Provided is a thermally-conductive electrical conducting layer having excellent thermal conductivity in the thickness direction. A thermally-conductive electrical conducting layer (1) is a thermally-conductive electrical conducting layer containing a binder component (11) and electrical conducting particles (12). The electrical conducting particles (12) include electrical conducting particles A (12a) having a median diameter larger than a thickness (T) of the thermally-conductive electrical conducting layer (1) and having a thermal conductivity of 20 W/mK or more, and electrical conducting particles B (12b) having a median diameter smaller than the thickness (T) of the thermally-conductive electrical conducting layer (1). The resistivity of the thermally-conductive electrical conducting layer (1) is 2.0×10−5Ω·m or more.
This conductive composition contains (A) an epoxy resin, (B) a polyol, (C) a cationic polymerization initiator, and (D) conductive particles. (A-1) an alicyclic epoxy resin and (A-2) a rubber-modified epoxy resin are contained as the epoxy resin (A). A polyol that has a molecular weight of 200 or more is contained as the polyol (B).
The present invention addresses the problem of providing a liquid leak detecting line capable of suppressing erroneous detection while suppressing a significant decrease in liquid leak detection performance. In order to resolve the abovementioned problem, the present invention provides a liquid leak detecting line comprising a plurality of detecting lines each comprising a conductor and a braided body covering the conductor, wherein the plurality of detecting lines include a first detecting line and a second detecting line, the braided body is configured from an electrically insulating yarn, and an electrically conductive liquid is detected when the liquid electrically connects the conductor of the first detecting line and the conductor of the second detecting line through the braided bodies, and wherein the braided body of one or both of the first detecting line and the second detecting line comprises a first yarn and a second yarn intersecting the first yarn, and the second yarn is thinner than the first yarn.
G01M 3/16 - Examen de l'étanchéité des structures ou ouvrages vis-à-vis d'un fluide par utilisation d'un fluide ou en faisant le vide par détection de la présence du fluide à l'emplacement de la fuite en utilisant des moyens de détection électrique
A conductive composition comprising an epoxy resin, a curing agent, and metal particles, wherein: a liquid epoxy resin and a solid epoxy resin are contained as the epoxy resin; high-melting-point metal particles that contain a metal having a melting point of not lower than 800°C and low-melting-point metal particles that contain a metal having a melting point of not higher than 240°C are contained as the metal particles; and, in the particle size distribution of the low-melting-point metal particles, D10 is 3-20 μm and D90 is 8-30 μm.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
The present invention relates to an electromagnetic wave shield film that can sufficiently exhibit a shielding effect even at high frequencies and that can be made to be thin, and to a shield printed wiring board including the same. An electromagnetic wave shield film according to the present invention has a shield layer containing a binder component and first conductive particles and satisfies T/δ ≥ 45/Rs, T ≤ 30, and T/δ ≥ 1 (in the formulas, T represents the thickness [μm] of the shield layer, Rs represents the sheet resistance value [mΩ/sq.] of the shield layer, and δ represents the skin depth [μm] of the shield layer at 10 GHz).
This electroconductive composition is characterized by comprising an epoxy resin, an imidazole-based curing agent containing no triazine ring, a benzoxazine resin, and electroconductive particles, wherein the epoxy resin contains an alicyclic epoxy resin.
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08K 3/01 - Emploi de substances inorganiques en tant qu'adjuvants caractérisées par leur fonction
This conductive composition contains 2-8 parts by mass of flux relative to 100 parts by mass of metal particles. The metal particles (100 parts by mass) contain 42-50 parts by mass of metal particles (A) that are composed of SnBi alloy particles and Sn particles, and 25-58 parts by mass of metal particle (B) that are at least one kind of particles selected from the group consisting of copper particles, silver particles, and silver-coated copper particles, and contain at least copper and silver. The 10% cumulative value of the particle diameters of the SnBi alloy particles is 4-15 μm, and the 90% cumulative value of the particle diameters of the SnBi alloy particles is 8-25 μm. The 10% cumulative value of the particle diameters of the Sn particles is 7-30 μm, and the 90% cumulative value of the particle diameters of the Sn particles is 15-50 μm.
H01B 1/20 - Matériau conducteur dispersé dans un matériau organique non conducteur
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/17 - Particules métalliques revêtues de métal
B22F 1/052 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules caractérisées par un mélange de particules de dimensions différentes ou par la distribution granulométrique des particules
B22F 7/04 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de couches successives avec une ou plusieurs couches non réalisées à partir de poudre, p. ex. à partir de tôles
C22C 12/00 - Alliages à base d'antimoine ou de bismuth
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
Provided is an electromagnetic wave shielding film capable of blocking or allowing passage of only an electromagnetic wave with a specific frequency. An electromagnetic wave shielding film, including: a metamaterial layer including a first main surface and a second main surface opposite to the first main surface; and an adhesive layer formed on the second main surface of the metamaterial layer, wherein when the metamaterial layer is viewed in a plan view from at least one of the first main surface or the second main surface, the metamaterial layer includes a conductive region where predetermined patterns made of a conductive material are periodically arranged, and a non-conductive region other than the conductive region.
2 or less, and the percentage of the number (cumulative frequency) of the first openings among the openings is 30 to 90%, and the percentage of the number (cumulative frequency) of the second openings among the openings is 10 to 70%.
Provided is an electromagnetic wave shield film that is not susceptible to swelling of an electroconductive adhesive layer due to heating and has sufficiently high solder float resistance. An electromagnetic wave shield film according to the present invention is obtained by sequentially layering a protective layer, a metal layer, and an electroconductive adhesive layer, wherein the electromagnetic wave shield film is characterized in that the electroconductive adhesive layer contains an epoxy resin having a weight-average molecular weight Mw of 50,000 or higher, a carboxy-group-containing curing agent, a nitrogen-containing organic filler, a phosphorus-containing liquid flame retardant, and an electroconductive filler.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 15/092 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines époxy
C08G 59/42 - Acides polycarboxyliquesLeurs anhydrides, halogénures ou esters à bas poids moléculaire
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
A coaxial cable (100a) comprises a first conductor part (1) and a second conductor part (2). The first conductor part (1) has an internal space (V). The first conductor part (1) extends along a central axis (A). The first conductor part (1) includes a first conductor section (11) and a first insulating section (12). The first insulating section (12) covers a surface (11s) of the first conductor section (11). A first through-hole (H1) is formed in the second conductor part (2), in a side surface (20s) surrounding the central axis (A). The first conductor part (1) is inserted into the internal space (V) via the first through-hole (H1).
A connection member (20) can be attached to a cable end on the output side of a flat cable having at least three-layer flat band-shaped cable conductors spaced apart from each other. The connection member (20) can be connected between the flat cable and a power reception device capable of receiving power supplied from the flat cable. The connection member (20) is provided with: at least three-layer flat band-shaped conductors (21, 23) disposed spaced apart from each other in the thickness direction; and a portion in which at least the three-layer flat band-shaped conductors (21, 23) are formed into two layers.
H01R 11/11 - Pièces d'extrémité ou pièces de dérivation pour fils ou câbles, supportées par le fil ou le câble et munies de moyens pour faciliter la connexion électrique avec quelque autre fil, borne ou organe conducteur
H02G 1/14 - Méthodes ou appareils spécialement adaptés à l'installation, entretien, réparation, ou démontage des câbles ou lignes électriques pour la jonction ou la terminaison de câbles
A flat cable (10) is provided with at least three layers of flat cable conductors spaced apart from each other. The at least three layers of flat cable conductors include an inner cable conductor (11), one outer cable conductor (13B), and the other outer cable conductor (13A). The other outer cable conductor (13A) is on the opposite side to the one outer cable conductor (13B) in the thickness direction. The inner cable conductor (11) is disposed so as to be sandwiched between the one outer cable conductor (13B) and the other outer cable conductor (13A) in the thickness direction. At least one of the one outer cable conductor (13B), the other outer cable conductor (13A), and the inner cable conductor (11) has a lower DC conductor resistance in a cable end portion than in the regions other than the cable end portion.
H01B 7/30 - Conducteurs ou câbles isolés caractérisés par la forme avec dispositions pour réduire les pertes dans les conducteurs transmettant du courant alternatif, p. ex. dues à l'effet pelliculaire
A flat cable (10) comprises at least three layers of flat strip-shaped cable conductors (11, 13A, 13B) spaced apart from each other. The cable ends of each of the at least three layers of flat strip-shaped cable conductors (11, 13A, 13B) are fixed in a state of being separated from each other at an interval (P) that is equal to or greater than the width (W) of the cable ends.
H01B 7/30 - Conducteurs ou câbles isolés caractérisés par la forme avec dispositions pour réduire les pertes dans les conducteurs transmettant du courant alternatif, p. ex. dues à l'effet pelliculaire
15.
METHOD FOR PRODUCING HIGHLY CONDUCTIVE COMPOSITION AFTER DRYING AND FIRING
A conductive composition according to the present invention comprises: (A) 1.005-1.74 mass% of a bisphenol-type epoxy resin; (B) not less than 0.015 mass% but less than 0.08 mass% of a (meth)acrylic resin that has a weight-average molecular weight of 1000-400,000; (C) 0.5-0.86 mass% of polymer particles that contain a polybutadiene rubber; (D) 5-95 mass% of copper particles that have an average particle diameter of 2-500 nm; (E) 0.9-4.8 mass% of silver particles that have an average particle diameter of 2-500 nm; (F) 0.001-20 mass% of a phosphorus-containing compound; (G) 0.0001-10 mass% of CuH; and (H) 0.1-90 mass% of a solvent.
C08L 33/04 - Homopolymères ou copolymères des esters
C08L 51/04 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des caoutchoucs
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
16.
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD
This thermosetting resin composition contains (A) a cyanate ester compound, (B) a phenolic resin, (C) another curable resin as an optional component, (D) a metal catalyst, and (E) another curing catalyst as an optional component. If the total amount of the component (A), the component (B), and the component (C) is taken as 100 parts by mass, the amount of the component (A) is 80-99 parts by mass, the amount of the component (B) is 1-15 parts by mass, and the amount of the component (C) is 0-10 parts by mass. The amount of the component (E) is 1 part by mass or less relative to a total of 100 parts by mass of the component (A), the component (B), and the component (C).
C08L 79/04 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principalePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 61/00 - Compositions contenant des polymères de condensation d'aldéhydes ou de cétonesCompositions contenant des dérivés de tels polymères
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
17.
Method for Manufacturing Shielded Printed Wiring Board and Shielded Printed Wiring Board
A shielded printed wiring board with electromagnetic wave shielding film on both sides thereof is produced by placing electromagnetic wave shielding films on the two sides of the printed wiring board, with ends thereof protruding past an end of the printed wiring board. The protruding ends of the electromagnetic wave shielding films are brought together, with an air gap therebetween, and an initial application of heat and pressure causes the ends of the electromagnetic wave shielding film to adhere to each other, but without completely curing adhesive resin components of the electromagnetic wave shielding films. Protective film layers are removed from the electromagnetic wave shielding films, followed by subsequent application of heat and pressure to complete cure of the adhesive resin and to remove the air gap.
An electromagnetic wave shielding film includes an electroconductive adhesive layer having high peel strength and high connection reliability and suppresses cracks in an insulating layer on the electroconductive adhesive layer. The electromagnetic wave shielding film includes an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition and an insulating layer on the electroconductive adhesive layer. The electroconductive particles include high melting point electroconductive particles and low melting point electroconductive particles having a lower melting point than the high melting point electroconductive particles, and the high melting point electroconductive particles include high melting point flaky particles and high melting point spherical particles, and the content of the high melting point flaky particles is 60 to 80% by weight of the total content of the high melting point flaky particles, the high melting point spherical particles, and the low melting point electroconductive particles.
A thermally conductive composition having excellent thermal conductivity, processability, and long-term reliability is provided. A thermally conductive composition contains: 100 parts by mass of an epoxy resin containing 1 to 30 parts by mass of a dimer acid epoxy resin and 1 to 40 parts by mass of a liquid epoxy resin (excluding dimer acid epoxy resins); and 700 to 1700 parts by mass of a conductive filler, in which the conductive filler contains a conductive filler (A) having an average particle size (D50) measured by a laser diffraction scattering particle size distribution measurement method of 5 to 20 μm and a conductive filler (B) having an average particle size (D50) of 1 to 8 μm, a rate ((A)/(B)) of the average particle size of the conductive filler (A) and the average particle size of the conductive filler (B) is 1.5 or more, and a content rate ((A)/(B)) of the conductive filler (A) and the conductive filler (B) by mass rate is 1.0 to 50.0.
An electromagnetic wave shielding film with high bending resistance includes a protecting layer, a metal layer, and an adhesive layer stacked in this order. A ratio of Repulsion Y to Repulsion X ([Repulsion Y]/[Repulsion X]) is 0.77 or higher, where Repulsion X denotes a repulsion of a stack including the protecting layer and the metal layer measured in a defined test for measuring repulsion of stacks, and Repulsion Y denotes a repulsion of the adhesive layer measured in a defined test for measuring repulsion of adhesive layers.
Provided is a laminate in which a protective layer is evenly laminated on a separator, and the separator does not have a too high peel strength after thermal press bonding. This laminate comprises: a separator which comprises a substrate and a silicone resin film formed on a surface of the substrate and serving as a release surface; and a protective layer laminated on the separator so as to be in contact with the release surface. The laminate is characterized in that the release surface has a water contact angle of 107.1° or greater, and that the protective layer includes at least one resin selected from the group consisting of polyurethane resins, polyamide-imide resins, and polyamide resins.
The film deposition apparatus used in a thermal spraying method includes a spray gun which includes a nozzle, a powder supply unit that supplies a powder to the spray gun as a film deposition raw material, and a gas supply unit that supplies a working gas to the spray gun. The nozzle includes a stainless pipe as a nozzle pipe, a ceramic pipe connected to an upstream portion of the stainless pipe through which the working gas flows, and a nozzle holder into which the ceramic pipe is inserted. The nozzle holder includes a first portion extending in a first direction in which the working gas flows through the nozzle holder. The film deposition apparatus further includes a pipe which connects the powder supply unit and the first portion. A portion of the pipe, which is connected to the first portion, extends in a second direction intersecting the first direction.
B05B 7/04 - Pistolets pulvérisateursAppareillages pour l'évacuation avec des dispositifs permettant le mélange de liquides ou d'autres matériaux fluides avant l'évacuation
B05B 7/00 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz
B05B 7/14 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz agencés pour projeter des matériaux en particules
A powder supply system (200) comprises: a hopper (3a); a powder replenishing machine (21); a pressure adjustment mechanism (22); and an opening/closing valve (23). The hopper (3a) stores powder to be supplied to a film-forming device. The powder replenishing machine (21) is connected to the hopper (3a), and replenishes the hopper (3a) with the powder while maintaining a constant pressure difference with respect to the inside of the hopper (3a). The pressure adjustment mechanism (22) can adjust pressure inside the hopper (3a) and pressure inside the powder replenishing machine (21) so that the pressure inside the hopper (3a) and the pressure inside the powder replenishing machine (21) become constant. The opening/closing valve (23) is installed at a part that connects the inside of the hopper (3a) and the inside of the powder replenishing machine (21).
B05C 19/06 - Stockage, alimentation ou régulation de l'application du matériau en particulesRécupération du matériau en particules en excès
C23C 4/12 - Revêtement par pulvérisation du matériau de revêtement à l'état fondu, p. ex. par pulvérisation à l'aide d'une flamme, d'un plasma ou d'une décharge électrique caractérisé par le procédé de pulvérisation
B22F 1/142 - Traitement thermique ou thermomécanique
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/05 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules
B22F 1/12 - Poudres métalliques contenant des particules non métalliques
B22F 1/105 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques contenant des agents lubrifiants ou liants inorganiques, p. ex. des sels métalliques
C23C 24/00 - Revêtement à partir de poudres inorganiques
25.
TRANSFER FILM, ELECTROMAGNETIC WAVE SHIELD FILM PROVIDED WITH TRANSFER FILM, AND SHIELD PRINTED WIRING BOARD
Provided is a transfer film having a main surface on which an uneven shape is formed, the transfer film making it possible to sufficiently reduce the glossiness of an object onto which the uneven shape is to be transferred, and having sufficiently high releasability. This transfer film is characterized by comprising a first main surface on which an uneven shape is formed, the first main surface having a protruding peak height Spk of 1.2 μm or less.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 3/30 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p. ex. des gorges, des nervures
B32B 7/025 - Propriétés électriques ou magnétiques
H05K 3/28 - Application de revêtements de protection non métalliques
A movable shaft (10) is provided with a cylindrical base layer (12) extending along the axial direction of the movable shaft, a surface layer (13), and a braid (14). The surface layer is disposed on an outer peripheral surface (12b) of the base layer with the braid interposed therebetween. The constituent material of the base layer is of the same kind as the constituent material of the surface layer. Durometer hardness of the base layer is higher than durometer hardness of the surface layer. The braid is formed by knitting a wire (14a) so as to have an opening (14b). At least a part of the surface layer is in contact with the outer peripheral surface via the opening.
The present invention provides a heat dissipation sheet laminate which is not susceptible to the occurrence of breakage during the pick-up of a heat dissipation sheet, and which is excellent in terms of bonding workability. This heat dissipation sheet laminate 1 sequentially comprises an embossed film 5, a heat dissipation sheet 4, a release film 3 and an adhesive sheet 2 in this order. The release film 3 can be separated from the adhesive sheet 2 and the heat dissipation sheet 4. A plurality of individualized pieces of the release film 3 are arranged on the adhesive sheet 2. A plurality of individualized pieces of the heat dissipation sheet 4 are respectively arranged on the individualized pieces of the release film 3. The release film 3 partially has a non-lamination region 31 on which the heat dissipation sheet 4 is not superposed. The adhesive sheet 2 is half-cut together with the release film 3.
The present invention provides an electromagnetic shielding film demonstrating excellent bending resistance over a long period of time. This electromagnetic shielding film includes a protective layer, a conductive adhesive layer, and a metal vapor-deposited layer provided between the protective layer and the conductive adhesive layer, the electromagnetic shielding film being characterized by having a tensile elastic modulus of 2.1 GPa to 4.0 GPa and an elongation at break of less than 3.0%.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
Provided is a laminate having a sufficiently high peelability of an adhesive layer and low manufacturing cost. A laminate according to the present invention is characterized by comprising: a protective layer having a first main surface that is not subjected to release treatment; and an adhesive layer that contains an adhesive component and a filler and is laminated so as to be in contact with the first main surface, wherein the filler has a bulk density of 7-23 mL/g, and when the weight of the adhesive component included in the adhesive layer is 100 parts by weight, the adhesive layer contains 2-75 parts by weight of the filler.
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
This electroconductive composition contains an epoxy compound, an imidazole compound, a phenolic curing agent, and electroconductive particles. In the epoxy compound, the content ratio of a naphthalene skeleton-containing epoxy resin is 10-30 mass%, the content ratio of a glycidyl amine-based epoxy resin is 40-90 mass%, and the content ratio of a reactive diluent, which has 1-2 glycidyl ether functional groups in an aliphatic hydrocarbon chain, is 10 mass% or less. The imidazole compound contains at least one compound selected from the group consisting of 2-undecylimidazole, 2-heptadecylimidazole, 4-methyl-2-phenylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole. Relative to 100 parts by mass of the epoxy compound, the content of the imidazole compound is 3-10 parts by mass and the content of the phenolic curing agent is 10-20 parts by mass. The content of the electroconductive particles is 82-90 mass% of the electroconductive composition.
Provided is an electromagnetic wave shielding film in which swelling is unlikely to occur between a ground circuit and an adhesive layer, even when a shielded printed wiring board, in which the adhesive layer of the electromagnetic wave shielding film and the ground circuit of the printed wiring board have been brought into contact, has been used for a long period of time in a high temperature, high humidity environment. The electromagnetic wave shielding film according to the present invention comprises an adhesive layer and a first protective layer disposed on the adhesive layer, and is characterized in that: the first protective layer contains a urethane-based resin having an acid value of 2000-4000 g/eq, and silica particles: and the adhesive layer contains a urethane-based resin having an acid value of 2000-4000 g/eq, an imidazole-based compound, and a phosphorus-containing flame retardant.
Provided is a bonding wire provided with a covering layer employing Au as a principal component on a surface of a core material employing Ag as a principal component, the bonding wire being capable of forming an FAB having a good shape with high sphericity. A bonding wire W according to the present invention has a core material 10 that contains Ag as a principal component and a covering layer 12 that is provided on a surface of the core material 10 and that contains Au as a principal component, wherein: the core material 10 contains one or more types of materials selected from the group consisting of Au, Pd, and In; the ratio of the film thickness of the covering layer 12 with respect to the diameter of the core material 10 is 0.0014 to 0.0048; and the ratio of the specific resistance of the core material 10 with respect to the specific resistance of the covering layer 12 is 85% to 115%.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
33.
Mask Jig, Film Formation Method, and Film Formation Apparatus
A mask jig, by which a film having stable quality can be efficiently formed on a surface of a substrate, includes a main body portion and a mask cover. The main body portion includes a first surface and a second surface located opposite to the first surface. The mask cover is disposed on the second surface side of the main body portion so as to overlap with the main body portion, and includes a third surface and a fourth surface located opposite to the third surface. The mask cover is composed of an imide-based resin.
An electromagnetic wave shielding film includes: a protective layer; a shield layer laminated on the protective layer; and an adhesive layer laminated on the shield layer. Conductive bumps are formed on a side of the adhesive layer of the shield layer. The conductive bumps are positioned on a tessellation of one kind of polygon at vertices of respective polygons, and the conductive bumps are arranged such that, with respect to each of the conductive bumps, when drawing line segments connecting respective conductive bumps and nearest conductive bumps at a nearest position and drawing a straight line passing through one line segment among the drawn line segments, the straight line has a portion that does not overlap with the other line segments.
An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive adhesive layer is subjected to high temperature. The conductive adhesive layer is a conductive adhesive layer including a binder component and conductive particles, wherein the conductive particles include conductive particles A having a median diameter of 100% or more of a thickness of the conductive adhesive layer, and conductive particles B having a median diameter of 1 to 50% of the median diameter of the conductive particles A, a content of the conductive particles is 110 to 900 parts by mass based on 100 parts by mass of the binder component, and a mass ratio of the conductive particles A to the conductive particles B is 0.1 to 7.2.
The present invention provides: an electromagnetic wave-shielding film in which the interlayer adhesion between an adhesive layer and a shield layer is unlikely to be destroyed even if the film is heated through reflow or the like; and a manufacturing method for the electromagnetic wave-shielding film. The present invention pertains to an electromagnetic wave-shielding film comprising a conductive adhesive layer, and a shield layer laminated on the conductive adhesive layer, the film being characterized in that the conductive adhesive layer contains at most 50 wt% of a conductive filler, and the specific surface area of the conductive filler is at most 0.9 m2/g.
An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A1) including one or more island-shaped metal layer fragments. Each opening (A1) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).
Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X≤Y≤100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region. When optional three unique regions including the optional region are viewed in plan view so that the distribution number Np in each region be 9 to 25, the ratio Ng/Np is 0.8 to 1.0, where Ng represents the distribution number of conductive particles present in two or more of the three regions.
An electromagnetic wave shielding film includes: a protective layer; a shield layer laminated on the protective layer; and an adhesive layer laminated on the shield layer, a plurality of conductive bumps formed on a side of the adhesive layer of the shield layer, in a plan view of the shield layer from the side of the adhesive layer, the conductive bumps being positioned on a tessellation of two or more kinds of polygons at vertices thereof, with the conductive bumps being arranged such that, with respect to each of them, when drawing line segments connecting the respective conductive bumps and nearest conductive bumps at a nearest position and drawing a straight line passing through one drawn line segment, the straight line has a portion that does not overlap with the other line segments.
Provided are a masking jig, a film formation method, and a film formation device that enable efficient formation of a film with consistent quality on the surface of a substrate. A masking jig is used in a thermal spraying method, and includes a body portion. The body portion includes a first surface and a second surface. The second surface is located on a side opposite to the first surface. The body portion has a through hole formed therethrough extending from the first surface to the second surface. The second surface includes inclined surfaces having inclination angles θ1 and θ2 of larger than or equal to 30° and smaller than 90° with respect to the first surface. An open end of the through hole in the second surface is formed in the inclined surfaces.
B05B 7/14 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz agencés pour projeter des matériaux en particules
B05B 12/20 - Éléments de masquage, c.-à-d. éléments définissant des aires non revêtues sur un objet à revêtir
B05D 1/12 - Application de matériaux en particules
It is an object of the present invention to provide a thermally conductive sheet that is excellent in thermally conductive property, has insulation property, has a low permittivity, and is excellent in designability. The thermally conductive sheet 1 comprises a binder component 11, titanium oxide, titanium nitride, and a thermally conductive filler 12 other than these, and a ratio of the titanium oxide to the total of the titanium oxide and the titanium nitride is 20 to 90% by mass. An L* value of a surface of the thermally conductive sheet 1 in the L*a*b* color system is preferably 41 or less. The total content of the titanium oxide and the titanium nitride is preferably 0.3 to 10.0 parts by mass based on the total amount 100 parts by mass of the thermally conductive filler 12.
The present invention provides an electromagnetic shielding film in which the interlayer adhesion between an adhesive layer and a metal foil is unlikely to be destroyed even if the film is heated with reflow etc. The present invention relates to an electromagnetic wave shielding film characterized in that: the electromagnetic wave shielding film contains an adhesive layer including a resin, and a metal foil laminated on the adhesive layer; the moisture-vapor transmission of the metal foil is 0.40 g/(m2·day) or more; and the moisture content of the adhesive layer is 1.00% by weight of less.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
The present invention provides an electroconductive adhesive layer which is capable of exhibiting sufficient adhesion strength to various adherends even if compression bonding is performed at low temperatures for a short period of time. This electroconductive adhesive layer (1) contains a binder component (11) and metal particles A (12a) that have a melting point of 170°C or less; and the metal particles A (12a) protrude from the surface. It is preferable that this electroconductive adhesive layer (1) additionally contains metal particles B (12b) which can be alloyed with the metal particles A (12a); and it is also preferable that this electroconductive adhesive layer (1) additionally contains solder particles C (12c). In addition, it is preferable that the metal particles A (12a) are spherical.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Power distribution or control machines and apparatus; rotary
converters; phase modifiers; electrical connectors; electric
cable adapters; electrical adapters; electrical sockets,
plugs and electric connections; connections, electric;
electrical terminals; electric wires and cables; flexible
flat cables, electric; wire connectors [electricity]; cable
connectors; splices for electrical transmission lines;
electric cable connectors; connections for electric lines.
Provided is a double-sided pressure-sensitive adhesive sheet which exhibits repairability when bonded to an adherend and with which adhesive strength after bonding can be intentionally improved by carrying out a heat treatment or a pressing treatment. A double-sided pressure-sensitive adhesive sheet 3 has a pressure-sensitive adhesive layer 2 on both surfaces of a base material 1. The pressure-sensitive adhesive layer 2 contains a binder component, a metal oxide and a black pigment. If the total amount of the binder component, the metal oxide and the black pigment is taken to be 100 mass%, the mass ratio of the metal oxide and the black pigment is 36.5:0.4 to 37.5:0.1. In addition, it is preferable for the metal oxide to be titanium oxide, for a release film to be layered on at least one of the pressure-sensitive adhesive layers 2, and for the L* value, as measured from the release film side, to be 40-75.
An electroconductive composition comprising: 100 parts by mass of a binder component comprising 40-70 parts by mass of a solid bisphenol type epoxy resin and 30-60 parts by mass of one or more liquid epoxy resins including at least one resin selected from the group consisting of alicyclic epoxy resins and rubber-modified epoxy resins; 1,400-2,500 parts by mass of electroconductive particles (B); 60-120 parts by mass of a blocked isocyanate hardener (C); and a solvent (D).
This conductive coating contains, with respect to 100 parts by mass of a binder component (A) containing an epoxy resin: 1200-3200 parts by mass of metal particles (B); 70-200 parts by mass of a block isocyanate curing agent (C); 5-50 parts by mass of a curing agent (D) that is at least one selected from the group consisting of an amine-based curing agent and an imidazole-based curing agent; and 100-1,500 parts by mass of a solvent (E).
C09D 163/00 - Compositions de revêtement à base de résines époxyCompositions de revêtement à base de dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
This conductive paste contains, with respect to (A) 100 parts by mass of a binder component containing 5-60 parts by mass of a solid epoxy resin and 40-95 parts by mass of a liquid epoxy resin in a range not exceeding a total amount of 100 parts by mass: (B) 770-4300 parts by mass of spherical high-melting-point metal particles having a melting point of at least 800°C; (C) 1510-5400 parts by mass of spherical low-melting-point metal particles having a melting point of at most 240°C; (D) 10-150 parts by mass of a curing agent; and (E) 30-200 parts by mass of a flux.
Metalworking machines and tools; metal surface treatment
machines and tools; spray coating machines and apparatus;
spray guns for coating and parts and fittings therefor;
spray nozzles for coating machines and apparatus; powder
coating spray guns and parts and fittings therefor; plastic
surface treatment machines and apparatus; semiconductor
manufacturing machines; surface treatment machines for
semiconductor wafers and integrated circuits; surface
treatment machines for the use in manufacturing
semiconductors; thin film deposition equipment for
semiconductors, metal, insulators, plastics, ceramics and
glass; ceramic surface treatment machines and apparatus;
parts and fittings for industrial surface treatment
equipment for metal, plastics, ceramics and glass; parts and
fittings for industrial surface treatment apparatus for the
use in modifying the surface of metal, plastics, ceramics
and glass; parts and fittings for thick film disposition
apparatus for the surface of metal, plastics, ceramics and
glass; parts and fittings for cold spray equipment, namely,
nozzles, nozzle tips, nozzle holders, nozzle connectors for
the use in industrial surface treatment for metal, plastics,
ceramics and glass.
50.
MASKING JIG, FILM FORMATION METHOD, AND FILM FORMATION DEVICE
A masking jig (1) is used in thermal spraying. The masking jig (1) comprises a body part (11). The body part (11) includes a first surface (11a) and a second surface (11b). The second surface (11b) is positioned on the reverse side from the first surface (11a). A through hole (12) is formed in the body part (11) reaching from the first surface (11a) to the second surface (11b). In the through hole (12), a first through hole (12a) formed so as to open the first surface (11a), and a second through hole (12b) formed so as to open the second surface (11b) run together. A second width (X2), which is the width in a direction along the first surface (11a) of the second through hole (12b), is greater than a first width (X1), which is the width in a direction along the first surface (11a) of the first through hole (12a). The body part (11) is formed by an imide resin.
B05B 7/16 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz comportant des moyens pour chauffer la matière à projeter
B05B 12/20 - Éléments de masquage, c.-à-d. éléments définissant des aires non revêtues sur un objet à revêtir
C23C 4/02 - Pré-traitement du matériau à revêtir, p. ex. pour revêtement de parties déterminées de la surface
Metalworking machines and tools; metal surface treatment
machines and tools; spray coating machines and apparatus;
spray guns for coating and parts and fittings therefor;
spray nozzles for coating machines and apparatus; powder
coating spray guns and parts and fittings therefor; plastic
surface treatment machines and apparatus; semiconductor
manufacturing machines; surface treatment machines for
semiconductor wafers and integrated circuits; surface
treatment machines for the use in manufacturing
semiconductors; thin film deposition equipment for
semiconductors, metal, insulators, plastics, ceramics and
glass; ceramic surface treatment machines and apparatus;
parts and fittings for industrial surface treatment
equipment for metal, plastics, ceramics and glass; parts and
fittings for industrial surface treatment apparatus for the
use in modifying the surface of metal, plastics, ceramics
and glass; parts and fittings for thick film disposition
apparatus for the surface of metal, plastics, ceramics and
glass; parts and fittings for cold spray equipment, namely,
nozzles, nozzle tips, nozzle holders, nozzle connectors for
the use in industrial surface treatment for metal, plastics,
ceramics and glass.
52.
ELECTROCONDUCTIVE ADHESIVE AND ELECTROMAGNETIC SHIELD FILM
Provided is an electroconductive adhesive which has both a high creep resistance at high temperatures and high adhesivity. This electroconductive adhesive is a sheet-type electroconductive adhesive comprising: electroconductive particles; a resin composition; a first main surface; and a second main surface opposing the first main surface. The conductive adhesive is characterized in that: the storage elastic modulus thereof at 65°C is 1.6×104Pa or more; and the arithmetic roughness Ra of the first main surface is 4 μm or less.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Electric power distribution apparatus; rotary converters; phase modifiers; electrical connectors; electric cable adapters; electrical adapters; electrical sockets, plugs and electric connections; connections, electric; electrical terminal boxes; electric wires and cables; flexible flat cables, electric; wire connectors for electricity; cable connectors; splices for electrical transmission lines; electric cable connectors; connections for electric lines
This coil (100A) comprises an electric wire (1) that is wound around a center axis (2) once or multiple times in a spiral manner. The electric wire (1) includes a conductor (10) having a long narrow cross-sectional shape (11) in a plane that includes the center axis (2). The cross-sectional shape (11) is curved so that a first end (12) and a second end (13) in the longitudinal direction are spaced away from the center axis (2). Consequently, loss is reduced in the coil comprising the electric wire that is wound once or multiple times in a spiral manner.
This masking jig (1) is used in a thermal spraying method. The masking jig (1) is provided with a body part (11). The body part (11) includes a first surface (11a) and a second surface (11b). The second surface (11b) is positioned on the reverse side from the first surface (11a). A body through hole (12) is formed in the body part (11) reaching from the first surface (11a) to the second surface (11b). The masking jig (1) is further provided with a mounting member (14) that can be mounted in/detached from the body through hole (12). A member through hole (15) penetrating in a first direction linking the first surface (11a) and the second surface (11b) when the mounting member (14) is inserted into the body through hole (12) is formed in the mounting member (14). The mounting member (14) is formed from an imide-based resin.
B05B 12/24 - Éléments de masquage, c.-à-d. éléments définissant des aires non revêtues sur un objet à revêtir fabriqués au moins partiellement en matériau flexible, p. ex. en feuilles de papier ou en tissu
Provided is a flexible heat dissipating sheet having excellent electromagnetic shielding properties and heat dissipating properties. This heat dissipating sheet 1 includes an electrically conductive adhesive layer 2, and heat dissipating films 3, 4 respectively formed on opposite sides of the electrically conductive adhesive layer 2, wherein the electrically conductive adhesive layer 2 contains an electrically conductive filler and a binder component, and the heat dissipating films 3, 4 contains a thermally conductive filler and a binder component. The size of an uneven shape formed between the heat dissipating film 3 and at least one surface of the electrically conductive adhesive layer 2 is preferably 1-50 μm. A dendrite-shaped and/or flake-shaped material is preferably included as the electrically conductive filler.
H01L 23/36 - Emploi de matériaux spécifiés ou mise en forme, en vue de faciliter le refroidissement ou le chauffage, p. ex. dissipateurs de chaleur
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
09 - Appareils et instruments scientifiques et électriques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Electronic control apparatus for machines; apparatus for
processing electronic payments; electronic communication
apparatus; electronic control apparatus; heat dissipation
sheets being structural parts or components of electronic
control apparatus for machines; heat dissipation sheets
being structural parts or components of apparatus for
processing electronic payments; heat dissipation sheets
being structural parts or components of electronic
communication apparatus; heat dissipation sheets being
structural parts or components of electronic control
apparatus; computers; computer peripheral devices; heat
dissipation sheets being structural parts or components of
computers; heat dissipation sheets being structural parts or
components of computer peripheral devices; semi-conductor
elements; heat dissipation sheets being structural parts or
components of semi-conductor elements; electronic circuits;
heat dissipation sheets being structural parts or components
of electronic circuits; integrated circuits; heat
dissipation sheets being structural parts or components of
integrated circuits; chips [integrated circuits]; heat
dissipation sheets being structural parts or components of
chips [integrated circuits]; printed circuit boards; heat
dissipation sheets being structural parts or components of
printed circuit boards; laboratory apparatus and
instruments; heat dissipation sheets being structural parts
or components of laboratory apparatus and instruments;
photographic machines and instruments; cinematographic
machines and apparatus; optical machines and apparatus; heat
dissipation sheets being structural parts or components of
photographic machines and instruments; heat dissipation
sheets being structural parts or components of
cinematographic machines and apparatus; heat dissipation
sheets being structural parts or components of optical
machines and apparatus; measuring or testing machines and
instruments; heat dissipation sheets being structural parts
or components of measuring or testing machines and
instruments; power distribution or control machines and
apparatus; phase modifiers; heat dissipation sheets being
structural parts or components of power distribution or
control machines and apparatus; heat dissipation sheets
being structural parts or components of phase modifiers;
personal digital assistants; heat dissipation sheets being
structural parts or components of personal digital
assistants; electronic circuits and CD-ROMs recorded with
programs for hand-held games with liquid crystal displays;
heat dissipation sheets being structural parts or components
of electronic circuits and CD-ROMs recorded with programs
for hand-held games with liquid crystal displays; game
programs for arcade video game machines; heat dissipation
sheets being structural parts or components of game programs
for arcade video game machines; solar batteries; batteries
and cells; heat dissipation sheets being structural parts or
components of solar batteries; heat dissipation sheets being
structural parts or components of batteries and cells;
consumer video game programs; heat dissipation sheets being
structural parts or components of consumer video game
programs; telecommunication machines and apparatus; heat
dissipation sheets being structural parts or components of
telecommunication machines and apparatus. Electrical insulating materials; thermal insulating
materials, not for buildings; silicone rubber; thermal
conductive silicone gels being silicone semi-worked
products; plastic sheets for heat dissipation purposes for
use in manufacture; plastic sheets for cooling purposes for
use in manufacture; semi-processed silicones being thermally
conductive insulators in sheet form; thermally conductive
insulators made of silicone, in sheet form; silicone
semi-worked products for thermal conductive sheets; thermal
conductive artificial resin in sheet form; thermal
conductive polymer resin in sheet form.
Provided is an electromagnetic shielding film having both sufficiently high concealment characteristics and anti-scratch characteristics for a surface of a protective layer. This electromagnetic shielding film comprises a protective layer having a first main surface and a second main surface opposing the first main surface, and a shield layer disposed on the second main surface of the protective layer, the electromagnetic shielding film being characterized in that the developed surface area ratio Sdr of the interface of the first main surface is 75.0-250%.
Provided is a biological electrode including a polarizable electrode layer; and a non-polarizable electrode layer layered on the polarizable electrode layer. The non-polarizable electrode layer includes a first silver layer layered on the polarizable electrode layer; a polymer layer layered on the first silver layer; and a second silver layer layered on the polymer layer, and at least the second silver layer includes silver chloride.
A61B 5/265 - Électrodes bioélectriques à cet effet caractérisées par les matériaux des électrodes contenant de l’argent ou du chlorure d’argent
A61B 5/268 - Électrodes bioélectriques à cet effet caractérisées par les matériaux des électrodes contenant des polymères conducteurs, p. ex. des polymères PEDOT:PSS
Metalworking machines and machine tools; metal surface treatment machines and machine tools; spray coating machines and apparatus; spray guns for coating and parts and fittings therefor; machine parts, namely, spray nozzles for coating machines and apparatus; powder coating spray guns and parts and fittings therefor; plastic surface treatment machines and apparatus; thin film deposition equipment for metal, insulators, plastic, ceramics and glass, namely, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns; ceramic surface treatment machines and apparatus; parts and fittings for industrial surface treatment equipment in the nature of nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns for metal, plastics, ceramics and glass; parts and fittings for industrial surface treatment machines for the use in modifying the surface of metal, plastics, ceramics and glass; parts and fittings for thick film disposition machines for the surface of metal, plastics, ceramics and glass; parts and fittings for cold spray equipment in the nature of power-operated sprayers, pneumatic blow guns and powder coating spray guns, namely, nozzles, nozzle tips, nozzle holders, nozzle connectors for the use in industrial surface treatment for metal, plastics, ceramics and glass
Metalworking machines and machine tools; metal surface treatment machines and machine tools; spray coating machines and apparatus; spray guns for coating and parts and fittings therefor; machine parts, namely, spray nozzles for coating machines and apparatus; powder coating spray guns and parts and fittings therefor; plastic surface treatment machines and apparatus; thin film deposition equipment for metal, insulators, plastic, ceramics and glass, namely, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns; ceramic surface treatment machines and apparatus; parts and fittings for industrial surface treatment equipment in the nature of nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns for metal, plastics, ceramics and glass; parts and fittings for industrial surface treatment machines for the use in modifying the surface of metal, plastics, ceramics and glass; parts and fittings for thick film disposition machines for the surface of metal, plastics, ceramics and glass; parts and fittings for cold spray equipment in the nature of power-operated sprayers, pneumatic blow guns and powder coating spray guns, namely, nozzles, nozzle tips, nozzle holders, nozzle connectors for the use in industrial surface treatment for metal, plastics, ceramics and glass
62.
Shield printed wiring board with ground member and ground member
A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided. A shielded printed wiring board with a ground member of the present invention is a shielded printed wiring board with a ground member, including: a substrate film formed by sequentially stacking a base film, a printed circuit including a ground circuit, and an insulating film; a shielding film including a shielding layer and a protective layer laminated on the shielding layer, the shielding film covering the substrate film such that the shielding layer is closer to the substrate film than the protective layer is; and a ground member arranged on the protective layer of the shielding film, the ground member including an external connection member having a first main surface and a second main surface opposite to the first main surface, and having electroconductivity, electroconductive particles disposed on the first main surface side, and an adhesive resin for fixing the electroconductive particles to the first main surface, wherein circularity of the cross sections of the electroconductive particles in the cross section of the ground member is 0.35 or more, and the electroconductive particles are penetrating the protective layer of the shielding film and connected to the shielding layer of the shielding film, and the external connection member of the ground member is electrically connectable to an external ground.
H01R 4/04 - Connexions conductrices de l'électricité entre plusieurs organes conducteurs en contact direct, c.-à-d. se touchant l'un l'autreMoyens pour réaliser ou maintenir de tels contactsConnexions conductrices de l'électricité ayant plusieurs emplacements espacés de connexion pour les conducteurs et utilisant des organes de contact pénétrant dans l'isolation utilisant des adhésifs électriquement conducteurs
63.
Electromagnetic wave shielding film and shielded printed wiring board
An electromagnetic wave shielding film that can be thinned, and has high peel strength, electroconductivity, shielding properties, and flex resistance and conformability to a step is provided. An electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition, wherein the electroconductive particles contain flaky electroconductive particles and spherical electroconductive particles, the average particle size of the spherical electroconductive particles is 1 to 10 μm, the content of the flaky electroconductive particles and the spherical electroconductive particles in the electroconductive adhesive layer is 70 to 80% by weight, the weight ratio of the flaky electroconductive particles to the spherical electroconductive particles, [flaky electroconductive particles]/[spherical electroconductive particles], is 6/4 to 8/2, and the thickness of the electroconductive adhesive layer is 5 to 20 μm.
A nozzle (2b) used in a thermal spraying method such as cold spraying comprises a nozzle pipe (23) through which a powder (10), which serves as a film-forming raw material, and a working gas pass. The nozzle pipe (23) has an inner peripheral surface where the surface roughness Sa has a D10 cumulative particle size distribution of the powder (10) of not more than 25%.
B05B 7/16 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz comportant des moyens pour chauffer la matière à projeter
Provided is a double-sided adhesive sheet which has excellent film processability and excellent adhesiveness. This double-sided adhesive sheet 3 comprises a substrate layer 1 and adhesive layers 2 including a heat-curable resin and superposed respectively on both surfaces of the substrate layer 1, wherein the substrate layer 1 has a modulus of 50-200 GPa. The double-sided adhesive sheet 3 has a modulus of 2-195 GPa. The heat-curable resin preferably includes a modified epoxy resin. The modulus of the substrate layer 1 is preferably 50-100 GPa. The substrate layer 1 has a thickness of preferably 2-40 μm.
Provided is a conductive adhesive layer having sufficiently high heat dissipation properties in the thickness direction while maintaining electromagnetic wave shielding properties. This conductive adhesive layer comprises a binder component and conductive particles, and is characterized in that: the conductive particles include first particles and second particles having a median diameter smaller than that of the first particles; the second particles are flaky particles obtained by covering the core particles with a metal layer; and the ratio of the mass of the conductive particles to the mass of the conductive adhesive layer is 60 to 90 mass%.
Provided is an electromagnetic shield film in which the interlayer adhesion between an adhesive layer and a shield layer is unlikely to break down even upon heating with reflow etc. An electromagnetic shield film according to the present invention comprises an adhesive layer and a shield layer that is laminated on the adhesive layer, said electromagnetic shield film being characterized in that: the adhesive layer contains resin and porous inorganic particles; and the pore volume of the porous inorganic particles is more than 0.44 mL/g but not more than 1.80 mL/g.
Provided is a conductive composition that can form a cured product having excellent conductive properties and adhesion to an adherend even at a lower curing temperature than is conventional. A conductive composition according to the present invention contains an epoxy compound, an imidazole compound, an amine adduct-based latent curing agent, an alkanolamine and/or aliphatic polyamine, and a metal powder, wherein: the epoxy equivalent of the epoxy compound is 100-300 g/eq; the mixed proportion of the metal powder in the conductive composition is 75-91 mass%; the imidazole compound includes an imidazole compound having a phenyl group; and 10-40 parts by mass of the imidazole compound, at least 3 parts by mass of the amine adduct-based latent curing agent, and at least 0.5 parts by mass of the alkanolamine and/or aliphatic polyamine are included relative to 100 parts by mass of the epoxy compound.
A powder charging component (1) comprises a first component (10) including a bottom section (11) and an outer frame (12), and a second component (15). The bottom section (11) has a bottom section hole (11CV) formed therein. The outer frame (12) extends from the outer periphery of the bottom section (11) in a first direction that intersects the bottom section (11). The second component (15) can be attached to the bottom section (11) so as to be surrounded by the outer frame (12). The second component (15) includes a leading end section (15A) with width in a planar view. The leading end section (15A) extends in the first direction and has a cylindrical part in which a first cavity (15CV) is formed.
B01J 4/00 - Dispositifs d'alimentationDispositifs de commande d'alimentation ou d'évacuation
B05C 19/06 - Stockage, alimentation ou régulation de l'application du matériau en particulesRécupération du matériau en particules en excès
B05D 1/02 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces réalisés par pulvérisation
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
B65B 69/00 - Déballage des objets ou matériaux non prévu ailleurs
B05B 7/16 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz comportant des moyens pour chauffer la matière à projeter
Provided is a thermally-conductive electrical conducting layer excelling in thermal conductivity in the thickness direction. The thermally-conductive electrical conducting layer (1) comprises a binder component (11) and electrically-conductive particles (12). The electrically-conductive particles (12) comprise: electrically-conductive particles A (12a) having a thermal conductivity of 20 W/mK or more and a median diameter that is larger than the thickness (T) of the thermally-conductive electrical conducting layer (1); and electrically-conductive particles B (12b) having a median diameter that is smaller than the thickness (T) of the thermally-conductive electrical conducting layer (1). The resistivity of the thermally-conductive electrical conducting layer (1) is 2.0×10-5 Ω·m or more.
H01B 5/16 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant un matériau conducteur incorporé à un matériau isolant ou faiblement conducteur, p. ex. du caoutchouc conducteur
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
Provided is an electromagnetic wave shield film from which static electricity that has accumulated during manufacture or transfer can be readily dissipated. An electromagnetic wave shield film of the present invention is characterized by comprising a protection layer disposed in an outermost layer, and a shield layer laminated on the inside of the protection layer, the protection layer having a surface resistivity of 1.0×105to 2.0×1012 Ω/□, and the protection layer includes a binder resin and carbon particles having an average particle diameter of 0.1-15 μm.
Provided is an electromagnetic wave shield film that has high volatile component permeability but also has sufficient high-frequency electromagnetic wave shielding characteristics. This electromagnetic wave shield film is formed by layering, in order, a protection layer, a metal vapor deposition layer, an electroplating layer, and a conductive adhesive layer. The electromagnetic wave shield film is characterized in that a plurality of through holes are formed in the electroplating layer, the through holes being filled with an insulating resin.
Provided is an electroconductive resin composition capable of forming a shield layer having exceptional adhesiveness to an object being coated even when exposed to high temperature and having exceptional shielding properties for the surface of the the object being coated. The electroconductive resin composition contains, per 100 parts by mass of a binder component (A), 4,000-15,000 parts by mass of metal particles (B), 1-20 parts by mass of a curing agent (C), and 300-4,000 parts by mass of a solvent (D). The binder component (A) contains 10-60 mass% of a rubber-modified epoxy resin (A1) and 40-90 mass% of an acrylic compound (A2). The metal particles (B) contain 2,000-13,500 parts by mass of metal particles (B1) that are silver powder and/or silver-coated copper powder and have an average particle size of 1-20 μm, and 400-7,500 parts by mass of metal particles (B2) that are spherical silver powder having an average particle size of 100-500 nm. The mass ratio [(B1):(B2)] of the metal particles (B1) and the metal particles (B2) is 5:5-9:1.
Provided is an electromagnetic wave shield film that does not readily accumulate volatile components between a metal layer and a conductive adhesive layer and has sufficiently high shielding properties for electromagnetic waves in the high-frequency band. This electromagnetic wave shield film is characterized by being formed by layering, in order, a protection layer, an isotropic conductive adhesive layer, a metal layer, and a conductive adhesive layer, the metal layer having an opening part.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
The present invention provides a conductive paste which is capable of forming a cured product that achieves high conductivity and long-term reliability at the same time. The present invention provides a conductive paste which contains, per 100 parts by mass of a liquid epoxy compound, 1,700 parts by mass to 3,300 parts by mass of metal particles that include high melting point metal particles (B1) which contain silver and/or copper and have a melting point of 800°C or higher, low melting point metal particles (B2) which are formed of an alloy having a melting point of 130°C to 150°C, and low melting point metal particles (B3) which are formed of an alloy of two or more metals selected from the group consisting of tin, silver, copper, bismuth and indium, and have a melting point of 200°C to 240°C, 1 part by mass to 30 parts by mass of a curing agent, and 20 parts by mass to 200 parts by mass of a flux.
09 - Appareils et instruments scientifiques et électriques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Electromagnetic interference shielding films being
structural parts or components of cellular phones;
electromagnetic interference shielding films being
structural parts or components of smartphones;
electromagnetic interference shielding films being
structural parts or components of tablet computers;
electromagnetic interference shielding films being
structural parts or components of computers; electromagnetic
interference shielding films being structural parts or
components of event recorders; electromagnetic interference
shielding films being structural parts or components of
navigational instruments for vehicles; electromagnetic
interference shielding films being structural parts or
components of Global Positioning System [GPS] apparatus;
electromagnetic interference shielding films being
structural parts or components of camcorders;
electromagnetic interference shielding films being
structural parts or components of printed circuit boards;
electromagnetic interference shielding films being
structural parts or components of flexible printed circuits;
electromagnetic interference shielding films being
structural parts or components of telecommunication machines
and apparatus; electromagnetic interference shielding films
being structural parts or components of computers and their
peripherals; electromagnetic interference shielding films
being structural parts or components of electron tubes;
electromagnetic interference shielding films being
structural parts or components of semi-conductor elements;
electromagnetic interference shielding films being
structural parts or components of electronic circuits, not
including those recorded with computer programs;
electromagnetic interference shielding films being
structural parts or components of computer program;
electromagnetic interference shielding films being
structural parts or components of personal digital
assistants; electromagnetic interference shielding materials
being structural parts or components of telecommunication
machines and apparatus; electromagnetic interference
shielding materials being structural parts or components of
computers and their peripherals; electromagnetic
interference shielding materials being structural parts or
components of electron tubes; electromagnetic interference
shielding materials being structural parts or components of
semi-conductor elements; electromagnetic interference
shielding materials being structural parts or components of
electronic circuits, not including those recorded with
computer programs; electromagnetic interference shielding
materials being structural parts or components of computer
program; electromagnetic interference shielding materials
being structural parts or components of personal digital
assistants; cellular phones; smartphones; tablet computers;
computers; event recorders; navigation apparatus for
vehicles [on-board computers]; Global Positioning System
[GPS] apparatus; camcorders; printed circuit boards;
flexible printed circuits; semi-conductors; parts of
semi-conductors; telecommunication machines and apparatus;
computers and their peripherals; electron tubes;
semi-conductor elements; electronic circuits, not including
those recorded with computer programs; computer program;
personal digital assistants. Electrical insulating materials; adhesive tapes, other than
stationery and not for medical or household purposes;
electromagnetic interference shielding plastic films;
electromagnetic interference shielding films;
electromagnetic interference shielding materials; adhesive
conductive plastic films; adhesive electromagnetic
interference shielding films; plastic substances,
semi-processed; plastic film, other than for wrapping;
plastic semi-worked products.
This bonding wire contains 0.005-2.0 mass% of In, a total of 0.005-2.0 mass% one or both of Au and Pd, a total of 5-500 ppm by mass of one or both elements selected from Bi and Cu, and a total of 0-500 ppm by mass of one or more elements selected from the group consisting of Ca, Mg, Ge, Y, Nd, Sm, Gd, La and Ce, with the remainder comprising Ag. Due to this configuration, it is possible to achieve excellent long-term reliability and achieve a good circular shape when a FAB is brought into contact with an electrode and crushed.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a transfer film that transfers recesses and projections to a protective layer of an electromagnetic wave shield film, thereby successfully imparting a matte effect to the surface of the protective layer, and that can be used to produce an electromagnetic wave shield film in which cracks do not easily occur in the protective layer during thermocompression bonding. This transfer film is provided with a matte effect transfer layer having a matte effect transfer surface, and is characterized in that the matte effect transfer layer comprises a resin filler.
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B32B 7/06 - Liaison entre couches permettant une séparation sans difficultés
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
The present invention provides an electromagnetic wave shield film that is not easily damaged even when placed on a high step-height substrate. The electromagnetic wave shield film comprises a protective layer and an isotropic conductive adhesive layer laminated on the protective layer, wherein the protective layer contains a protective layer filler, the isotropic conductive adhesive layer contains a resin component, a conductive filler, and a non-conductive filler, the ratio of the weight of the conductive filler to the weight of the non-conductive filler (the weight of the conductive filler/the weight of the non-conductive filler) is 15.0-23.0, and the ratio of the total weight of the conductive filler and the non-conductive filler to the weight of the protective layer filler ((the weight of the conductive filler + the weight of the non-conductive filler)/the weight of the protective layer filler) is 1.9-2.2.
A conductive composition is provided that can be spray coated to form a shielding layer having good shielding capability against 100 MHz to 40 GHz electromagnetic waves, and having desirable adhesion to a package with good laser mark visibility. A method of production of a shielded package with such a conductive composition is also provided. A conductive composition includes at least: (A) a (meth)acrylic resin having a weight average molecular weight of 1,000 or more and 400,000 or less; (B) a monomer having a glycidyl group and/or a (meth)acryloyl group within the molecule; (C) a granular resin component having an average particle diameter of 10 nm to 700 nm; (D) a conductive filler having an average particle diameter of 10 to 500 nm; (E) a scale-like conductive filler having an average particle diameter of 1 to 50 μm; (F) a radical polymerization initiator; and (G) an epoxy resin curing agent, the granular resin component (C) being present in a proportion of 3 to 27 mass % in a resin component containing the acrylic resin (A), the monomer (B), and the granular resin component (C), the conductive filler (D) and the conductive filler (E) being present in an amount of 2,000 to 12,000 parts by mass in total relative to 100 parts by mass of the resin component, the radical polymerization initiator (F) being present in an amount of 0.5 to 40 parts by mass relative to 100 parts by mass of the resin component, and the epoxy resin curing agent (G) being present in an amount of 0.5 to 40 parts by mass relative to 100 parts by mass of the resin component.
C09D 133/10 - Homopolymères ou copolymères d'esters de l'acide méthacrylique
C09D 133/14 - Homopolymères ou copolymères d'esters d'esters contenant des atomes d'halogène, d'azote, de soufre ou d'oxygène en plus de l'oxygène du radical carboxyle
C09D 163/00 - Compositions de revêtement à base de résines époxyCompositions de revêtement à base de dérivés des résines époxy
C09D 4/06 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
H01L 23/552 - Protection contre les radiations, p. ex. la lumière
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
81.
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
Provided is an electromagnetic wave shielding film that exhibits a high peel strength and connection reliability by its electroconductive adhesive layer and that can suppress the generation of cracking in an insulating layer laminated on the electroconductive adhesive layer. The electromagnetic wave shielding film according to the present invention comprises an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition, and an insulating layer laminated on the electroconductive adhesive layer, and is characterized in that the electroconductive particles comprise higher-melting-point electroconductive particles and lower-melting-point electroconductive particles having a melting point lower than that of the higher-melting-point electroconductive particles; in that the higher-melting-point electroconductive particles contain high-melting-point flake particles and high-melting-point spherical particles; and in that the content of the high-melting-point flake particles is 60-80 wt% with reference to the total content of the high-melting-point flake particles plus the high-melting-point spherical particles plus the lower-melting-point electroconductive particles.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 7/025 - Propriétés électriques ou magnétiques
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
Provided is a biological electrode including: a polarizable electrode layer; and a non-polarizable electrode layer laminated on the polarizable electrode layer, in which the non-polarizable electrode layer includes a resin, silver, and silver chloride supported by silica, a content of the silver is 150 to 300 mass parts based on 100 mass parts of the resin, a ratio between the silver and the silver chloride is 97:3 to 95:5, and the non-polarizable electrode layer has a thickness of 3 to 5 μm.
This film-forming device used in thermal spraying comprises: a spray gun including a nozzle (2b); a powder supply unit that supplies powder to the spray gun as a film-forming material; and a gas supply unit that supplies an operating gas to the spray gun. The nozzle (2b) includes: a stainless steel pipe (23) serving as a nozzle pipe; a ceramic pipe (22) connected to the stainless steel pipe (23) on the upstream side through which the operating gas flows; and a nozzle holder (21) into which the ceramic pipe (22) is inserted. The nozzle holder (21) includes a first section (21A) extending in a first direction in which the operating gas flows within the nozzle holder (21). The film-forming device further comprises piping (5) connecting the powder supply unit and the first section (21A). Piping (5A), which is a section of the piping (5) connected to the first section (21A), extends in a second direction intersecting the first direction.
B05B 7/04 - Pistolets pulvérisateursAppareillages pour l'évacuation avec des dispositifs permettant le mélange de liquides ou d'autres matériaux fluides avant l'évacuation
B05B 7/16 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz comportant des moyens pour chauffer la matière à projeter
Provided is an electromagnetic wave shield film having sufficiently high bending resistance. The electromagnetic wave shield film according to the present invention is characterized by including a protection layer, a metal layer, and an adhesive layer that are sequentially laminated, wherein the ratio ([repulsive force Y])/[repulsive force X]) of the repulsive force Y of the adhesive layer in an adhesive layer repulsive force measurement test to the repulsive force X of a laminate, which is composed of the protection layer and the metal layer, in a laminate repulsive force measurement test is 0.77 or greater.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 15/088 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des polyamides
85.
SPRAY NOZZLE, NOZZLE TIP PART, AND THERMAL SPRAYING DEVICE
Provided is a spray nozzle that makes it possible to reduce a difference in film thickness in a film. A spray nozzle (1) for use in a cold spray device (100) includes: a nozzle main body (15) that has a first path (20) through which a film material and a carrier gas pass; and a nozzle tip section (16) that is provided at a tip section of the nozzle main body (15) and has a second path (21) which communicates with the first path (20), the second path (21) being broadened at a position apart from a cross-sectional center (P) of the second path (21).
Even in a case where a spray nozzle of a solid phase particle deposition device is in motion, flying solid phase particles are efficiently collected. An attachment (1) includes: an engagement part (2) to be engaged with a spray nozzle (130) of a cold spray device (1); and an opening part (3) connected to the engagement part (2) and having at least one opening (3a, 3b) to be connected to a collection section (20) that is configured to collect solid phase particles (30b) which are sprayed through the spray nozzle (130) onto a base material (170) and are not involved in formation of a film on the base material (170).
B05B 14/10 - Aménagements pour collecter, réutiliser ou éliminer le matériau de pulvérisation excédentaire le matériau excédentaire étant sous forme de particules
B05B 1/28 - Buses, têtes de pulvérisation ou autres dispositifs de sortie, avec ou sans dispositifs auxiliaires tels que valves, moyens de chauffage avec des moyens incorporés pour faire écran au liquide ou autre matériau fluide sortant, p. ex. pour limiter l'aire de pulvérisationBuses, têtes de pulvérisation ou autres dispositifs de sortie, avec ou sans dispositifs auxiliaires tels que valves, moyens de chauffage avec des moyens pour empêcher l'égouttement ou pour recueillir l'excès de liquide ou autre matériau fluide
B05B 12/32 - Éléments d’écran, c.-à-d. éléments empêchant un excès de pulvérisation d’atteindre des aires autres que l’objet à pulvériser
Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.
Provided is an electromagnetic wave shield film capable of blocking or transmitting only electromagnetic waves having a specific frequency. The electromagnetic wave shield film comprises a metamaterial layer having a first major surface and a second major surface opposing the first major surface, and an adhesive layer formed on the second major surface side of the metamaterial layer, and is characterized in that, when the metamaterial layer is viewed in plan from the first major surface side and/or the second major surface side, the metamaterial layer is composed of an electrically conductive region in which predetermined patterns formed of an electrically conductive material are periodically arrayed, and a non-electrically conductive region other than the electrically conductive region.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 7/025 - Propriétés électriques ou magnétiques
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
H01Q 17/00 - Dispositifs pour absorber les ondes rayonnées par une antenneCombinaisons de tels dispositifs avec des éléments ou systèmes d'antennes actives
The present invention provides an electromagnetic-wave-shielding film having adequately high bending resistance, and adequately high electromagnetic-wave-shielding characteristics even when used in transmission circuits that transmit high-frequency-region signals. The electromagnetic-wave-shielding film according to the present invention comprises an adhesive layer, a shield layer laminated on the adhesive layer, and an insulation layer laminated on the shield layer, wherein said electromagnetic-wave-shielding film is characterized in that: a plurality of open portions having an open area of 1 to 5000 µm2are formed on said shielding layer; the open portions include first open portions in which the open area exceeds 1 µm2and is 300 µm2or less, and second open portions in which the open area exceeds 300 µm2and is 5000 µm2 or less; and the proportion of the open portions that are first open portions (cumulative frequency) is 30 to 90% , and the proportion of the open portions that are second open portions (cumulative frequency) is 10 to 70%.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 7/025 - Propriétés électriques ou magnétiques
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
90.
ELECTROCONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Provided is an electroconductive resin composition that can cure at a temperature of 150°C or less and has exceptional electroconductivity, adhesive strength, and solvent resistance after curing. An electroconductive resin composition containing at least 0.3-5 parts by mass of (B) a cationic initiator and 250-2,400 parts by mass of (C) electroconductive particles per 100 parts by mass of a cationically polymerizable compound (A) including (A-1) an alicyclic epoxy compound and (A-2) a rubber-modified epoxy resin, the content ratio of the alicyclic epoxy compound (A-1) being 20 mass% or greater in component (A) and the content ratio of the rubber-modified epoxy resin (A-2) being 0.4-15 mass% in component (A).
09 - Appareils et instruments scientifiques et électriques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Electromagnetic interference shielding films being structural parts or components of cellular phones; electromagnetic interference shielding films being structural parts or components of smartphones; electromagnetic interference shielding films being structural parts or components of tablet computers; electromagnetic interference shielding films being structural parts or components of computers; electromagnetic interference shielding films being structural parts or components of event recorders in the nature of time lapse image recorders, video cameras, dashboard cameras; electromagnetic interference shielding films being structural parts or components of navigational instruments for vehicles; electromagnetic interference shielding films being structural parts or components of Global Positioning System [GPS] apparatus; electromagnetic interference shielding films being structural parts or components of camcorders; electromagnetic interference shielding films being structural parts or components of printed circuit boards; electromagnetic interference shielding films being structural parts or components of flexible printed circuits; electromagnetic interference shielding films being structural parts or components of telecommunication machines and apparatus; electromagnetic interference shielding films being structural parts or components of computers and their peripherals; electromagnetic interference shielding films being structural parts or components of electron tubes; electromagnetic interference shielding films being structural parts or components of semi-conductor elements; electromagnetic interference shielding films being structural parts or components of electronic circuits, not including those recorded with computer programs; electromagnetic interference shielding films being structural parts or components of personal digital assistants; structural parts or components of semi-conductors Adhesive tapes, other than stationery and not for medical or household purposes; electromagnetic interference shielding plastic films being conductive films for electromagnetic radiation shielding in electronic products; electromagnetic interference shielding films being conductive films for electromagnetic radiation shielding in electronic products; electromagnetic interference shielding materials in the nature of electrically conductive films for electromagnetic shielding in electronic devices; adhesive conductive plastic films in the nature of electrically conductive films for electromagnetic shielding in electronic devices; adhesive electromagnetic interference shielding films in the nature of electrically conductive films for electromagnetic shielding in electronic devices; plastic substances, semi-processed; plastic film, other than for wrapping, namely, plastic film for use in manufacturing
The present invention provides a thermally conductive composition which has excellent thermal conductivity, processability, and long-term reliability. The thermally conductive composition comprises: 100 parts by mass of an epoxy resin comprising 1-30 parts by mass of a dimer acid type epoxy resin and 1-40 parts by mass of a liquid epoxy resin (excluding the dimer acid type epoxy resin); and 700-1,700 parts by mass of an electrically conductive filler. The electrically conductive filler contains an electrically conductive filler (A) having a mean particle size (D50) of 5-20 μm, as measured by laser diffraction/scattering particle distribution measurement, and an electrically conductive filler (B) having a mean particle size (D50) of 1-8 μm. The ratio ((A)/(B)) of the mean particle size of the electrically conductive filler (A) to the mean particle size of the electrically conductive filler (B) is not less than 1.5. The ratio ((A)/(B)) of the content of the electrically conductive filler (A) to the content of the electrically conductive filler (B) is 1.0-50.0 by mass.
There is provided a conductive adhesive with which the connection stability between objects that are conductive members is excellent, the connection stability is maintained even when the conductive adhesive is subjected to high temperature, and rising towards the back side of an object is less likely to occur.
A conductive adhesive 1 includes a binder component 12, and metal particles (A) 11 having a 20% compressive strength of 25 MPa or less in a 170° C. environment. The metal particles 11 preferably include a metal having a melting point of 280° C. or less. The content of the metal having a melting point of 280° C. or less in the metal particles (A) 11 is preferably 80% by mass or more.
Provided is a conductive paste that exhibits an excellent conductivity and an excellent long-term reliability. This conductive paste comprises, per 100 parts by mass of a binder component containing an acrylate compound and an epoxy compound, 600-1200 parts by mass of high melting point metal particles comprising silver-coated copper alloy particles, 900-1500 parts by mass of low melting point metal particles having a melting point not greater than 180°C, 0.5-30 parts by mass of a curing agent, and 1-100 parts by mass of a flux.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/107 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques contenant des matériaux organiques comportant des solvants, p. ex. pour la coulée en moule poreux ou absorbant
B22F 1/17 - Particules métalliques revêtues de métal
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
C22C 9/04 - Alliages à base de cuivre avec le zinc comme second constituant majeur
C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
C22C 12/00 - Alliages à base d'antimoine ou de bismuth
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
Provided is an electromagnetic wave shielding film capable of easily adhering to an object, excellent in electrical connection stability, and excellent in transparency, shielding performance, and environmental resistance. The electromagnetic wave shielding film of the present invention has a first insulating layer, a transparent metal layer, a second insulating layer, and a conductive adhesive layer laminated in this order, in which a thickness of the second insulating layer is 10 to 500 nm, the conductive adhesive layer contains a binder component and spherical conductive particles, a median size of the spherical conductive particles is 3 to 50 μm, and a content ratio of the spherical conductive particles is 5 to 20 mass % with respect to 100 mass % of the conductive adhesive layer.
A movable shaft includes a tubular member. The tubular member has a proximal end and a distal end in a longitudinal direction of the tubular member. The tubular member has a bent portion extending along the longitudinal direction and allowed to be bent. Flexibility of the bent portion increases from a side of the proximal end to a side of the distal end.
Provided is an electromagnetic wave shield film having excellent blackness regardless of the constitutive composition of a black layer. An electromagnetic wave shield film 1 is provided on a surface thereof with a protective layer 2. The protective layer 2 has a black protective layer 21. The minimum autocorrelation length Sal of the surface of the protective layer 2 is 10 μm or less. The developed area ratio Sdr of the interface is 200% or more. The ratio [Sdr/Sal] of the Sdr to the Sal is at least 50. The brightness L* on the protective layer 2 side is preferably 24 or less.
A masking jig (1) whereby a film having stable quality can be efficiently formed on the surface of a substrate is provided with a body section (11) and a mask cover (12). The body section (11) includes a first surface (11s1) and a second surface (11s2) positioned on the reverse side from the first surface (11s1). The mask cover (12) is disposed on the second surface (11s2) side of the body section (11) so as to overlap the body section (11), and includes a third surface (12s1) and a fourth surface (12s2) positioned on the reverse side from the third surface (12s1). The mask cover (12) is formed from an imide-based resin.
B05B 7/16 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p. ex. un liquide et de l'air, une poudre et un gaz comportant des moyens pour chauffer la matière à projeter
B05B 12/20 - Éléments de masquage, c.-à-d. éléments définissant des aires non revêtues sur un objet à revêtir
C23C 4/02 - Pré-traitement du matériau à revêtir, p. ex. pour revêtement de parties déterminées de la surface
Provided is an electromagnetic wave shield film which can be easily bonded to an adherend, has excellent adhesion properties and electrical connection stability, and also has excellent environmental resistance. An electromagnetic wave shield film 1 obtained by layering a metal layer 3, a first inorganic layer 4 and a conductive adhesive layer 5 in this order, wherein the thickness of the first inorganic layer 4 is 0.1-100nm, the conductive adhesive layer 5 contains a binder component and conductive particles, and the ratio of the thickness of the conductive adhesive layer 5 to the median diameter of the conductive particles is 0.2-3.5.
H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques
B32B 9/00 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
100.
CONDUCTIVE PASTE AND MULTILAYER SUBSTRATE USING SAME
The present invention provides: a conductive paste which has excellent thermal conductivity, electrical conductivity, fillability of a hole that is formed in a substrate, and long-term reliability; and a multilayer substrate which uses this conductive paste. This conductive paste contains, per 100 parts by mass of a liquid epoxy resin (A): 2,300 to 5,000 parts by mass of a metal filler (B) which contains two or more metal powders including at least one metal powder (B1) that comprises a high-melting-point metal which contains silver and/or copper, while having a melting point of 800°C or more, and at least one metal powder (B2) that comprises a low-melting-point metal which is composed of an alloy of two or more metals selected from the group consisting of tin, lead, bismuth and indium, while having a melting point of 180°C or less; 10 to 40 parts by mass of a curing agent (C) which contains a hydroxyl group-containing aromatic compound; and 60 to 230 parts by mass of a flux (D).
