereof
A printed wiring board includes a mounting conductor layer including first and second electrodes, a connection conductor layer including connection wirings such that the connection wirings connect the first and second electrodes, a resin insulating layer formed between the mounting conductor layer and the connection conductor layer and having openings, and connection via conductors formed in the openings of the resin insulating layer and including first and second connection via conductors such that the first connection via conductors electrically connect the first electrodes and the connection wirings and the second connection via conductors electrically connect the second electrodes and the connection wirings. The resin insulating layer includes inorganic particles and resin. The inorganic particles include first inorganic particles forming inner wall surfaces in the openings and second inorganic particles embedded in the resin insulating layer. Shapes of the first inorganic particles are different from shapes of the second inorganic particles.
A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part laminated on the first build-up part and including an insulating layer and a conductor layer. The minimum width and minimum inter-wiring distance of wirings in the first build-up part are smaller than the minimum width and minimum inter-wiring distance of wirings in the second build-up part. The insulating layer in the first build-up part includes resin and inorganic particles including first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin such that the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin, respectively. The insulating layer of the first build-up part has a surface covered by the conductor layer and including a surface of the resin and exposed surfaces of the first portions.
A wiring substrate includes a first build-up part including first insulating layers, first conductor layers, and first via conductors, and a second build-up part including second insulating layers and second conductor layers. The minimum wiring width and minimum inter-wiring distance in the first conductor layers are smaller than the minimum wiring width and minimum inter-wiring distance in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer formed on the first layer. The first layer includes a lower layer including a sputtering film including an alloy including copper, aluminum, and at least one element selected from nickel, zinc, gallium, silicon, and magnesium, and an upper layer including a sputtering film including copper. The lower layer is formed in contact with surfaces of the first insulating layers and inner wall surfaces and bottom surfaces in via openings for the first via conductors.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
77.
BUS BAR AND METHOD FOR PRODUCING SAME, AND POWER STORAGE DEVICE
Provided are a bus bar in which an insulating film is formed in a desired region and peeling or the like of the insulating film can be suppressed, even if a bus bar body has a complicated shape, and a method for producing the same. A bus bar (20) has a bus bar body (25) and an insulating film (10) formed on the surface of the bus bar body (25). The bus bar body (25) has a pair of main surface portions (25a) that face each other, a plurality of end surface portions (25b) that join the facing main surface portions (25a) to each other, and corner portions (25c) that are formed between the main surface portions (25a) and the end surface portions (25b). The outer surfaces of the insulating film (10) formed on the corner portions (25c) of the bus bar body (25) have R shapes. In addition, the film thickness of the insulating film (10) formed on the corner portions (25c) of the bus bar body (25) is greater than the film thickness of the insulating film (10) formed on the main surface portions (25a) of the bus bar body (25).
A wiring substrate includes insulating layers including a first insulating layer and a second insulating layer, conductive layers including a first conductive layer including a pad and a second conductive layer, a coating film covering the first conductive layer including the pad and improving adhesion between the first conductive layer and the second insulating layer, and a via conductor formed in a through hole penetrating through the second insulating layer and the coating film on the pad and connecting the pad and the second conductive layer. The pad has a surface formed such that a root mean square roughness of the surface is in a range of 0.10 μm to 0.23 μm, and a peeling part is formed between the pad and the second insulating layer such that the peeling part is formed within 15 μm around an outer edge of the through hole on the surface of the pad.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
79.
COIL SUBSTRATE, COIL SUBSTRATE FOR MOTOR, AND MOTOR
Provided are a coil substrate, a coil substrate for a motor, and a motor with which it is possible to maintain a circular shape of a cross-section of the coil substrate even when the density of the coil wiring is increased, or the size of the coil substrate is reduced. The coil substrate according to an embodiment comprises a flexible substrate, a coil that is a first wiring on a first surface of the flexible substrate, and a coil that is a second wiring on a second surface of the flexible substrate. The coil that is the first wiring and the coil that is the second wiring are arranged with a plurality of coils arranged from a first side to a second side of the flexible substrate. The flexible substrate includes a first region near one end, a second region adjacent to the other end side of the first region, and a third region that is positioned near the other end and adjacent to the other end side of the second region. A first insulating layer is formed on the first surface and a second insulating layer is formed on the second surface. In the first region, the first insulating layer is not formed, while the second insulating layer is formed. In the second region, the first insulating layer and the second insulating layer are formed.
A thermal insulation sheet containing a thermal insulation material containing inorganic particles and a resin film covering at least a part of a surface of the thermal insulation material. A method for producing the thermal insulation sheet, including: molding a material for a thermal insulation material containing the inorganic particles into a sheet shape; and coating the surface of the thermal insulation material molded into the sheet shape with the resin film forming composition by a screen printing method or a spray coat printing method to form the resin film.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate and has a through hole penetrating through the glass substrate. The through-hole conductor is formed in the through hole. The seed layer is covering inner wall surface of the insulating layer in opening in which the via conductor is formed. The seed layer has a first portion and a second portion electrically connected to the first portion. That part of the first portion is formed on the second portion.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than the minimum inter-wiring distance in the second conductor layers. Each first conductor layer and each via conductor include first and second layers. The first layer includes a first portion covering respective surface of the first insulating layers, a second portion covering inner wall surface in respective via opening in the first insulating layers, and a third portion covering bottom surface in the respective via opening. The thickness of the first portion is larger than the thickness of the second portion and larger than the thickness of the third portion.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part including an insulating layer and a conductor layer. The minimum wiring width of wirings in the conductor layer of the first build-up part is smaller than the minimum wiring width of wirings in the conductor layer of the second build-up part. The minimum inter-wiring distance of the wirings in the first part is smaller than the minimum inter-wiring distance of the wirings in the second part. The first build-up part is formed such that the conductor layer includes a conductor pattern including a first metal layer, a second metal layer, and a third metal layer. The width of the first metal layer is larger than the width of the second metal layer. The width of the third metal layer is larger than the width of the first metal layer.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
84.
METHOD OF PRODUCING INORGANIC FIBER MAT AND INORGANIC FIBER MAT
Provided is a method of producing an inorganic fiber mat, the method including: a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat; a defibrating step of defibrating the first inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
85.
SHEET FORMATION MAT AND METHOD FOR MANUFACTURING SHEET FORMATION MAT
Provided is a sheet formation mat having sufficiently high surface pressure. This sheet formation mat is composed of inorganic fibers. The sheet formation mat is characterized: by comprising fiber bundles formed by interlacing 10 or more of the inorganic fibers so as to be twisted, as well as the inorganic fibers which do not constitute the fiber bundles. The papermaking mat is also characterized in that: the average length of the fiber bundles is 5-15 mm; the average width of the fiber bundles is 0.2-1.0 mm; the fiber bundles include fiber bundles in a wavy state; and a traced length of the fiber bundles in a wavy state measured by the following traced length measuring method is longer than the length of the fiber bundles in a wavy state by 0.1 mm or more. Traced length measuring method: A fiber bundle in a wavy state is statically placed on a flat surface. When the statically-placed fiber bundle in a wavy state is viewed from above, one end part to another end part of the fiber bundle in a wavy state is traced along the fiber bundle in a wavy state, and the traced distance is set as "the traced length of the fiber bundle in a wavy state".
D04H 1/58 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
D06M 11/45 - Oxides or hydroxides of elements of Groups 3 or 13 of the Periodic TableAluminates
D06M 11/79 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof with silicon dioxide, silicic acids or their salts
D06M 15/233 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated aromatic, e.g. styrene
D06M 15/244 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of halogenated hydrocarbons
D06M 15/263 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acidsSalts or esters thereof
D06M 15/327 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated alcohols or esters thereof
D06M 15/693 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment with natural or synthetic rubber, or derivatives thereof
A thermal insulation material having carbon fibers, the thermal insulation material containing; a covering layer containing pyrolytic carbon at a surface of the thermal insulation material; and a base layer containing carbon-based particles between the carbon fibers below the covering layer. A method for producing a thermal insulation material including: forming a base layer by impregnating a surface of a molded body containing carbon fibers with a slurry containing carbon-based particles; and forming a covering layer containing pyrolytic carbon on the base layer by applying a chemical vapor deposition method to the molded body in a CVD furnace.
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor layers. The minimum inter-wiring distance of the wirings in the first conductor layers is smaller than the minimum inter-wiring distance of the wirings in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer. The first layer of each via conductor is covering inner wall surface in a via opening and has a first portion and a second portion. The first portion has a portion formed closer to the center of the via opening than the second portion.
Provided is a mat made by a papermaking process that is less likely to be cracked even when wound around a base material. A mat made by a papermaking process according to the present invention is composed of inorganic fibers, and has a first principal surface and a second principal surface facing the first principal surface. A plurality of linear protrusions are formed on the first principal surface. The protrusions are oriented in one direction in the plane direction of the first principal surface in a plan view of the mat made by a papermaking process. The protrusions have an average length of 5 to 200 mm, an average width of 1 to 50 mm, and an average height of 0.05 to 0.50 mm. At least five protrusions are formed in an arbitrary area of 10 cm by 10 cm in length and breadth on the first principal surface. The protrusions each include a fiber bundle formed by a plurality of fibers interlaced in a twisted manner.
D21H 13/40 - Inorganic fibres or flakes siliceous vitreous, e.g. mineral wool or glass fibres
D21H 15/02 - Pulp or paper, comprising fibres or web-forming material characterised by features other than their chemical constitution characterised by configuration
Provided is a mat made by a papermaking process, the mat being less likely to have cracks even when wound around a base material, and having a sufficiently high surface pressure. The mat made by a papermaking process is configured from inorganic fibers, and is characterized by comprising a fiber bundle formed by interlacing 10 or more of the inorganic fibers in a twisted manner, and the inorganic fibers that do not constitute the fiber bundle, wherein: the average length of the fiber bundle exceeds 5 mm; and, when the mat made by a papermaking process is opened by a method indicated below for opening the mat made by a papermaking process, and a slurry including the inorganic fibers is obtained, an underwater bulk specific gravity of the inorganic fibers included in the slurry is 0.012 to 0.035 g/cm3. A method for opening the mat made by a papermaking process: Heat-treat the mat made by a papermaking process at 600°C for 1 hour. Weigh out 5.0 grams of fibers from the mat made by a papermaking process while disentangling the fibers, and put the fibers into a container containing 400 cc of water. After stirring at a speed of 1000 rpm for 10 minutes, transfer the mixture to a measuring cylinder and add water until the total capacity is 500 cc. Let the mixture stand for 30 minutes, read the height of the settled fibers, and calculate the underwater bulk specific gravity by using the following formula (1). (1): Underwater bulk specific gravity (g/cm3) = 5.0 (g)/sedimentation volume of fibers (cm3)
C04B 38/00 - Porous mortars, concrete, artificial stone or ceramic warePreparation thereof
D06M 11/45 - Oxides or hydroxides of elements of Groups 3 or 13 of the Periodic TableAluminates
D06M 11/79 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereofSuch treatment combined with mechanical treatment, e.g. mercerising with silicon or compounds thereof with silicon dioxide, silicic acids or their salts
D06M 15/233 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of hydrocarbons, or reaction products thereof, e.g. afterhalogenated or sulfochlorinated aromatic, e.g. styrene
D06M 15/263 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated carboxylic acidsSalts or esters thereof
D06M 15/333 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds of unsaturated alcohols or esters thereof of vinyl acetatePolyvinylalcohol
D06M 15/693 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment with natural or synthetic rubber, or derivatives thereof
90.
Method of producing inorganic fiber mat and inorganic fiber mat
Provided is a method of producing an inorganic fiber mat the method including: a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat; a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/70 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
D04H 1/46 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
D21B 1/32 - Defibrating by other means of waste paper
Provided are a cover protector that can protect a heat insulating material from scattered objects and can further improve heat insulation performance, a method for manufacturing the cover protector, and a battery module. A cover protector (1) comprises: a heat insulating material (2) containing inorganic particles; an inorganic fiber sheet (3); and an adhesive layer (4) that joins the heat insulating material (2) and the inorganic fiber sheet (3), and contains an organic material. When viewed in the lamination direction of the heat insulating material (2) and the inorganic fiber sheet (3), the adhesive layer (4) has a plurality of island-shaped parts (5) and a mesh-shaped part (6) that connects the island-shaped parts (5) to each other.
F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
Provided are: a cover protector and a method for manufacturing same, capable of enhancing adhesiveness between a heat insulating material and a prescribed surface such as an inner wall surface of a battery case; and a battery module. A cover protector (10) includes: a heat insulating material (1) containing first organic fibers (3); and an organic film (2) bonded to at least a portion of a surface of the heat insulating material (1). At least a portion of the first organic fibers (3) protrudes from the surface of the heat insulating material (1). A battery module (100) includes: the cover protector (10); a storage battery (110); and a battery case (120) that accommodates the cover protector (10) and the storage battery (110).
F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
This heat insulation material for a combustion chamber is a plate-like molding including inorganic fibers, the heat insulation material being characterized in that when the bulk densities of a first main surface part, a second main surface part, and a central part between the first main surface part and the second main surface part in the thickness direction are compared, at least the bulk density of the first main surface part is smaller than the bulk density of the central part, and the first main surface part is arranged toward the inner wall surface of the combustion chamber.
F24H 1/12 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium in which the water is kept separate from the heating medium
94.
HEAT TRANSFER SUPPRESSING SHEET, METHOD FOR MANUFACTURING SAME, AND BATTERY MODULE
Provided are: a heat transfer suppressing sheet which has a multilayer structure and has a more outstanding heat insulating effect and flame retarding effect, in addition to which the multilayer structure can be maintained even when exposed to a high heat or a flame from a battery cell that has undergone thermal runaway; and a battery module that is provided with the heat transfer suppressing sheet and that is extremely safe. In a heat transfer suppressing sheet (A1), a laminated body including a heat insulating material (A10) and an inorganic sheet (A20) is sewn together using a sewing thread (A30) that has a melting point lower than that of inorganic fibers of the inorganic sheet (A20), and that is preferably thinner than openings of the inorganic sheet (A20), and a battery module (A100) accommodates storage batteries (A110) in a battery case (A120), the heat transfer suppressing sheet (A1) being disposed between the storage batteries (A110), and/or the top of the battery case (A120), and/or a side wall of the battery case (A120), and/or the bottom wall of the battery case (A120).
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 10/659 - Means for temperature control structurally associated with the cells by heat storage or buffering, e.g. heat capacity or liquid-solid phase changes or transition
95.
HEAT TRANSFER SUPPRESSION SHEET, METHOD FOR PRODUCING SAME, AND BATTERY PACK
The present invention provides: a heat transfer suppression sheet which has excellent thermal insulation performance; a method for producing this heat transfer suppression sheet; and a battery pack which comprises this heat transfer suppression sheet. This heat transfer suppression sheet (10) contains dry silica particles (1), while having pores (2) inside. The dry silica particles (1) have an average primary particle diameter of 25 nm or less, and the total volume of pores having a mode diameter of 68 nm or less is 10% or more with respect to the total volume of the pores. This method for producing a heat transfer suppression sheet (10) has a processing step in which a material mixture containing dry silica particles (1) is processed into a sheet shape by a dry method. The dry silica particles (1) have an average primary particle diameter of 25 nm or less.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
Provided is a heat transfer suppression sheet with which heat insulation properties can be further improved, damage caused by scattered matter during thermal runaway can be suppressed, and the heat insulation properties can be maintained. Also provided is a battery pack having this heat transfer suppression sheet. A heat transfer suppression sheet (50) includes: a heat insulation material (10) having inorganic particles (4), and organic fibers (1) or inorganic fibers (15); and a mica sheet (51) laminated on at least one of a first surface (10a) and a second surface (10b), which are orthogonal to the thickness direction of the heat insulation material (10). Meanwhile, a battery pack (100) has a plurality of battery cells (20a, 20b, 20c) and the heat transfer suppression sheet (50), and the plurality of battery cells (20a, 20b, 20c) are connected in series or in parallel.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
An assembled battery in which a plurality of battery cells is connected serially or in parallel, the battery cells each having an electrode surface having an electrode and a peripheral surface orthogonal to the electrode surface and being disposed such that the peripheral surfaces face each other. The assembled battery contains the battery cells, an insulating material covering the peripheral surface of the battery cells, and a heat dissipation member covering the peripheral surface of the battery cells which is covered with the insulating material. The insulating material has a plurality of holes piercing the insulating material from a surface thereof facing the battery cells to a surface thereof facing the heat dissipation member.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
98.
HEAT TRANSFER SUPPRESSION SHEET, METHOD FOR PRODUCING SAME, AND BATTERY PACK
Provided is a heat transfer suppression sheet which is capable of suppressing the reduction of the service life of a battery by reducing unevenness of pressing force to a battery cell by an elastic sheet. This heat transfer suppression sheet (10) has a heat insulation material (11) that contains inorganic particles, an elastic sheet (12) that is superposed on the heat insulation material (11), and a resin film (13) that covers the heat insulation material (11) and the elastic sheet (12). The heat insulating material (11) has a pair of heat insulating material main surfaces (11a) that are orthogonal to the thickness direction, and the elastic sheet (12) has a pair of elastic sheet main surfaces (12a) that are orthogonal to the thickness direction, and a plurality of elastic sheet end surfaces (12b) that connect the pair of elastic sheet main surfaces (12a). In addition, the heat insulating material (11) and the elastic sheet (12) are superposed upon each other in such a manner that a heat insulating material main surface (11a) and an elastic sheet main surface (12a) face each other. Furthermore, at least one end surface among the plurality of elastic sheet end surfaces (12b) is inclined further inward with the distance from the heat insulating material (11) by being pressed by the resin film (13).
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/291 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
A wiring substrate includes a core substrate including a through-hole conductor, a first resin insulating layer, a first conductor layer including a seed layer and an electrolytic plating layer, a via conductor formed such that the via conductor electrically connects the through-hole conductor and first conductor layer, and a second resin insulating layer covering the first conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is penetrating through the glass substrate, the seed layer includes a first layer formed on the first resin insulating layer and a second layer formed on the first layer, and the first conductor layer includes a conductor circuit such that a width of the first layer is larger than a width of the second layer in the conductor circuit and a width of the electrolytic plating layer is larger than the width of the first layer in the conductor circuit.
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
The present invention suppresses a connection loss between an electronic component and a photoelectric component, and a reduction in data speed caused by the connection loss between the electronic component and the photoelectric component. A wiring board (1) according to an embodiment of the present invention comprises: a first component mounting region (A1) on a component mounting surface (1a); a photoelectric component mounting region (A0); and optical wiring (31) that can be optically connected to a photoelectric component (E0). A recess (20) is formed in the component mounting surface (1a) of the wiring board (1). The first component mounting region (A1) is provided in the recess (20). The first component mounting region (A1) at least partially overlaps the photoelectric component mounting region (A0) in a plan view.
