A prober includes a measurement unit, a wafer chuck, an alignment device, and a falling restriction mechanism. The wafer chuck holds a wafer on its upper surface and is held on the lower surface of the measurement unit. The falling restriction mechanism restricts falling of the wafer chuck from the lower surface of the measurement unit. The falling restriction mechanism includes a plurality of falling restriction claws and a position control device. The position control device can switch positions of the plurality of falling restriction claws between a retracted position for allowing the wafer chuck to pass between the falling restriction claws, an intermediate position for receiving the wafer chuck separated from the lower surface of the measurement unit from below, and an advanced position for centering the wafer chuck.
A three-position control device includes a cylinder device, a fluid control unit, and a displacement restriction device. The cylinder device displaces a piston to each of a retracted position, an intermediate position, and an advanced position. The cylinder device has a first fluid chamber for retraction and a second fluid chamber for advance. A fluid control unit switches an advanced/retracted position of the piston. A second working pressure during displacement from an intermediate position to the advanced position is set to be greater than a first working pressure during displacement from the retracted position to the intermediate position. The displacement restriction device has a load receiving portion and a biasing means. A biasing force of the biasing means is set to be greater than a thrust caused by the first working pressure and smaller than a thrust caused by the second working pressure.
F15B 11/12 - Systèmes de servomoteurs dépourvus d'asservissement avec un seul servomoteur avec positions intermédiaires distinctesSystèmes de servomoteurs dépourvus d'asservissement avec un seul servomoteur avec action échelonnée
F15B 13/04 - Dispositifs de distribution ou d'alimentation du fluide caractérisés par leur adaptation à la commande de servomoteurs pour utilisation avec un servomoteur unique
3.
WAFER INSPECTION APPARATUS, CHUCK POSITION MEASUREMENT METHOD, AND TARGET
A wafer inspection apparatus, a chuck position measurement method, and a target capable of improving a throughput are provided. A wafer inspection apparatus 10 includes a probe card 21, a chuck 22 capable of electrically connecting a wafer W to the probe card 21, a holding portion 23 holding the chuck 22, a target provided on the chuck 22, and an imaging unit 25 imaging the target. The target is formed to be larger than an allowable movement range of the chuck 22 with respect to the holding portion 23 to be able to be imaged with the imaging unit 25 fixed at a predetermined position. A position and an angle of the chuck 22 are determined on the basis of the imaged target.
This laser machining device comprises: a protective film inspection mechanism for determining the application state of a protective film applied to a workpiece; and a positioning mechanism for placing and positioning the workpiece on a machining table during laser machining. After the positioning mechanism positions the workpiece on the machining table, the protective film inspection mechanism determines the application state of the protective film. This laser machining method comprises: a positioning step for placing and positioning a workpiece yet to be laser-machined on a machining table; and a determination step for measuring, after the positioning step, the application state of a protective film applied to the workpiece positioned on the machining table and determining the application state of the protective film.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
Provided are a laser processing method and a laser processing device that make it possible to divide a wafer along a division line with high precision while reducing splash damage in laser processing for forming a modified layer inside a wafer by irradiating the division line with a laser. This laser processing method comprises: a first laser processing step for forming a modified layer along a first division line; and a second laser processing step for forming a modified layer along a second division line that intersects the first division line, the second laser processing step being performed after the first laser processing step. In the second laser processing step, a first modified layer 15A and a second modified layer 15B having different positions in the thickness direction of a wafer 10 are formed, and, at the intersection of the first division line 11 and the second division line, the distance to the first division line 11 from the second modified layer 15B is made greater than that from the first modified layer 15A.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
A wafer chamfering device, which trues (S4) an abrasive grinding wheel 16 by a truer 10 and grinds an edge portion of the outer circumference of a wafer W by using the abrasive grinding wheel 16 that has been trued (S4), comprises: a truer-creation grinding wheel 15 that creates an edge shape of the truer 10 in accordance with a truer machining program 50; a control unit 30 that controls the truer-creation grinding wheel 15 and a machining condition for the truer 10 and the abrasive grinding wheel 16; and a truer-creation grinding wheel evaluation unit 39 that evaluates the truer-creation grinding wheel 15 according to the result of measuring the edge shape of the truer 10. The chamfering device creates and updates the truer machining program 50 on the basis of the evaluation, and improves the delivery quality of the wafer pertaining to acceptable accuracy, variations, and the like, and extends and maximizes the service life of the truer-creation grinding wheel.
B24B 53/00 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet
B24B 49/18 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la présence d'outils à dresser
B24B 53/07 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives des meules profilées utilisant des outils de forme complémentaire de celle à réaliser, p. ex. blocs, rouleaux profilés
Provided are a charge and discharge test system, a charge and discharge test method, and a program that make it possible to increase the proportion of a power sharing period to a test period. A charge and discharge test system 10 comprises a control device that controls a first bidirectional DC/DC converter 14 and a second bidirectional DC/DC converter 15 so that power is shared between a test battery 11 and a non-test battery 12 during a charge and discharge test, and controls operation of an AC/DC converter 13 according to power surplus or deficit on a direct-current bus 16. The control device executes: determination voltage acquisition processing for acquiring a determination voltage that is a voltage of the non-test battery 12; voltage determination processing for determining whether or not a forcing condition set for the determination voltage is satisfied; and forcing processing for performing, if the forcing condition is satisfied, forced discharging or forced charging of the non-test battery 12 by controlling the second bidirectional DC/DC converter 15 so that the forcing condition is not satisfied.
G01R 31/382 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge
G01R 31/385 - Dispositions pour mesurer des variables des batteries ou des accumulateurs
G01R 31/396 - Acquisition ou traitement de données pour le test ou la surveillance d’éléments particuliers ou de groupes particuliers d’éléments dans une batterie
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
A prober includes a wafer chuck that is a support member for supporting a wafer, a test part that tests electrical characteristics of semiconductor devices formed on a wafer when the wafer is placed on the wafer chuck, a jetting part that sends air to an air purge line connected to a chuck space formed in the wafer chuck, and a cooling control part that determines whether or not to cause the air to jet out.
G01K 3/00 - Thermomètres donnant une indication autre que la valeur instantanée de la température
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
Provided is a machining method for machining a workpiece with a hubless blade including a blade body that is fixed to a spindle of a machining device via a blade fixing part, and a gripping part that can be handled by being connected to one surface of the blade body and held, the machining method comprising: a step for automatically replacing the hubless blade on the spindle with one to be used for the workpiece; a step for machining the workpiece with the hubless blade that has been installed through the automatic replacement on the spindle; and a step for recycling the gripping part of the hubless blade that has reached a friction limit through machining of the workpiece.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
10.
TEMPERATURE REGULATION SYSTEM AND CIRCULATION UNIT
The objective of the present invention is to provide a temperature regulation system that can rapidly cool a chuck. Provided is a temperature regulation system for a prober having a chuck for holding a wafer, the temperature regulation system comprising: a cooling unit having a refrigerating machine for cooling an inflowing coolant and a storage tank disposed on the coolant outflow side of the refrigerating machine and capable of storing the coolant cooled by the refrigerating machine; a supply channel for supplying the coolant cooled by the cooling unit to the chuck; a recovery channel along which the coolant flowing out from the chuck is recovered into the cooling unit; a bypass channel connecting the supply channel and the recovery channel; and a switching part, provided at a first connection part between the supply channel and the bypass channel, that switches between a first circulation channel along which the coolant cooled by the cooling unit is circulated through the supply channel, the chuck, and the recovery channel without going through the bypass channel and a second circulation channel along which the coolant cooled by the cooling unit is circulated through the supply channel, the bypass channel, and the recovery channel without going through the chuck.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
11.
LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING DEVICE
Provided is a laser beam machining method for forming a modified region by irradiating the interior of a wafer with a laser beam, the laser beam machining method including a first irradiation step for irradiating a first street of the wafer with the laser beam, and a second irradiation step for irradiating a second street that crosses the first street with the laser beam after the first irradiation step, where, in the second irradiation step, the total output of the laser beam at the intersection of the first street and the second street is changed.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
B23K 26/064 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples au moyen d'éléments optiques, p. ex. lentilles, miroirs ou prismes
B23K 26/067 - Division du faisceau en faisceaux multiples, p. ex. foyers multiples
Provided is a chamfering device 100 for grinding a peripheral edge of a wafer into a predetermined shape, the chamfering device comprising: a grinding wheel 16 that rotates around a first axis and abuts its peripheral edge to the peripheral edge of the wafer to grind the peripheral edge of the wafer; a tool 2 that rotates around a second axis and abuts its peripheral edge to the peripheral edge of the grinding wheel to adjust the shape of the peripheral edge of the grinding wheel; and a control device 30 that adjusts a relative position between the tool and the grinding wheel so that a locus of movement of an abutting position between the peripheral edge of the tool and the peripheral edge of the grinding wheel is the same as the predetermined shape. This device provides a chamfered wafer having an excellent shape accuracy or surface quality.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet
B24B 53/00 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives
B24D 3/06 - Propriétés physiques des corps ou feuilles abrasives, p. ex. surfaces abrasives de nature particulièreCorps ou feuilles abrasives caractérisés par leurs constituants les constituants étant utilisés comme agglomérants et étant essentiellement inorganiques métalliques
B24D 5/00 - Meules agglomérées, ou meules comportant des segments abrasifs rapportés, conçues pour travailler uniquement par leur périphérieBagues ou accessoires pour le montage des ces meules
13.
CHAMFERING DEVICE FOR WAFER, AND CHAMFERING METHOD
Disclosed is a chamfering device for a wafer, which is provided with a crystal orientation measurement instrument 24 for measuring the crystal orientation of a wafer, and which repeats grinding of a peripheral edge of the wafer until the consistency between an alignment mark of the wafer and the crystal orientation satisfies a predetermined criterion. Consequently, this chamfering device can eliminate mismatching between the alignment mark and the crystal orientation.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
This crack measuring instrument is for detecting a crack generated inside a workpiece, and comprises: a light source unit that emits detection light along a light source optical axis which is parallel to a main optical axis and is eccentric with respect to the main optical axis; a condenser lens that condenses the detection light emitted from the light source unit within the workpiece; a condensing point changing unit that changes the condensing point of the condenser lens in the thickness direction of the workpiece; a bifurcation unit that is disposed at a position conjugate with the condensing point of the condenser lens and bifurcates light passing through a specific region; a detector that detects one of light components, of the detection light, that have been bifurcated by the bifurcation unit after the detection light is reflected at the interface of the workpiece, and that outputs a detection signal on the basis of the detection result; and a control unit that detects the position of the interface and the depth of the crack on the basis of the position of the condensing point of the condenser lens and the detection signal.
Provided are a grinding performance determination device and grinding performance determination method that enable grinding performance to be accurately determined. The grinding performance determination method includes: an extraction step in which an AE signal output from an AE sensor (104) provided on a grinder (100) is acquired, the AE signal is processed, and a micro feature amount of the AE signal is extracted; and a determination step in which the micro feature amount extracted in the extraction step is input to an AI model, which has been trained by inputting a micro feature amount of an AE signal for training, and information indicating the grinding performance of the grinder is output.
B24B 49/18 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la présence d'outils à dresser
B23Q 17/09 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer la pression de coupe ou l'état de l'outil de coupe, p. ex. aptitude à la coupe, charge sur l'outil
B24B 7/00 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 53/00 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives
G05B 19/4155 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par le déroulement du programme, c.-à-d. le déroulement d'un programme de pièce ou le déroulement d'une fonction machine, p. ex. choix d'un programme
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
16.
DICING APPARATUS AND TRIMMING METHOD FOR DICING APPARATUS
The purpose of the present invention is to provide a dicing apparatus capable of high-precision trimming of a workpiece having devices. The dicing apparatus is provided with a chuck table, a rotation table, a microscope, a displacement sensor, a cutting unit, and a control unit that controls movement of the chuck table, the rotation table, the microscope, and the displacement sensor on the basis of measurement results from the microscope and the displacement sensor. The workpiece includes a plurality of devices disposed in regions partitioned by a plurality of first groove portions extending in the X direction and a plurality of second groove portions extending in the Y direction. The control unit acquires, with respect to a specific portion of prescribed devices positioned outward in the radial direction about the Z axis among the devices on the workpiece, workpiece position information along the entire circumference regarding a normal-direction position at circumferential positions about the Z axis on the basis of the measurement results from the displacement sensor, and causes a blade to cut a step portion recessed in the Z direction in the outer peripheral portion of the workpiece on the basis of the acquired workpiece position information.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
Provided is a grinding device capable of improving the efficiency of blade adjustment work, including adjustment of a blade. This grinding device comprises: a table 11 for holding a wafer; one or a plurality of blades 12a, 12b for cutting the wafer 1 as a result of the blades being rotated by spindles; three or more adjustment parts 17a, 17b, 18a, 18b having a region for adjusting the blades; and movement parts for moving the adjustment parts 17a, 17b, 18a, 18b and the blades 12a, 12b relative to one another.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
This semiconductor manufacturing device comprises: a conveyance mechanism that conveys a semiconductor wafer; a chuck table on which the semiconductor wafer is placed and held by suction; a pre-suction mechanism that is provided to the chuck table and that temporarily fixes the semiconductor wafer placed on the chuck table; and a pressing mechanism that presses the surface of the semiconductor wafer temporarily fixed to the chuck table.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
This transfer arm is provided with: a plurality of air discharge ports (13, 14) that open to a lower surface (12) of an arm top plate (11); and a slope part (15) that is provided on the lower surface (12) and that inclines outward in the radial direction toward the lower side. When a wafer W is sucked and moved toward the lower surface (12), the slope part (15) can come into contact with the outer peripheral part of the wafer W. The plurality of air discharge ports (13, 14) have: an outer air discharge port (13) that faces the outer peripheral part of the wafer W from above; and an inner air discharge port (14) that is disposed inward in the radial direction of the outer air discharge port (13). The pressure of air discharged from the outer air discharge port (13) is smaller than the pressure of air discharged from the inner air discharge port (14).
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
B65G 49/06 - Systèmes transporteurs caractérisés par leur utilisation à des fins particulières, non prévus ailleurs pour des matériaux ou objets fragiles ou dommageables pour des feuilles fragiles, p. ex. en verre
B65G 49/07 - Systèmes transporteurs caractérisés par leur utilisation à des fins particulières, non prévus ailleurs pour des matériaux ou objets fragiles ou dommageables pour des plaquettes semi-conductrices
20.
CHARGE AND DISCHARGE TEST SYSTEM, CHARGE AND DISCHARGE TEST METHOD, AND CONTROL DEVICE
Provided are a charge and discharge test system, a charge and discharge test method, and a control device capable of reducing power loss associated with conversion of power charged and discharged by a charge and discharge body. A charge and discharge system 1 comprises: an AC/DC converter 20 that converts first power into second DC power; a bidirectional DC/DC converter 30 that has one end connected to the AC/DC converter 20 via a bus BS, has the other end connected to a charge and discharge body BT to be subjected to a charge and discharge test, and converts second DC power converted by the AC/DC converter 20 into third DC power or converts power discharged by the charge and discharge body BT into the second DC power; a capacitor 40 connected to the bus BS; and a control device 10 that controls at least one operation of the AC/DC converter 20 and the bidirectional DC/DC converter 30.
Provided is an inner diameter measuring apparatus that can obtain an accurate measurement result, while being mounted on a robot arm even in an environment in which large electromagnetic noise occurs. An inner diameter measuring apparatus is mounted on a tip part of a robot arm in a detachable manner to measure an inner diameter of a hole formed in a workpiece. The inner diameter measuring apparatus includes at least two contactors and a data conversion and transmission part. The at least two contactors are in contact with an inner wall face of the hole formed in the workpiece. The data conversion and transmission part converts analog data about displacements of the at least two contactors into digital data representing the inner diameter of the hole and transmits the digital data to an external device.
A temperature control device, a temperature control method, a program, a prober, and a learning model generating method that can implement automatic adjustment of a chuck temperature control parameter are provided. The temperature control device includes a chuck temperature acquiring unit that acquires a chuck temperature, a classifying unit which outputs a temperature change pattern in a case where the chuck temperature is input, using a learned model generated through learning with a correspondence relationship between features of changes in the chuck temperature and temperature change patterns, and a temperature control parameter setting unit that derives a temperature control parameter corresponding to the temperature change pattern output from the classifying unit and sets the temperature control parameter, and operation of a chuck temperature adjusting unit that adjusts the chuck temperature is controlled using the temperature control parameter.
H05B 1/02 - Dispositions de commutation automatique spécialement adaptées aux appareils de chauffage
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H05B 3/28 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes non flexibles le conducteur chauffant enrobé dans un matériau isolant
23.
OWN-POSITION ESTIMATING DEVICE, OWN-POSITION ESTIMATING METHOD, AND CAMERA RELATIVE POSITION ADJUSTING METHOD
Provided are an own-position estimating device and an own-position estimating method capable of improving the precision of own-position estimation without using a wide-angle lens. An own-position estimating device (50) comprises: an image acquiring unit (60) that acquires a plurality of images obtained by imaging target groups (14A, 14B) using a plurality of cameras (20A, 20B), respectively, that are mounted on a probe head (12) and that have mutually different imaging directions; and an own-position estimating unit (62) that detects the position and orientation of the probe head (12) on the basis of the plurality of images.
Provided are a diagnostic device, a diagnostic method, and a needle mark inspection device with which it is possible to objectively ascertain a state of an inspection device and easily specify an abnormality factor. This diagnostic device is a device for diagnosing a state of an inspection device (10) that inspects electrical characteristics by bringing a probe needle of a probe card into contact with an electrode pad of each chip formed on a wafer, the diagnostic device comprising: a shape data acquisition unit (120) for acquiring three-dimensional shape data of a surface of the electrode pad after the inspection is performed; a detection processing unit (122) for detecting needle mark position data indicating a position of a probe needle mark formed on the electrode pad on the basis of the three-dimensional shape data; a diagnostic processing unit (116) for generating diagnostic information for diagnosing whether there is an abnormality in the inspection device on the basis of the needle mark position data; and a diagnostic information output unit (128) for outputting the diagnostic information.
An inspection device includes: a camera configured to capture an image of an inspection object on a wafer; a first determining unit configured to detect the inspection object from the image captured by the camera and make a tentative determination of quality of the inspection object; a three-dimensional shape measuring machine configured to measure a three-dimensional shape of the inspection object determined to be abnormal by the tentative determination; and a second determining unit configured to make a formal determination of the quality of the inspection object based on the three-dimensional shape of the inspection object measured by the three-dimensional shape measuring machine and the image captured by the camera or based on the three-dimensional shape of the inspection object measured by the three-dimensional shape measuring machine.
A prober 1 inspects the electrical characteristics of a device formed on a wafer W. The prober 1 comprises: a housing 2 in which an inspection area 10 to be inspected is formed; a first supply unit for supplying dry gas to the inspection area 10 as a whole; a second supply unit for locally supplying dry gas to a portion of the inspection area; and a control unit 20 for controlling dry gas supplied by each supply unit.
This laser processing device includes: a light source that emits a processing laser beam onto a workpiece to form a modified region inside the workpiece, a focusing lens that focuses the processing laser beam on the workpiece, and a lens driving means for moving the focusing lens to displace the focusing point of the processing laser beam in the thickness direction of the workpiece, and also includes an upper surface height position detection means for detecting the upper surface height position of the workpiece, and a crack detection means for detecting the crack depth of a crack formed inside the workpiece. The upper surface height position detection means detects the upper surface height position when the workpiece is processed with the processing laser beam, and the crack detection means detects the lower surface height position of the workpiece on the basis of an actual refractive index and the upper surface height position of the workpiece.
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
This machining apparatus comprises: a machining laser irradiation device that emits a machining laser beam while moving in the traveling direction along a plurality of dicing streets that extend in at least one direction of a wafer; a coaxial height detection unit that has the same optical axis as the machining laser beam, irradiates the surface of the wafer with a detection laser beam, and detects the height position of the surface of the wafer on the basis of the reflected light of the detection laser beam; a front height detection unit that is positioned forward with respect to the machining laser irradiation device; and a rear height detection unit that is positioned at the rear on the opposite side from the front with respect to the machining laser irradiation device, wherein the front height detection unit and the rear height detection unit are movable in the parallel direction of the plurality of dicing streets, and detect the height positions of the dicing streets.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
B23K 26/046 - Focalisation automatique du faisceau laser
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
G01B 11/02 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur
29.
OWN-POSITION ESTIMATING DEVICE AND OWN-POSITION ESTIMATING METHOD
Provided is an own-position estimating device and an own-position estimating method capable of estimating the own-position of a probe head with a high degree of precision, while facilitating association of a target in a three-dimensional space with a target in an image. An own-position estimating device (50) comprises: a relative position information detecting unit (target group position information detecting unit (56) and probe head position information detecting unit (58)) that detects relative position information indicating the relative positional relationship between a probe head (12) and a target group (14) including a plurality of targets (24); an image acquiring unit (60) that acquires an image of the target group (14) captured by a camera (20) mounted on the probe head (12); and a high-precision own-position estimating unit (62) that uses the relative position information and the image to detect the position and orientation of the probe head (12) with respect to the target group (14) with a higher degree of precision than the relative position information.
Provided are an own-position estimating device and an own-position estimating method capable of performing own-position estimation of a camera over a wide range. An own-position estimating device (50) comprises: an image acquiring unit (60) that acquires an image, captured by a camera (20), of a target plate (14) having a plurality of target groups; a feature point detecting unit (62) that detects a feature point indicating the position of each target of the target groups from the image; and an own-position estimating unit (64) that detects the position and orientation of the camera (20) on the basis of an error function indicating a correspondence relationship between each feature point detected by the feature point detecting unit (62) and a target point indicating the position of each target of the target groups.
Provided are a calibration method and a calibration device that can easily obtain a relative positional relationship between a probe head and a stylus ball. The calibration method includes: a movement step of moving a stylus ball of a probe head along a path on the surface of a calibration ball in a state in which the stylus ball is in contact with the surface of the calibration ball; a self-position estimation step of detecting the position and attitude of the probe head on the basis of images that a camera mounted on the probe head has captured of a target group while the movement step is being performed; and a calibration step of obtaining a relative positional relationship between the probe head and the stylus ball on the basis of the detection result of the self-position estimation step.
G01B 5/008 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer les coordonnées de points en utilisant des machines de mesure de coordonnées
G01B 5/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
A prober according to an embodiment tests the electrical characteristics of semiconductor devices formed on a wafer. The prober includes: a plurality of areas for each of which a set dew point for preventing dew condensation is set, the set dew points being different from each other; a supply unit that supplies dry gas to the respective areas; and a controller that controls supply of the dry gas from the supply unit. The controller controls supply of the dry gas to the respective areas so that dew points in the respective areas become the set dew points.
This method for surface treatment of a chuck for a wafer testing device is for treating a surface of a disk-shaped chuck which is provided to the wafer testing device and which holds a wafer by means of vacuum suction. The chuck has an upper surface on which the wafer is placed, and a recess formed of a groove, a step, or a hole which is recessed from the upper surface. The method for treating the surface of the chuck comprises in order: a blast polishing step (S1) for performing blast polishing on the outer circumferential part of the upper surface; an electrolytic polishing step (S3) for performing electrolytic polishing on the chuck; and a chemical polishing step (S4) for performing chemical polishing on the chuck.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
34.
MEASUREMENT DEVICE AND METHOD FOR CONTROLLING MOBILE BODY
Provided are a measurement device and a method for controlling a mobile body capable of suppressing the occurrence of a defect caused by the movement of a mobile body. A method for controlling a mobile body (10, 10C, 200, 500) comprises: a step for detecting a bending amount of a collision detection sensor (80, 80A, 82, 82A, 82B, 90, 202, 210, 512) that is attached to a mobile body included in a measurement device (1, 1A, 1B, 1C) and has lower rigidity than the mobile body; and a step for performing movement control of the mobile body in accordance with the bending amount.
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01P 15/00 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération
A prober according to the present invention is characterized by comprising an XY stage 22 on which is provided a Zθ stage 21 on which is provided a wafer chuck 20, guides 41 that guide drive shafts for the X-axis, Y-axis, Z-axis, and θ-axis directions of the wafer chuck, a prober control unit 10 that drives motors, drives the XY stage in the XY-axis directions to a prescribed position that corresponds to a device measurement instrument 29, and raises the Zθ stage in the Z-axis direction to bring an electrode pad into electrical contact with a probe needle 26, and a brake that is affixed to at least one of the guides and holds the drive shaft at which the brake is affixed to fix the drive shaft to the guide. The prober is also characterized in that the motors have a motor excitation brake function, and after the electrode pad has been brought into contact with the probe needle, the prober control unit turns on the brake and turns off the motor excitation brake of the motor that corresponds to the drive shaft at which the brake is affixed. The prober thereby makes it possible to greatly reduce power consumption, improve positioning precision, and achieve high-precision contact, high-speed needle track inspection function, and high speed/low vibration.
Provided is a machining device capable of precisely measuring a shape of a machined workpiece. The machining device includes: a table configured to hold a workpiece on a holding surface perpendicular to a Z-axis; a machining unit configured to machine the workpiece on the table; an imaging unit configured to image a surface of the workpiece using an optical interferometry; a drive unit configured to move the imaging unit along a direction of the Z-axis relative to the table; and an imaging control unit configured to control the drive unit and the imaging unit to image the surface of the workpiece on the table through scanning in the direction of the Z-axis. The imaging control unit picks up an image of the surface of the workpiece through scanning in the direction of the Z-axis, in accordance with an imaging condition determined for each site to be imaged.
A prober 100 for executing an electric test on a wafer includes: a wafer chuck 20 having a holding surface for holding a wafer W; a probe card 25 having a plurality of probes 26 on a surface facing the holding surface; an alignment device for positioning the wafer chuck with respect to the probe card; and a control device. The control device includes a memory, a processor, and a program stored in the memory and configured to be executable by the processor. The program includes a command for switching position control for the alignment device from full-closed control to semi-closed control at a first timing related to the start of the electric test. This prober makes it possible to perform alignment with high accuracy even when performing high-voltage measurement.
To make an improvement in the shape accuracy of a wafer shaped in the grinding operation after pretreatment and make an improvement in the efficiency of grinding operation of a wafer. A grinding apparatus includes at least one plasma generator configured to irradiate, before an outer circumferential edge of a wafer is ground, at least part of the outer circumferential edge with plasma.
B24B 9/06 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière propre aux objets à meuler de matière inorganique non métallique, p. ex. de la pierre, des céramiques, de la porcelaine
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
H01J 37/32 - Tubes à décharge en atmosphère gazeuse
This inspection device is provided with: a light source unit for irradiating, with light, a wafer having a surface covered with a protection film; a light-receiving unit for receiving reflection light from the wafer or fluorescence emitted as a result of absorption of the light by an additive included in the protection film; a position adjustment means for moving the wafer relative to a measurement unit comprising the light source unit and the light-receiving unit to thereby scan the irradiation position on the wafer; and an analysis unit for analyzing at least an image of the outer circumferential region of the wafer to evaluate the application state of the protection film. The inspection device makes it possible to execute detection of the application state of a protection film on a wafer, which has the protection film layered thereon, with high resolution or in a short period of time.
voptopt)); a measured object information acquiring unit (wafer information acquiring unit (34)) that acquires measured object information (wafer information (29)); and a temperature calculating unit (36) that calculates the temperature of the measured object on the basis of the second thickness and the measured object information.
G01K 11/125 - Mesure de la température basée sur les variations physiques ou chimiques, n'entrant pas dans les groupes , , ou utilisant le changement de couleur, de translucidité ou de réflectance utilisant les changements de réflectance
42.
CHARGE/DISCHARGE TEST SYSTEM AND CONTROL METHOD FOR CHARGE/DISCHARGE TEST SYSTEM
A charge/discharge test system includes a bidirectional AC/DC converter connected to an AC power supply (an AC power supply), an isolated bidirectional DC/DC converter that has one end connected to a first DC bus and the other end connected to a second DC bus, a plurality of non-isolated bidirectional DC/DC converters that have one ends connected to the second DC bus and the other ends connected to charge/discharge targets (batteries) different from each other, and a charge/discharge controlling unit (ET control unit). The charge/discharge controlling unit charges power output from at least one of the charge/discharge targets via the non-isolated bidirectional DC/DC converter into at least one of the charge/discharge targets via the second DC bus and at least one of the non-isolated bidirectional DC/DC converters.
A charge/discharge test system includes: a plurality of charge/discharge test devices configured to perform charging and discharging of charge/discharge targets; a switching circuit capable of switching between combinations of electrical connection between one or more of the charge/discharge test devices and one or more of the charge/discharge targets, and a control unit configured to control the switching circuit to execute switching between the combinations.
G01R 31/3842 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge combinant des mesures de tension et de courant
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
44.
CALIBRATION METHOD AND CALIBRATION DEVICE FOR CAMERA
This calibration method for a camera includes: an image acquisition step for acquiring a plurality of calibration images obtained by imaging, with a camera, a dot pattern in which a plurality of dots are disposed periodically; a pattern information setting step for setting pattern information including information on the disposition of the dots; a feature point detection step for detecting feature points indicating the positions of the dots by using the calibration images; and a parameter calculation step for calculating parameters for the camera on the basis of the feature points and the pattern information. The feature point detection step involves detecting, as the feature points, gravity center positions of the dots on the basis of projection images obtained by projecting, onto virtual planes VP set within a three-dimensional space, the outlines of dot images DI on image planes IP of the calibration images.
In a tool holder attachment state detection method of the present invention, during setup, a tool holder 11 is attached to a spindle 26 without any chuck error, counting of the number of notches 11C formed in a flange portion 11B is started after the rotation of a tool 9 is started, and a time T taken to obtain measurement data from the notch 11C detected last and a count N at that time are stored, and during machining, measurement data is obtained by making the count N and the time T correspond to each other by the same procedure as during setup. Therefore, regardless of sensor types, the number of notches, shape accuracy, environment, and the like, this method easily and accurately matches the phases of measurement data during setup and machining, and improves the detection accuracy of chuck errors.
B23Q 17/00 - Agencements sur les machines-outils pour indiquer ou mesurer
B23Q 17/22 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer la position réelle ou désirée de l'outil ou de la pièce
46.
SHAPE MEASUREMENT DEVICE, SHAPE MEASUREMENT METHOD, AND WAFER PROCESSING SYSTEM
Provided is a shape measurement method for measuring the shape of a surface subject to measurement at an end part of a wafer, the shape measurement method comprising: generating measurement data indicating the shape of a notch part formed on the surface subject to measurement, the measurement data being generated on the basis of the coordinates of a point cloud obtained by repeatedly imaging the notch part by using an imaging part when an optical unit (104) is moved relative to the surface subject to measurement, the optical unit (104) having a light source part that has an optical axis parallel to the main surface of the wafer and irradiates the surface subject to measurement with measurement light along the optical axis, and the imaging part, which is used in imaging reflected light from the surface subject to measurement; and performing shape analysis of the notch part on the basis of the measurement data.
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
[Solution] A shape measurement device for acquiring a plurality of surface images while scanning a surface of a plate-shaped measurement object 1 and measuring a shape of the measurement object 1 includes: an imaging system 10 that irradiates the measurement object 1 with parallel light and acquires the surface image; a stage system 30 that holds the measurement object 1 and adjusts an attitude of the measurement object 1 with respect to the imaging system 10; and a control device 20. The control device 20 includes: an attitude adjustment unit 21 that controls the imaging system 10 and the stage system 30 to scan the surface while adjusting the attitude to obtain a plurality of surface images; and an image processing unit 22 that generates a restored model of a three-dimensional shape of the measurement object 1 from the plurality of acquired surface images. When acquiring the surface image, the attitude adjustment unit 21 adjusts the attitude so that an angle of incidence of the parallel light onto the surface falls within a predetermined range. According to the shape measurement device, it is possible to measure the shape of a plate-shaped measurement object, particularly a notch portion of a wafer having a complicated shape, with higher accuracy.
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
G06T 7/593 - Récupération de la profondeur ou de la forme à partir de plusieurs images à partir d’images stéréo
H04N 23/695 - Commande de la direction de la caméra pour modifier le champ de vision, p. ex. par un panoramique, une inclinaison ou en fonction du suivi des objets
48.
WAFER PROCESSING SYSTEM AND WAFER PROCESSING METHOD
A wafer processing system (10) comprises: a grinding unit (16) for subjecting an edge portion of a wafer to a grinding processing; a measuring unit (20) for measuring the shape of the edge portion of the ground-processed wafer, the measuring unit measuring the shape of the edge portion of a truer used in the grinding processing; and a feedback calculating unit (152) for performing feedback to the grinding processing on the basis of a measurement result of the shape of the edge portion of the truer.
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet
B24B 53/00 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives
B24B 53/07 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives des meules profilées utilisant des outils de forme complémentaire de celle à réaliser, p. ex. blocs, rouleaux profilés
09 - Appareils et instruments scientifiques et électriques
Produits et services
Length measuring gauges; comparators, non-electronic;
interferometers; screw-thread measuring machines and
instruments; flatness measurement machines and instruments;
straightness measurement machines and instruments; precision
measurement machines and instruments; laboratory apparatus
and instruments; optical machines and apparatus; measuring
machines and instruments; surface roughness measurement
machines and instruments; measuring machines and instruments
for manufacturing semi-conductors; optical machines and
apparatus for manufacturing semiconductor; telecommunication
machines and instruments; electronic data recorders for
recording measured values.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Precision measuring machines and instruments; roundness
measurement machines and instruments; cylindrical shape
measurement machines and instruments; measuring machines and
instruments for semiconductor manufacturing; measuring
machines and instruments; optical machines and apparatus for
semiconductor manufacturing; optical machines and apparatus;
laboratory apparatus and instruments; telecommunication
machines and instruments; electronic data recorders for
recording measured values.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Precision measuring machines and instruments; laboratory
apparatus and instruments; optical machines and apparatus;
electronic data recorders for recording measured values;
automatic control machines and instruments for measurement
and analysis of semiconductor device characteristics;
testing apparatus for semiconductors; measuring machines and
instruments; photographic apparatus and instruments;
cinematographic machines and apparatus; surface roughness
measuring machines and instruments; portable surface
roughness measurement machines and instruments; measuring
machines and instruments for semiconductor manufacturing;
optical machines and apparatus for semiconductor
manufacturing; telecommunication machines and instruments.
52.
NON-CONTACT SHAPE MEASURING APPARATUS AND POSITION ADJUSTING METHOD
Provided are: a sensor head (20); a light-receiving sensor (36) in which an incident position of reflected light (LA) on a light-receiving surface (36a) changes in accordance with the distance between the sensor head (20) and a measurement surface (Wa); a distance measurement unit (46) that measures the distance on the basis of the incident position of the reflected light (LA) on the light-receiving surface (36a); and a movement mechanism (C-axis movement mechanism (16)) that moves the sensor head (20) or the measurement surface (Wa) toward or away from the other along a movement axis (C-axis (14)). A measurement range (WR) is determined in advance at a position separated from the sensor head (20) in the emission direction of measurement light (L), and the light-receiving surface (36a) has a size at which the reflected light (LA) can be received even when the sensor head (20) or the measurement surface (Wa) is brought close to the other by the movement mechanism up to a position at which the measurement surface (Wa) is included within a proximity range (SR).
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
G01C 3/06 - Utilisation de moyens électriques pour obtenir une indication finale
09 - Appareils et instruments scientifiques et électriques
Produits et services
Precision measuring machines and instruments for uses in the nature of surface texture, contour, roundness and cylindrical profile, and 3D coordinate measuring; Precision measuring machines and instruments for uses in the nature of surface texture, contour, roundness and cylindrical profile, and 3D coordinate measuring used in conjunction with corresponding computer network software; Computer software for surface texture, contour, roundness and cylindrical profile, and 3D coordinate measuring used in conjunction with precision measuring machines and instruments; Computer software for operating precision measuring machines and instruments for uses corresponding to computer networks; Computer software for analyzing surface texture, contour, roundness and cylindrical profile; Computer software; Electronic machines, apparatus and their parts; Measuring machines and instruments
Semiconductor manufacturing devices; sharpeners for semiconductor manufacturing devices; grinding whetstones for metalworking [parts of machines or tools for machines]; polishing whetstones for metalworking [parts of machines or tools for machines]; grinding whetstones for stones [parts of machines or tools for machines]; cutting whetstone for stones [parts of machines or tools for machines]; polishing whetstones for stones [parts of machines or tools for machines]; grinding whetstones for plastics [parts of machines or tools for machines]; cutting whetstones for plastic [parts of machines or tools for machines]; polishing whetstones for plastics [parts of machines or tools for machines]; grinding whetstones for glass [parts of machines or tools for machines]; cutting whetstones for glass [parts of machines or tools for machines]; polishing whetstones for glass [parts of machines or tools for machines]; cutting whetstones for woodworking [parts of machines or tools for machines]; grinding whetstones for woodworking [parts of machines or tools for machines]; polishing whetstones for woodworking [parts of machines or tools for machines]; dressing tools for blades [parts of machines or tools for machines]; plate for blade truing and blade dressing [parts of machines or tools for machines].
09 - Appareils et instruments scientifiques et électriques
10 - Appareils et instruments médicaux
37 - Services de construction; extraction minière; installation et réparation
Produits et services
X-ray computed tomography [CT] scanners, not for medical
purposes; non-destructive inspection apparatus; X-ray
apparatus for measurement; X-ray apparatus; non-destructive
inspection apparatus using X-rays; shape measurement
machines and instruments; laboratory apparatus and
instruments; photographic apparatus and instruments;
cinematographic machines and apparatus; measuring machines
and instruments; precision measuring machines and
instruments; computers; computer peripherals; computer
programs; data processors; 3D scanners; material testing
instruments and machines; telecommunication machines and
instruments. X-ray computed tomography [CT] scanners. Repair or maintenance of X-ray computed tomography [CT]
scanners; repair or maintenance of non-destructive
inspection apparatus; repair or maintenance of electronic
machines and apparatus; repair or maintenance of
telecommunication machines and apparatus; repair or
maintenance of power distribution or control machines and
apparatus; repair or maintenance of laboratory apparatus and
instruments; repair or maintenance of measuring and testing
machines and instruments; repair or maintenance of computers
(including central processing units, electronic circuits and
magnetic disks that store computer programs, and other
peripherals).
A cleaning device for a wafer-suction chuck mechanism capable of automatically and simply performing cleaning treatment on a chuck surface that suction-holds a wafer and cleaning treatment on a frame suction-holding section. The cleaning device is configured to include a scraper 17 and a brush 18 that press frame suction-holding section cleaning means 10B for removing a sludge on a frame suction-holding section 11B onto the frame suction-holding section 11B, and a water nozzle 19 that discharges and supplies water onto the frame suction-holding section 11B.
A three-dimensional shape measuring device includes: an interference objective lens including an interfering unit configured to separate part of measurement light as reference light and generate multiplexed light of the measurement light returning from the surface to be measured and the reference light returning from a reference surface, and an objective lens configured to cause the measurement light to focus on the surface to be measured; a scanning unit configured to cause the interference objective lens to scan relatively with respect to the surface to be measured; an image capturing unit configured to repeatedly capture an image of the multiplexed light and output a plurality of captured images during scanning; and a first signal processing unit configured to calculate the three-dimensional shape of the surface to be measured, based on a result of comparing the sharpness of each pixel on the same coordinate of the plurality of captured images.
A wafer chuck having a holding surface for holding a wafer, the wafer chuck includes: a heating and cooling unit configured to heat or cool the wafer chuck; at least one temperature sensor disposed in the wafer chuck; and a heat flow sensor which is disposed in the wafer chuck, and in which a plurality of thermocouples are connected in series and connecting parts between thermocouples adjacent to each other are alternately disposed at a first depth position from the holding surface and at a second depth position deeper than the first depth position. The heat flow sensor has a plurality of temperature measurement points provided for the respective thermocouples, and the plurality of temperature measurement points are disposed over an entirety of the wafer chuck when the wafer chuck is seen in plan view.
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
The laser light correction method includes: a step of performing trimming machining on a positioning workpiece in which a laser irradiation surface includes a material that facilitates detection of a laser-irradiation mark, the trimming machining in which a split laser is focused on the laser irradiation surface via a laser optical system while moving the laser optical system in the machining feed direction relative to the positioning workpiece to form a first groove having two rows parallel to each other in a machining feed direction, and performing hollowing machining in which a line laser is focused on the laser irradiation surface via the laser optical system to form a second groove; a step of detecting the first groove and the second groove by a microscope; and a step of correcting focus positions of the split laser and the line laser based on detection results of the first and second grooves.
Provided are a method and a device for adjusting an optical axis of laser light, capable of accurately grasping change in the state of the laser light and maintaining the quality of laser processing. The method for adjusting an optical axis of laser light includes: a step of detecting a position of laser light by position sensitive detectors arranged at two or more detection positions on an optical path of the laser light that is output from a laser light source toward a workpiece; and a step of adjusting, based on the detected position of the laser light, at least one of a position and an angle of optical elements arranged at two or more positions on the optical path of the laser light, to adjust an optical axis of the laser light.
To provide an expansion retaining ring that may maintain an annular shape of a ring body while ensuring flexibility of a ring-shaped lip. The expansion retaining ring includes a ring body and a ring-shaped lip formed of a material softer than the ring body, the ring-shaped lip being able to be detachably attached to an outer circumferential surface of the ring body and protruding outward from the outer circumferential surface of the ring body.
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
Provided is a dicing device capable of favorably performing a maintenance work, even when a workpiece is large. A dicing device includes a housing that accommodates inside thereof, a worktable configured to hold and move a workpiece, and a spindle configured to be rotatable while holding a blade, wherein the housing has: an end face provided in a moving direction of the worktable, the end face being on a side where a maintenance work of the dicing device is performed; and a slider constituting a part of the end face, and the slider is configured to be freely slidable in a direction to shorten a distance from the end face to the spindle.
B28D 5/02 - Travail mécanique des pierres fines, pierres précieuses, cristaux, p. ex. des matériaux pour semi-conducteursAppareillages ou dispositifs à cet effet par outils rotatifs, p. ex. par forets
63.
LASER OPTICAL SYSTEM AND ADJUSTMENT METHOD THEREFOR, AND LASER MACHINING DEVICE AND METHOD
A laser optical system and an adjustment method therefor, and a laser machining device and method capable of adjusting laser light so as to satisfy criteria of laser machining are provided. The adjustment method of a laser optical system including a plurality of optical element units which are arranged in series on an optical path of laser light and each of which includes a half-wave plate and a Wollaston prism, the laser optical system configured to branch the laser light incident on the Wollaston prism through the half-wave plate into two beams of branched laser light, includes a step of rotating the half-wave plate around the optical path to adjust branching ratios of the branched laser light and a step of rotating the Wollaston prism around the optical path to adjust branching directions of the branched laser light.
A surface shape measurement device includes: a first image capturing system configured to capture a first captured image of a measurement object while scanning relative to the measurement object; a second image capturing system that is separate from the first image capturing system and configured to capture a second captured image of the measurement object or a support body thereof in synchronization with the first image capturing system; a calculating unit configured to calculate a surface shape of the measurement object based on first captured images; a storage unit configured to store coordinate system transformation information for transforming a second coordinate system to a first coordinate system; a displacement detecting unit configured to detect displacement of the measurement object based on second captured images; and a correcting unit configured to correct the surface shape based on a detection result of the displacement and on the coordinate system transformation information.
The shape measuring device includes: a relative movement unit that relatively moves a probe along a surface to be measured and scans the surface with measurement light; a detecting unit that, while the relative movement is performed, repeatedly detects, multiplexed light generated by a multiplexing unit for each of measurement point of the surface on which the measurement light is incident; a distance calculating unit that detects a beat frequency from a detection signal of the multiplexed light detected by the detecting unit and calculates a distance from the probe to the measurement point based on the beat frequency for each measurement point; a position calculating unit that calculates a position of each measurement point; and a position correcting unit that corrects the position of the measurement point based on a Doppler shift amount of the measurement light reflected at the measurement point, for each measurement point.
A sheet release apparatus that stably releases a protective sheet from an adherend without damaging the adherend. A sheet release apparatus includes a conveyance table that is movable in a predetermined movement direction with an adherend held therein and a heat stamp that bonds a release tape to a protective sheet, in which the heat stamp includes a plurality of stamp heads that each contact the release tape to press the release tape toward the protective sheet.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A workpiece processing apparatus that prevents a processing capability of a processing apparatus from deteriorating due to a peeling unit that peels a protective sheet from a workpiece. A workpiece processing apparatus includes an affixing unit that affixes a dicing tape to a workpiece and a dicing frame, and a plurality of peeling units that peel a protective sheet previously affixed to the workpiece from the workpiece integrated with the dicing frame via the dicing tape.
A three-dimensional shape measuring device includes a holder that changes the reference light path length in response to temperature change, and a temperature adjusting unit that adjusts a temperature of the holder to a target temperature, so as to make a measurement light path length equal to a reference light path length with high accuracy at low cost regardless of a temperature of an installation environment. A three-dimensional shape measuring device includes a temperature adjusting unit that adjusts the temperature of the holder and a temperature control unit that controls the temperature adjusting unit so as to selectively switch a measurement mode between a first measurement mode in which the reference light path length is made equal to a measurement light path length and a second measurement mode in which the reference light path length is made different from the measurement light path length.
A surface shape measuring device includes a camera that captures the observation image acquired by the optical head, a drive unit that causes the optical head to scan relatively in a scanning direction perpendicular to the measurement target, an encoder for detecting a position of the optical head in the scanning direction with respect to the measurement target, an imaging instructing unit that instructs the camera to capture the observation image based on a position signal output from the encoder for each predetermined interval, a frame dropping occurrence rate calculating unit that calculates a frame dropping occurrence rate indicating an occurrence rate of frame dropping of the camera, and a measurement condition setting unit that sets a measurement condition for measuring a surface shape of the measurement target based on the frame dropping occurrence rate.
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
G01D 5/347 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens optiques, c.-à-d. utilisant de la lumière infrarouge, visible ou ultraviolette avec atténuation ou obturation complète ou partielle des rayons lumineux les rayons lumineux étant détectés par des cellules photo-électriques en utilisant le déplacement d'échelles de codage
H04N 23/695 - Commande de la direction de la caméra pour modifier le champ de vision, p. ex. par un panoramique, une inclinaison ou en fonction du suivi des objets
An adjustment method for a shape measuring device that radiates light from a light source to a master for adjustment and a reference surface respectively as measurement light and reference light and measures a shape of a surface to be measured of a measurement target using multiplexed light of the measurement light and the reference light respectively reflected by the master for adjustment and the reference surface, the adjustment method including; measuring the master for adjustment in an adjusted state in which a focus position matches an interference position and calculating and storing a matching degree parameter indicating a matching degree between the focus position and the interference position as an adjustment matching degree parameter; when the measurement target is measured, measuring the master for adjustment, calculating the matching degree parameter and comparing the matching degree parameter with the adjustment matching degree parameter, to confirm the matching degree.
An automatic balancer comprising: a balance head configured to rotate integrally with a rotating body around a rotation axis of the rotating body, the balance head including a balance correction mechanism configured to correct imbalance of the rotating body, and a case having a cylindrical outer peripheral surface parallel to the rotation axis and configured to house the balance correction mechanism; a stator provided separately from the balance head and having a shape which is along a circumferential direction of the outer peripheral surface with a clearance from the outer peripheral surface; and a rotor part provided at a position where the rotor part faces the stator on the outer peripheral surface, configured to rotate integrally with the balance head, the rotor part having a shape along the circumferential direction of the outer peripheral surface, wherein the stator and the rotor part are configured to perform wireless communication therebetween.
09 - Appareils et instruments scientifiques et électriques
37 - Services de construction; extraction minière; installation et réparation
38 - Services de télécommunications
39 - Services de transport, emballage et entreposage; organisation de voyages
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Battery manufacturing equipment; semiconductor manufacturing
machines. Measuring or testing machines and instruments; laboratory
apparatus and instruments; power distribution or control
machines and apparatus; batteries and cells; electric or
magnetic meters and testers; electric wires and cables;
buzzers, electric; telecommunications apparatus and
instruments; charge-discharge testing machines and
apparatus, and parts therefor; computers and computer
peripherals; computer programs; data processing apparatus;
electronic circuits; electron tubes; X-ray tubes not for
medical purposes; semi-conductors; resistance wires;
electrodes, other than welding electrodes or medical
electrodes; regulators for scuba diving; charge-discharge
test equipment; secondary batteries; lithium secondary
batteries; power converter; electric vehicle charging
station equipment. Repair or maintenance of electronic machines and apparatus;
repair or maintenance of telecommunication machines and
apparatus; repair or maintenance of power distribution or
control machines and apparatus; repair or maintenance of
electric motors; repair or maintenance of power generators;
repair or maintenance of laboratory apparatus and
instruments; repair or maintenance of measuring and testing
machines and instruments; repair or maintenance of chemical
processing machines and apparatus; repair or maintenance of
charge/discharge test equipment; inspection, repair and
maintenance of performance and safety evaluation test
equipment for secondary batteries; charging batteries and
storage batteries; rental of charging station equipment. Telecommunication (other than broadcasting); rental of
telecommunication equipment, including telephones and
facsimile apparatus; communications by computer terminals;
provision of access to a worldwide computer network; mobile
telephone communication. Electricity distribution; rental of automobiles; collection
of waste and trash. Custom manufacture of charge-discharge test equipment;
custom manufacture of batteries and cells; custom
manufacture of measuring or testing machines and
instruments; custom manufacture of laboratory apparatus and
instruments; recycling of waste and trash; rental of battery
manufacturing equipment; rental of inspection and
measurement equipment; rental of chemical processing
machines and apparatus; sorting and disposal of waste and
trash. Design or development of charge-discharge test equipment;
advice on the design or development of charge-discharge test
equipment; design or development of measuring or testing
machines and instruments; advice on the design or
development of measuring or testing machines and
instruments; designing of machines, apparatus, instruments
[including their parts] or systems composed of such
machines, apparatus and instruments; technological advice
relating to computers, automobiles and industrial machines;
tests or research related to batteries; testing or research
on prevention of pollution; testing or research on
electricity; testing or research on machines, apparatus and
instruments; rental of charge-discharge test equipment;
rental of measuring apparatus; rental of computers;
providing computer programs on data networks; rental of
laboratory apparatus and instruments; rental of measuring or
testing machines and instruments; quality assessment;
quality assessment of secondary battery; secondary battery
performance and safety evaluation tests for others;
development, design and lending of performance and safety
evaluation test equipment for secondary batteries; research
and development of new products for others.
73.
LASER IRRADIATING DEVICE, LASER IRRADIATING METHOD, AND LASER PROCESSING DEVICE
A laser irradiating method includes: detecting a height position of a laser irradiation surface of a workpiece by focusing a distance measuring laser beam onto a planned irradiation line as an irradiation line preceding an irradiation line in a sub-scanning direction from a length measuring section (24) provided to be movable in a main scanning direction together with a laser irradiation section (22) and is provided at a position preceding the laser irradiation section in the sub-scanning direction; and controlling a height position of a focal point of a laser beam irradiated from the laser irradiation section when irradiating a laser beam from the laser irradiation section with a planned irradiation line as a new planned irradiation line on the basis of planned irradiation line information acquired from a detection result of the height position of the laser irradiation surface of the workpiece detected by the length measuring section.
B23K 26/046 - Focalisation automatique du faisceau laser
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/78 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels
A fly-cut apparatus to process a work with bumps on a front surface. A fly-cut apparatus cuts an upper surface of a BG film laminated to a work including a bump region with bumps formed on a front surface and an outer peripheral region around the bump region. The fly-cut apparatus includes a fly-cut tool, a tool spindle with a lower end to which the fly-cut tool is attached, and capable of ascending and descending in a state of rotating the fly-cut tool, and a chuck which rotatably retains the work, and the fly-cut tool cuts the upper surface of the BG film from a center toward an outer perimeter.
B23Q 11/10 - Dispositions pour le refroidissement ou la lubrification des outils ou des pièces travaillées
B23D 5/00 - Machines à raboter ou à mortaiser taillant autrement que par déplacement relatif de l'outil et de la pièce à usiner selon une ligne droite
B23Q 17/20 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer les caractéristiques de la pièce, p. ex. contour, dimensions, dureté
B24B 41/06 - Supports de pièces, p. ex. lunettes réglables
The chiller system includes an internal circulation path, an external circulation path, and a control device. The internal circulation path is equipped with a refrigerant tank, an internal circulation pump, and a freezer. The external circulation path includes a feed path and a return path the feed path being equipped with an external circulation pump and a temperature sensor. A communication path that provides communication between the return path and the refrigerant tank is equipped with throttle means. The internal circulation path is equipped with an on-off control valve, with one end of the pressurizing path being connected to an upstream side of the on-off control valve in the internal circulation path and the other end being connected to an upstream side of the throttle part in the communication path. The control device controls operation of the on-off control valve based on a measurement result of the temperature sensor.
The wafer test system includes: a prober including a chuck that holds a semiconductor wafer and a probe card having probe needles thereon, and brings the probe needles in contact with semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips; an overhead hoist transport that delivers the cassette that houses the plurality of semiconductor wafers to be inspected to the prober and withdraws, from the prober, the cassette that houses the semiconductor wafers that have been inspected; a conveying control unit that controls the overhead hoist transport to convey the probe card between a replacement position of the probe card predetermined in the prober and a storage of the probe card located in a place different from the prober; and a card conveying mechanism that conveys the probe card between a holding position in the prober and the replacement position.
09 - Appareils et instruments scientifiques et électriques
37 - Services de construction; extraction minière; installation et réparation
38 - Services de télécommunications
39 - Services de transport, emballage et entreposage; organisation de voyages
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Battery manufacturing equipment; semiconductor manufacturing
machines. Measuring or testing machines and instruments; laboratory
apparatus and instruments; power distribution or control
machines and apparatus; batteries and cells; electric or
magnetic meters and testers; electric wires and cables;
buzzers, electric; telecommunications apparatus and
instruments; charge-discharge testing machines and
apparatus, and parts therefor; computers and computer
peripherals; computer programs; data processing apparatus;
electronic circuits; electron tubes; X-ray tubes not for
medical purposes; semi-conductors; resistance wires;
electrodes, other than welding electrodes or medical
electrodes; regulators for scuba diving; charge-discharge
test equipment; secondary batteries; lithium secondary
batteries; power converter; electric vehicle charging
station equipment. Repair or maintenance of electronic machines and apparatus;
repair or maintenance of telecommunication machines and
apparatus; repair or maintenance of power distribution or
control machines and apparatus; repair or maintenance of
electric motors; repair or maintenance of power generators;
repair or maintenance of laboratory apparatus and
instruments; repair or maintenance of measuring and testing
machines and instruments; repair or maintenance of chemical
processing machines and apparatus; repair or maintenance of
charge/discharge test equipment; inspection, repair and
maintenance of performance and safety evaluation test
equipment for secondary batteries; charging batteries and
storage batteries; rental of charging station equipment. Telecommunication (other than broadcasting); rental of
telecommunication equipment, including telephones and
facsimile apparatus; communications by computer terminals;
provision of access to a worldwide computer network; mobile
telephone communication. Electricity distribution; rental of automobiles; collection
of waste and trash. Custom manufacture of charge-discharge test equipment;
custom manufacture of batteries and cells; custom
manufacture of measuring or testing machines and
instruments; custom manufacture of laboratory apparatus and
instruments; recycling of waste and trash; rental of battery
manufacturing equipment; rental of inspection and
measurement equipment; rental of chemical processing
machines and apparatus; sorting and disposal of waste and
trash. Design or development of charge-discharge test equipment;
advice on the design or development of charge-discharge test
equipment; design or development of measuring or testing
machines and instruments; advice on the design or
development of measuring or testing machines and
instruments; designing of machines, apparatus, instruments
[including their parts] or systems composed of such
machines, apparatus and instruments; technological advice
relating to computers, automobiles and industrial machines;
tests or research related to batteries; testing or research
on prevention of pollution; testing or research on
electricity; testing or research on machines, apparatus and
instruments; rental of charge-discharge test equipment;
rental of measuring apparatus; rental of computers;
providing computer programs on data networks; rental of
laboratory apparatus and instruments; rental of measuring or
testing machines and instruments; quality assessment;
quality assessment of secondary battery; secondary battery
performance and safety evaluation tests for others;
development, design and lending of performance and safety
evaluation test equipment for secondary batteries; research
and development of new products for others.
This probe comprises: a light incidence/emission portion (cable tip end surface (33a)) which emits measurement light (LA) and upon which reflected light (LB) thereof is incident; a light splitting element (beam splitter (44)) which has a first surface (44a), a second surface (44b) and a third surface (44c), and which optically splits the measurement light (LA) incident on the first surface (44a) from the light incidence/emission portion and emits a portion thereof from the second surface (44b), and optically splits the reflected light (LB) incident on the second surface (44b), emits a portion thereof from the first surface (44a) toward the light incidence/emission portion and emits the remainder from the third surface (44c); a light receiving element (45) which receives the reflected light (LB) emitted from the third surface (44c); and a tip end portion attachment portion (attachment shaft (46)) to which a first probe tip end portion (50) for non-contact measurement and a second probe tip end portion (60) for contact measurement can be selectively attached.
G01B 21/00 - Dispositions pour la mesure ou leurs détails, où la technique de mesure n'est pas couverte par les autres groupes de la présente sous-classe, est non spécifiée ou est non significative
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
This laser machining method comprises using a laser machining unit to machine a second groove in a workpiece, the laser machining unit comprising: a first machining section capable of machining two lines of first grooves in the workpiece, to which a machining feed is relatively applied, by irradiating the workpiece with a pair of laser lights; and two second machining sections that are disposed on both sides of the first machining section with respect to a machining feed direction, and are capable of machining a space between the two lines of first grooves being machined by the first machining section, by irradiating the space with laser light. In the laser machining method, the machining feed is given a plurality of times to machine the second groove that is hollowed between the two first grooves. In the first machining feed, while the two lines of first grooves are machined in the workpiece by the first machining section, the space between the two lines of first grooves is machined by the second machining section positioned on the downstream side of the first machining section with respect to the direction in which the machining proceeds. In the second and subsequent machining feeds, the two second machining sections are used to machine the space between the two lines of first grooves.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
[Problem] To provide a grinding device and a grinding method capable of accurately grinding the rear surface of a wafer, for example, by monitoring the state of wear or the like of a grindstone and managing the grindstone to be always in a good state. [Solution] This grinding device comprises: a chuck table having a holding surface 13a for holding a wafer W; a sensor portion 18 having an emitting portion 18 for emitting a detection signal toward a grindstone surface 15a of a grindstone 15 which rotates integrally with a grinding wheel 14 so as to draw an annular locus, and a receiving portion 18b for receiving the detection signal reflected by the grindstone surface 15; and a control unit 19 for calculating a variation in an amount of wear in the circumferential direction of the grindstone 15 on the basis of the detection signal received by the receiving portion 18b, and comparing the variation in the amount of wear with a reference value to determine whether the grindstone 15 is wearing appropriately.
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet comportant une table porte-pièce rotative
B24B 49/18 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la présence d'outils à dresser
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
This workpiece machining apparatus comprises: a table that holds a workpiece; a machining unit that has a first machining part and a second machining part arranged in the X direction, and that irradiates the table fed in the X direction relatively along a scheduled machining line set in the workpiece with a pair of first laser beams from the first machining part in the Z direction to thereby machine two grooves along the scheduled machining line, and irradiates a space between the two grooves machined by the first machining part with a second laser beam from the second machining part in the Z direction to thereby machine the space between the two grooves; a feeding drive part that moves the table and the machining unit relative to each other in the X direction and the Y direction to thereby provide feeding in the X direction and the Y direction; a correction part that corrects inclination of the arrangement of the first and second machining parts with respect to the scheduled machining line; and a control part that controls the correction of the inclination carried out by the correction part.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
This charge/discharge test system includes a test device 20-1 that connects secondary batteries 15-1 … 15-n and performs a charge/discharge test, wherein the charge/discharge test system generates measurement data DT1 from signals indicating battery states generated by the test devices 20-1 … 20-m and analyzes the measurement data to determine characteristics of the batteries. According to the charge/discharge test system comprising: the test device that acquires the measurement data at a first sampling interval f1; a large-capacity storage device 1(100) that stores the measurement data; and an evaluation data output means for extracting the measurement data at a second sampling interval f2 that is A times the first sampling interval (A represents an integer of 2 or more) on the basis of the stored measurement data, and outputting the measurement data as evaluation data DT2, detailed data for long-term tests and abnormal conditions can be output arbitrarily, and current, voltage, temperature, etc. can be evaluated in detail.
G01R 31/385 - Dispositions pour mesurer des variables des batteries ou des accumulateurs
H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
Provided with a prober and a temperature measurement method capable of achieving an automatization of a temperature measurement of a wafer chuck. A temperature measurement jig (70) having one or more temperature sensors (72) is supported at a position where a probe card is supported when the probe card is conveyed using a conveyance device configured to transfer the probe card to a wafer chuck (18), the temperature measurement jig having one or more temperature sensors, and the one or more temperature sensors is contacted with a surface of the wafer chuck to be measured in a state that the conveyance device supports the temperature measurement jig.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
A processing discharge liquid filtration device enhances filtration capacity for filtering a discharge liquid discharged from a processing device. The processing discharge liquid filtration device includes a dirty tank that stores a discharge liquid containing cutting chips, a dirty tank pump that pumps the discharge liquid stored in the dirty tank to a screen filter for primary filtration processing that recovers the cutting chips mixed into the discharge liquid, and a cutting chip recovery container that contains the cutting chips recovered by the screen filter. The processing discharge liquid filtration device eliminates the time and effort to replace the filtration member or filter and keeps the quality of the filtered discharge liquid constant.
B23Q 11/10 - Dispositions pour le refroidissement ou la lubrification des outils ou des pièces travaillées
B23Q 11/00 - Accessoires montés sur les machines-outils pour maintenir les outils ou les organes de la machine dans de bonnes conditions de travail ou pour refroidir les pièces travailléesDispositifs de sécurité spécialement combinés aux machines-outils, disposés dans ces machines ou spécialement conçus pour être utilisés en relation avec ces machines
86.
GROOVE SHAPE MEASURING METHOD AND GROOVE SHAPE MEASURING APPARATUS
The present disclosure provides a groove shape measuring method and a groove shape measuring apparatus, capable of achieving reduction in processing load and acquisition of a more accurate cross-sectional profile. The groove shape measuring method includes: a setting step of dividing a processing groove into a plurality of measurement regions with a predetermined pitch and further setting, for each of the measurement regions, N number of sub-measurement regions in the measurement region; a coordinate data acquisition step of acquiring a plurality of coordinate data on the processing groove in respective M-th sub-measurement regions in the measurement regions; and a cross-sectional profile generation step of generating a cross-sectional profile by projecting the coordinate data, corresponding to the M-th sub-measurement regions acquired for the respective measurement regions in the coordinate data acquisition step, onto a two-dimensional plane.
G01B 5/008 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer les coordonnées de points en utilisant des machines de mesure de coordonnées
B23K 26/03 - Observation, p. ex. surveillance de la pièce à travailler
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
87.
MACHINING STATE DETECTION APPARATUS, MACHINING STATE DETECTION METHOD, PROGRAM, DICING APPARATUS, AND LEARNING MODEL GENERATION METHOD
A machining state detection apparatus acquires an environmental temperature history, a blade supply water temperature history, and a heat source supply water temperature history, and derives an environmental temperature history feature amount, a blade supply water temperature history feature amount, and a heat source supply water temperature history feature amount, and when a machining error is predicted based on a temperature history feature amount including the environmental temperature history feature amount, the blade supply water temperature history feature amount and the heat source supply water temperature history feature amount, with a learning model which is trained using the temperature history feature amount and the machining error as learning data and which outputs a prediction value of the machining error, when the temperature history feature amount is input.
G05B 19/406 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par le contrôle ou la sécurité
G05B 13/02 - Systèmes de commande adaptatifs, c.-à-d. systèmes se réglant eux-mêmes automatiquement pour obtenir un rendement optimal suivant un critère prédéterminé électriques
88.
MACHINE TOOL WITH AUTOMATIC TOOL CHANGER, AND EDDY CURRENT SENSOR USED FOR SAME
Provided is a machine tool with an automatic tool changer, said machine tool machining a workpiece 24 by mounting, on a spindle head 26, a tool holder 11 to which tools 25 are fitted, said machine tool having an eddy current sensor 1 which is positioned such that a measurement end face 1-4 faces the outer peripheral surface of a flange part 11B of the tool holder 11, and a data processing device 3 which detects vibrations of a tool 25-1 mounted on the spindle head 26 on the basis of data measured by the eddy current sensor 1, wherein the eddy current sensor 1 comprises a coil 1-2 that is formed in a spiral shape and is held in a bobbin 1-3, which is a cylindrical container, and a core 1-1 that is a soft magnetic body positioned at the axial centre of the coil 1-2 on the measurement end face 1-4 side. Said machine tool makes it possible to accelerate tool change operations without impairing detection accuracy.
B23Q 17/00 - Agencements sur les machines-outils pour indiquer ou mesurer
B23B 31/00 - Mandrins de serrageMandrins extensiblesLeurs adaptations à la commande à distance
B23Q 3/155 - Agencements pour insérer ou retirer automatiquement les outils
G01B 7/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques
G01B 7/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
This laser processing device processes a workpiece given a relative processing feed, by irradiating the workpiece with a laser beam from a laser processing head. The laser processing head includes: a first processing unit for processing two grooves by irradiating the workpiece with a pair of first laser beams; a second processing unit for processing a space between the two grooves processed by the first processing unit by irradiating the space between the two grooves with a second laser beam; and a first focal point adjustment unit that moves the position of the focal point of the second laser beam relative to the position of the focal point of the first laser beam along the optical axis direction to adjust the relative positional relationship between the focal point of the first laser beam and the focal point of the second laser beam in the optical axis direction.
B23K 26/046 - Focalisation automatique du faisceau laser
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
This is a workpiece machining method for performing hollowing machining between two grooves formed in a workpiece, the workpiece machining method including: a first step for irradiating a first laser beam having a non-circular beam spot between the two grooves on a workpiece to which machining feed is applied relatively along the two grooves, to perform hollowing machining between the two grooves; and a second step for irradiating a second laser beam having a non-circular beam spot between the two grooves that underwent hollowing machining by the first laser beam on the workpiece to which machining feed is applied relatively along the two grooves, to perform further hollowing machining between the two grooves. In the first step, the longitudinal direction of the beam spot is inclined with respect to the advancing direction of the machining to irradiate the first laser beam so as to have a machining width corresponding to the space between the two grooves. In the second step, the longitudinal direction of the beam spot is inclined in the direction opposite to the first laser beam with respect to the advancing direction of the machining to irradiate the second laser beam so as to have a machining width corresponding to the space between the two grooves.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
A housing for a prober having a multi-layer structure in which measuring parts are stacked includes: floor bases configured to floor surfaces of respective layers of the multi-layer structure; and at least one side frame body which is arranged between a floor base of one layer and a floor base of another layer positioned above the one layer among the plurality of layers, and which is positioned in both side parts of the measuring parts, wherein the side frame body includes: a first side frame which is erected on the floor base of the one layer and which supports a lower surface side of the floor base of the another layer; and a second side frame which is erected on the floor base of the one layer at a position different from that of the first side frame, and supports a measuring part constituent member arranged in the measuring part.
A drive control device including an operation instruction transmission unit configured to transmit an operation instruction to a motor driving device for operating a movement mechanism of a wafer chuck; an information acquisition unit (62) configured to acquire a position deviation information including a position deviation at an actual position of the wafer chuck with respect to a position of the wafer chuck in the operation instruction; an analysis unit (64) configured to analyze the position deviation information; and a determination unit configured to determine an existence or absence of an occurrence of an abnormal operation of the movement mechanism based on an analysis result of the position deviation information can suppress a breakage of the wafer or the like in a state that the wafer and a probe are in contact with each other.
This measurement device (10) comprises: a light source (12) that emits multi-wavelength light; a first optical unit (56) that generates chromatic aberration along an optical axis (AX) with respect to the multi-wavelength light; a second optical unit (56) for condensing the multi-wavelength light, in which the chromatic aberration has been generated, onto a measurement position of a measurement object (W); a dimming member (57) that blocks a portion of the multi-wavelength light incident on the first optical member and is disposed at a position penetrated by the optical axis; a dimming adjustment unit that varies the surface area where the dimming member blocks the multi-wavelength light; an aperture (AP) that transmits at least portion of the multi-wavelength light transmitted through the dimming member; and a light receiving part for acquiring spectrum information about the multi-wavelength light transmitted through the aperture.
Provided is a laser processing method, in which a pulse waveform F of a pulse laser beam L that forms a laser processed region P inside a workpiece (wafer W) includes: a first stage waveform ST1 in which the power of the pulse laser beam L rises to a maximum value (peak power Pmax) in time t0; a second stage waveform St2 in which the power falls to a reference value (base power Pb) in time t1; and a third stage waveform ST3 in which the power is maintained within a predetermined variation range without falling below the reference value. The reference value is in a range from 30% to 60% of the maximum value. The time t0 is in a range from 1% to 20% of a pulse width te. The time t1 is in a range from 3% to 40% of the pulse width te. Time tp corresponding to a value which is half the maximum value is in a range from 2% to 40% of the pulse width te.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
[Problem] To provide a workpiece visual inspection device and a method capable of accurately and efficiently performing visual inspection of a workpiece. [Solution] Provided is a workpiece visual inspection device 1 comprising: a chuck table 2 on which a workpiece W is placed; cameras 4A, 4B, 4C that capture an image of a to-be-machined surface Wa of the workpiece W; a first slide mechanism 23 and a second slide mechanism 44 that move at least one of the chuck table 2 and the cameras 4A, 4B, 4C relative to the other, and scan imaging positions 4a, 4b, 4c of the cameras 4A, 4B, 4C in a rectangular shape when observed in plan view; and a determination unit 52 that determines the quality of the workpiece W on the basis of a plurality of captured images captured by the cameras 4A, 4B, 4C.
This machining device acquires data including information on a workpiece machining condition, and machines the workpiece in accordance with the machining condition described in the acquired data. The machining device comprises an irradiation unit that irradiates the workpiece with electromagnetic waves that can transmit through the workpiece, an imaging unit that captures an image of the workpiece irradiated by the electromagnetic waves, a preprocessing unit that performs preprocessing of a first image obtained by the image capture to generate a second image, and an image processing unit that performs image processing of the second image. Information on a processing condition in the preprocessing is include in the data acquired by the machining device. The preprocessing unit performs preprocessing of the first image in accordance with the processing condition described in the data, and generates a second image.
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B23K 26/364 - Gravure au laser pour faire une rainure ou une saignée, p. ex. pour tracer une rainure d'amorce de rupture
B23Q 17/22 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer la position réelle ou désirée de l'outil ou de la pièce
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
97.
SEMICONDUCTOR WAFER GRINDING DEVICE AND GRINDING METHOD
The peripheries of semiconductor wafers can be efficiently machined at high yield by a semiconductor wafer grinding method comprising: a step for measuring a crystal orientation in the periphery of the semiconductor wafer with respect to at least one among a plurality of semiconductor wafers that are cut from the same ingot, and storing the crystal orientation as crystal orientation data corresponding to a peripheral direction displacement from a reference position of the semiconductor wafer; a step for grinding by changing, according to the crystal orientation, grinding conditions including the direction and frequency of an applied ultrasonic wave, and storing valid grinding conditions as training data; a step for detecting a reference position of another semiconductor wafer and estimating the crystal orientation of a grinding position of this semiconductor wafer with reference to the crystal orientation data on the basis of the detected reference position; and a step for setting a grinding condition at the grinding position of this semiconductor wafer with reference to the training data, and grinding the periphery of the semiconductor wafer by applying the set grinding condition to a grinding spindle.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
B24B 1/04 - Procédés de meulage ou de polissageUtilisation d'équipements auxiliaires en relation avec ces procédés en soumettant les outils de meulage ou de polissage, les produits de meulage ou de polissage ou les pièces à des vibrations, p. ex. meulage en fréquence ultrasonore
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet
A measurement device (1) is provided with a stylus for measuring the surface of an object to be measured, and comprises: a detector (10) including a stylus section (14) attached so as to be swingable around a swing center according to the shape of the surface of the object to be measured; a thermometer (80) that measures the temperature at the time of measurement by the stylus section; a temperature correction parameter storage unit (108) that stores temperature correction parameters corresponding to the type of the stylus section, the temperature at the time of measurement that was measured by the thermometer, and the temperature at the time of calibration; and a temperature correction unit (102) that detects the type of the stylus section used in the measurement, acquires the temperature correction parameter corresponding to the type of the stylus section, the temperature at the time of measurement that was measured by the thermometer, and the temperature at the time of calibration from the temperature correction parameter storage unit and corrects the measurement result on the basis of the temperature correction parameter.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
99.
MEASURING FORCE ADJUSTMENT MECHANISM AND MEASURING DEVICE EQUIPPED WITH SAME
A measuring force adjustment mechanism 300 that is installed in a measuring device comprises: a tension spring 146; an upper-side spring locking fixture 160 which locks one end of the spring; and a lower-side spring locking fixture 312 which locks the other end of the spring. In the measuring force adjustment mechanism 300: the upper-side spring locking fixture has a thread part 160a formed on the side opposite to the side where the spring is locked; a cap nut 320 which has a screw formed to mesh with said thread part and which is exposed to the outside of the measuring device on the side opposite to the screw formed portion is formed; the exposed portion of the cap nut is provided with a tool locking part 322 in which a tool can be fitted; a seal groove 334 is formed in the lateral side of the cap nut; and a rotational movement regulation means 160e that is capable of moving in the vertical direction without rotating about the own axis even when the cap nut is rotated is formed in the upper-side spring locking fixture. Accordingly, it is possible to realize a measuring force adjustment mechanism that is used in a measuring device, that does not cause excessive torque to a spring despite a compact size, and that allows adjustment from outside.
A measurement device (1) comprises: a detector (10) that is accommodated in an internal space of a detector housing (30) and includes an arm part attached so as to be able to oscillate about an oscillation center; a stylus part (14) provided with a stylus for performing measurement of a surface of a measurement object, the stylus part being attached to the arm part and being attached so as to be able to oscillate integrally with the arm part in accordance with the shape of the surface of the measurement object; a first temperature sensor that measures the temperature of the internal space, and a temperature correction unit (102) that corrects the result of measurement of the measurement object on the basis of the temperature, measured by the first temperature sensor, of the internal space during measurement.
G01B 5/20 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer des contours ou des courbes
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
