Even in a case where a spray nozzle of a solid phase particle deposition device is in motion, flying solid phase particles are efficiently collected. An attachment (1) includes: an engagement part (2) to be engaged with a spray nozzle (130) of a cold spray device (1); and an opening part (3) connected to the engagement part (2) and having at least one opening (3a, 3b) to be connected to a collection section (20) that is configured to collect solid phase particles (30b) which are sprayed through the spray nozzle (130) onto a base material (170) and are not involved in formation of a film on the base material (170).
B05B 14/10 - Arrangements for collecting, re-using or eliminating excess spraying material the excess material being particulate
B05B 1/28 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of sprayNozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for catching drips or collecting surplus liquid or other fluent material
B05B 12/32 - Shielding elements, i.e. elements preventing overspray from reaching areas other than the object to be sprayed
C23C 24/04 - Impact or kinetic deposition of particles
A wiring member (1) according to the present invention comprises a knitted fabric that includes a fabric and an electric wire (3) that is inserted into the fabric and extends in a prescribed direction. The knitted fabric includes a non-insertion part formed by the electric wire (3) not being inserted into the fabric.
A61B 5/145 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value
D03D 15/60 - Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the warp or weft elements other than yarns or threads
The purpose of the present invention is to provide an electromagnetic wave shielding film in which a protective layer surface has a sufficiently high scratch resistance. An electromagnetic wave shielding film according to the present invention comprises: a protective layer having a first main surface and a second main surface opposite the first main surface; and a shield layer disposed on the second main surface side of the protective layer. The L* value of the first main surface is 29 or greater, and the fastest decay auto-correlation rate (Sal) of the first main surface is 3 μm or greater.
Provided is a heat-conducting electroconductive adhesive layer that exhibits excellent heat conductivity, electroconductivity, adhesion to an adherend, and electromagnetic wave-shielding performance. A heat-conducting electroconductive adhesive layer 1 contains a binder component 11 and a carbon fiber 12a. The binder component 11 contains a thermosetting-type resin. The carbon fiber 12a has metal supported on the surface thereof. The ratio of the diameter of the carbon fiber 12a to the thickness T of the heat-conducting electroconductive adhesive layer 1 is 0.2-0.5.
Provided is a bonding wire in which a coating layer having Au as a primary component is provided on the surface of a core material having Ag as a primary component, said bonding wire having good wire drawing processability, and being able to form an FAB that has a good shape with high sphericity. A bonding wire W according to the present invention has a core material 10 that includes Ag as a primary component, and a coating layer 12 that is provided on the surface of the core material 10 and includes Au as a primary component, wherein the core material 10 is a bonding wire in which the total included quantity of one or two elements selected from the group consisting of Au and Pd is 0.1 mass% to 3.0 mass%, the total included quantity of one or more elements selected from the group consisting of In, Bi, and Sn is 0.0005 mass% to 0.5 mass%, and the melting point difference ΔTtma obtained by subtracting the melting point Tm1 of the core material 10 from the melting point Tm2 of the coating layer 12 is 90°C to 105°C.
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/14 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
An electromagnetic wave shielding film comprising a shield layer and a protective layer layered on the shield layer, wherein the protective layer includes a first protective layer that is layered on the shield layer, a second protective layer that is layered on the first protective layer, and a third protective layer that is layered on the second protective layer, and the first protective layer and the third protective layer each have a higher elastic modulus than the second protective layer.
An electromagnetic wave shield film comprising a shield layer and a conductive adhesive layer laminated on the shield. The shield layer is a metal layer having a thickness of 6 μm or more. The conductive adhesive layer contains 30-55 mass% inclusive of conductive particles.
The purpose of the present invention is to provide an electromagnetic wave shielding film in which a crack is not generated in a protective layer even if the film is repeatedly bent, and shield performance is not susceptible to deterioration. This electromagnetic wave shielding film according to the present invention is obtained by sequentially laminating a protective layer, a shield layer, and an adhesive layer, and is characterized in that the ratio (hardness/Young's modulus) of the hardness to the Young's modulus of the protective layer as measured by a nanoindentation test conforming to ISO 14577 is 0.05-0.10.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
9.
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
The purpose of the present invention is to provide an electromagnetic wave shielding film in which a crack is not generated in a protective layer even if the film is repeatedly bent, and shield performance is not susceptible to deterioration. This electromagnetic wave shielding film according to the present invention is obtained by sequentially laminating a protective layer, a shield layer, and an adhesive layer, and is characterized in that the hardness of the protective layer as measured by a nanoindentation test conforming to ISO 14577 is 0.15-0.70 GPa.
Provided is an electromagnetic wave-absorbing thermally conductive sheet excellent in thermal conductivity and in characteristics of absorbing electromagnetic waves of a millimeter wave band. An electromagnetic wave-absorbing thermally conductive sheet 1 comprises: a binder component 11; and a powder 12. The electromagnetic wave-absorbing thermally conductive sheet 1 has a thermal conductivity of 3 W/mK or more in the thickness direction when the sheet is compressed so as to have a thickness of 80%, and a dielectric loss of 3000 dB/m or more at a frequency of 28 GHz. The powder 12 preferably contains a powder (A) 12a having a median diameter of more than 20 μm but not more than 130 μm and a powder (B) 12b having a median diameter of 1-20 μm.
Provided is a thermally conductive film having excellent thermal conductivity and excellent adhesion to an adherend. The thermally conductive film 1 comprises a binder component 11 and a thermally conductive filler 12. The D90 of the thermally conductive filler 12 is 30–120% of a thickness T of the thermally conductive film 1. The D90 of the thermally conductive filler 12 is preferably 1–200 μm. The thickness of the thermally conductive film 1 is preferably 10–1,000 μm. The binder component 11 preferably contains a thermosetting resin.
The present invention provides an electrically conductive adhesive layer having sufficiently high heat dissipation properties in the thickness direction while maintaining its electromagnetic wave shielding properties. The electrically conductive adhesive layer of the present invention includes a binder component and electrically conductive particles, wherein the electrically conductive particles include first particles and second particles having a smaller median diameter than the first particles, the second particles are flaky particles each including a core particle covered with a metal layer, and a percentage of a mass of the electrically conductive particles relative to a mass of the electrically conductive adhesive layer is 60 to 90 mass %.
Provided is an electromagnetic wave shielding film from which static electricity that has accumulated during production or transfer can be easily dissipated. An electromagnetic wave shielding film of the present invention includes a protective layer disposed outermost and a shielding layer stacked inward from the protective layer, wherein the protective layer has a surface resistivity of 1.0×105 to 2.0×1012Ω/□, and the protective layer contains a binder resin and carbon particles having an average particle size of 0.1 to 15 μm.
Provided is a thermally-conductive electrical conducting layer having excellent thermal conductivity in the thickness direction. A thermally-conductive electrical conducting layer (1) is a thermally-conductive electrical conducting layer containing a binder component (11) and electrical conducting particles (12). The electrical conducting particles (12) include electrical conducting particles A (12a) having a median diameter larger than a thickness (T) of the thermally-conductive electrical conducting layer (1) and having a thermal conductivity of 20 W/mK or more, and electrical conducting particles B (12b) having a median diameter smaller than the thickness (T) of the thermally-conductive electrical conducting layer (1). The resistivity of the thermally-conductive electrical conducting layer (1) is 2.0×10−5Ω·m or more.
This conductive composition contains (A) an epoxy resin, (B) a polyol, (C) a cationic polymerization initiator, and (D) conductive particles. (A-1) an alicyclic epoxy resin and (A-2) a rubber-modified epoxy resin are contained as the epoxy resin (A). A polyol that has a molecular weight of 200 or more is contained as the polyol (B).
The present invention addresses the problem of providing a liquid leak detecting line capable of suppressing erroneous detection while suppressing a significant decrease in liquid leak detection performance. In order to resolve the abovementioned problem, the present invention provides a liquid leak detecting line comprising a plurality of detecting lines each comprising a conductor and a braided body covering the conductor, wherein the plurality of detecting lines include a first detecting line and a second detecting line, the braided body is configured from an electrically insulating yarn, and an electrically conductive liquid is detected when the liquid electrically connects the conductor of the first detecting line and the conductor of the second detecting line through the braided bodies, and wherein the braided body of one or both of the first detecting line and the second detecting line comprises a first yarn and a second yarn intersecting the first yarn, and the second yarn is thinner than the first yarn.
G01M 3/16 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means
A conductive composition comprising an epoxy resin, a curing agent, and metal particles, wherein: a liquid epoxy resin and a solid epoxy resin are contained as the epoxy resin; high-melting-point metal particles that contain a metal having a melting point of not lower than 800°C and low-melting-point metal particles that contain a metal having a melting point of not higher than 240°C are contained as the metal particles; and, in the particle size distribution of the low-melting-point metal particles, D10 is 3-20 μm and D90 is 8-30 μm.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
The present invention relates to an electromagnetic wave shield film that can sufficiently exhibit a shielding effect even at high frequencies and that can be made to be thin, and to a shield printed wiring board including the same. An electromagnetic wave shield film according to the present invention has a shield layer containing a binder component and first conductive particles and satisfies T/δ ≥ 45/Rs, T ≤ 30, and T/δ ≥ 1 (in the formulas, T represents the thickness [μm] of the shield layer, Rs represents the sheet resistance value [mΩ/sq.] of the shield layer, and δ represents the skin depth [μm] of the shield layer at 10 GHz).
This electroconductive composition is characterized by comprising an epoxy resin, an imidazole-based curing agent containing no triazine ring, a benzoxazine resin, and electroconductive particles, wherein the epoxy resin contains an alicyclic epoxy resin.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
This conductive composition contains 2-8 parts by mass of flux relative to 100 parts by mass of metal particles. The metal particles (100 parts by mass) contain 42-50 parts by mass of metal particles (A) that are composed of SnBi alloy particles and Sn particles, and 25-58 parts by mass of metal particle (B) that are at least one kind of particles selected from the group consisting of copper particles, silver particles, and silver-coated copper particles, and contain at least copper and silver. The 10% cumulative value of the particle diameters of the SnBi alloy particles is 4-15 μm, and the 90% cumulative value of the particle diameters of the SnBi alloy particles is 8-25 μm. The 10% cumulative value of the particle diameters of the Sn particles is 7-30 μm, and the 90% cumulative value of the particle diameters of the Sn particles is 15-50 μm.
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
2 or less, and the percentage of the number (cumulative frequency) of the first openings among the openings is 30 to 90%, and the percentage of the number (cumulative frequency) of the second openings among the openings is 10 to 70%.
Provided is an electromagnetic wave shielding film capable of blocking or allowing passage of only an electromagnetic wave with a specific frequency. An electromagnetic wave shielding film, including: a metamaterial layer including a first main surface and a second main surface opposite to the first main surface; and an adhesive layer formed on the second main surface of the metamaterial layer, wherein when the metamaterial layer is viewed in a plan view from at least one of the first main surface or the second main surface, the metamaterial layer includes a conductive region where predetermined patterns made of a conductive material are periodically arranged, and a non-conductive region other than the conductive region.
Provided is an electromagnetic wave shield film that is not susceptible to swelling of an electroconductive adhesive layer due to heating and has sufficiently high solder float resistance. An electromagnetic wave shield film according to the present invention is obtained by sequentially layering a protective layer, a metal layer, and an electroconductive adhesive layer, wherein the electromagnetic wave shield film is characterized in that the electroconductive adhesive layer contains an epoxy resin having a weight-average molecular weight Mw of 50,000 or higher, a carboxy-group-containing curing agent, a nitrogen-containing organic filler, a phosphorus-containing liquid flame retardant, and an electroconductive filler.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
A coaxial cable (100a) comprises a first conductor part (1) and a second conductor part (2). The first conductor part (1) has an internal space (V). The first conductor part (1) extends along a central axis (A). The first conductor part (1) includes a first conductor section (11) and a first insulating section (12). The first insulating section (12) covers a surface (11s) of the first conductor section (11). A first through-hole (H1) is formed in the second conductor part (2), in a side surface (20s) surrounding the central axis (A). The first conductor part (1) is inserted into the internal space (V) via the first through-hole (H1).
A connection member (20) can be attached to a cable end on the output side of a flat cable having at least three-layer flat band-shaped cable conductors spaced apart from each other. The connection member (20) can be connected between the flat cable and a power reception device capable of receiving power supplied from the flat cable. The connection member (20) is provided with: at least three-layer flat band-shaped conductors (21, 23) disposed spaced apart from each other in the thickness direction; and a portion in which at least the three-layer flat band-shaped conductors (21, 23) are formed into two layers.
H01R 11/11 - End pieces or tapping pieces for wires or cables, supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member
H02G 1/14 - Methods or apparatus specially adapted for installing, maintaining, repairing, or dismantling electric cables or lines for joining or terminating cables
A flat cable (10) is provided with at least three layers of flat cable conductors spaced apart from each other. The at least three layers of flat cable conductors include an inner cable conductor (11), one outer cable conductor (13B), and the other outer cable conductor (13A). The other outer cable conductor (13A) is on the opposite side to the one outer cable conductor (13B) in the thickness direction. The inner cable conductor (11) is disposed so as to be sandwiched between the one outer cable conductor (13B) and the other outer cable conductor (13A) in the thickness direction. At least one of the one outer cable conductor (13B), the other outer cable conductor (13A), and the inner cable conductor (11) has a lower DC conductor resistance in a cable end portion than in the regions other than the cable end portion.
H01B 7/30 - Insulated conductors or cables characterised by their form with arrangements for reducing conductor losses when carrying AC, e.g. due to skin effect
A flat cable (10) comprises at least three layers of flat strip-shaped cable conductors (11, 13A, 13B) spaced apart from each other. The cable ends of each of the at least three layers of flat strip-shaped cable conductors (11, 13A, 13B) are fixed in a state of being separated from each other at an interval (P) that is equal to or greater than the width (W) of the cable ends.
H01B 7/30 - Insulated conductors or cables characterised by their form with arrangements for reducing conductor losses when carrying AC, e.g. due to skin effect
28.
METHOD FOR PRODUCING HIGHLY CONDUCTIVE COMPOSITION AFTER DRYING AND FIRING
A conductive composition according to the present invention comprises: (A) 1.005-1.74 mass% of a bisphenol-type epoxy resin; (B) not less than 0.015 mass% but less than 0.08 mass% of a (meth)acrylic resin that has a weight-average molecular weight of 1000-400,000; (C) 0.5-0.86 mass% of polymer particles that contain a polybutadiene rubber; (D) 5-95 mass% of copper particles that have an average particle diameter of 2-500 nm; (E) 0.9-4.8 mass% of silver particles that have an average particle diameter of 2-500 nm; (F) 0.001-20 mass% of a phosphorus-containing compound; (G) 0.0001-10 mass% of CuH; and (H) 0.1-90 mass% of a solvent.
C08L 51/04 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to rubbers
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 1/09 - Use of materials for the metallic pattern
29.
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD
This thermosetting resin composition contains (A) a cyanate ester compound, (B) a phenolic resin, (C) another curable resin as an optional component, (D) a metal catalyst, and (E) another curing catalyst as an optional component. If the total amount of the component (A), the component (B), and the component (C) is taken as 100 parts by mass, the amount of the component (A) is 80-99 parts by mass, the amount of the component (B) is 1-15 parts by mass, and the amount of the component (C) is 0-10 parts by mass. The amount of the component (E) is 1 part by mass or less relative to a total of 100 parts by mass of the component (A), the component (B), and the component (C).
C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 61/00 - Compositions of condensation polymers of aldehydes or ketonesCompositions of derivatives of such polymers
A shielded printed wiring board with electromagnetic wave shielding film on both sides thereof is produced by placing electromagnetic wave shielding films on the two sides of the printed wiring board, with ends thereof protruding past an end of the printed wiring board. The protruding ends of the electromagnetic wave shielding films are brought together, with an air gap therebetween, and an initial application of heat and pressure causes the ends of the electromagnetic wave shielding film to adhere to each other, but without completely curing adhesive resin components of the electromagnetic wave shielding films. Protective film layers are removed from the electromagnetic wave shielding films, followed by subsequent application of heat and pressure to complete cure of the adhesive resin and to remove the air gap.
An electromagnetic wave shielding film includes an electroconductive adhesive layer having high peel strength and high connection reliability and suppresses cracks in an insulating layer on the electroconductive adhesive layer. The electromagnetic wave shielding film includes an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition and an insulating layer on the electroconductive adhesive layer. The electroconductive particles include high melting point electroconductive particles and low melting point electroconductive particles having a lower melting point than the high melting point electroconductive particles, and the high melting point electroconductive particles include high melting point flaky particles and high melting point spherical particles, and the content of the high melting point flaky particles is 60 to 80% by weight of the total content of the high melting point flaky particles, the high melting point spherical particles, and the low melting point electroconductive particles.
A thermally conductive composition having excellent thermal conductivity, processability, and long-term reliability is provided. A thermally conductive composition contains: 100 parts by mass of an epoxy resin containing 1 to 30 parts by mass of a dimer acid epoxy resin and 1 to 40 parts by mass of a liquid epoxy resin (excluding dimer acid epoxy resins); and 700 to 1700 parts by mass of a conductive filler, in which the conductive filler contains a conductive filler (A) having an average particle size (D50) measured by a laser diffraction scattering particle size distribution measurement method of 5 to 20 μm and a conductive filler (B) having an average particle size (D50) of 1 to 8 μm, a rate ((A)/(B)) of the average particle size of the conductive filler (A) and the average particle size of the conductive filler (B) is 1.5 or more, and a content rate ((A)/(B)) of the conductive filler (A) and the conductive filler (B) by mass rate is 1.0 to 50.0.
An electromagnetic wave shielding film with high bending resistance includes a protecting layer, a metal layer, and an adhesive layer stacked in this order. A ratio of Repulsion Y to Repulsion X ([Repulsion Y]/[Repulsion X]) is 0.77 or higher, where Repulsion X denotes a repulsion of a stack including the protecting layer and the metal layer measured in a defined test for measuring repulsion of stacks, and Repulsion Y denotes a repulsion of the adhesive layer measured in a defined test for measuring repulsion of adhesive layers.
Provided is a laminate in which a protective layer is evenly laminated on a separator, and the separator does not have a too high peel strength after thermal press bonding. This laminate comprises: a separator which comprises a substrate and a silicone resin film formed on a surface of the substrate and serving as a release surface; and a protective layer laminated on the separator so as to be in contact with the release surface. The laminate is characterized in that the release surface has a water contact angle of 107.1° or greater, and that the protective layer includes at least one resin selected from the group consisting of polyurethane resins, polyamide-imide resins, and polyamide resins.
The film deposition apparatus used in a thermal spraying method includes a spray gun which includes a nozzle, a powder supply unit that supplies a powder to the spray gun as a film deposition raw material, and a gas supply unit that supplies a working gas to the spray gun. The nozzle includes a stainless pipe as a nozzle pipe, a ceramic pipe connected to an upstream portion of the stainless pipe through which the working gas flows, and a nozzle holder into which the ceramic pipe is inserted. The nozzle holder includes a first portion extending in a first direction in which the working gas flows through the nozzle holder. The film deposition apparatus further includes a pipe which connects the powder supply unit and the first portion. A portion of the pipe, which is connected to the first portion, extends in a second direction intersecting the first direction.
B05B 7/04 - Spray pistolsApparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
B05B 7/00 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
B05B 7/14 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
A powder supply system (200) comprises: a hopper (3a); a powder replenishing machine (21); a pressure adjustment mechanism (22); and an opening/closing valve (23). The hopper (3a) stores powder to be supplied to a film-forming device. The powder replenishing machine (21) is connected to the hopper (3a), and replenishes the hopper (3a) with the powder while maintaining a constant pressure difference with respect to the inside of the hopper (3a). The pressure adjustment mechanism (22) can adjust pressure inside the hopper (3a) and pressure inside the powder replenishing machine (21) so that the pressure inside the hopper (3a) and the pressure inside the powder replenishing machine (21) become constant. The opening/closing valve (23) is installed at a part that connects the inside of the hopper (3a) and the inside of the powder replenishing machine (21).
B05C 19/06 - Storage, supply or control of the application of particulate materialRecovery of excess particulate material
C23C 4/12 - Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
B22F 1/105 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
C23C 24/00 - Coating starting from inorganic powder
38.
TRANSFER FILM, ELECTROMAGNETIC WAVE SHIELD FILM PROVIDED WITH TRANSFER FILM, AND SHIELD PRINTED WIRING BOARD
Provided is a transfer film having a main surface on which an uneven shape is formed, the transfer film making it possible to sufficiently reduce the glossiness of an object onto which the uneven shape is to be transferred, and having sufficiently high releasability. This transfer film is characterized by comprising a first main surface on which an uneven shape is formed, the first main surface having a protruding peak height Spk of 1.2 μm or less.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
A movable shaft (10) is provided with a cylindrical base layer (12) extending along the axial direction of the movable shaft, a surface layer (13), and a braid (14). The surface layer is disposed on an outer peripheral surface (12b) of the base layer with the braid interposed therebetween. The constituent material of the base layer is of the same kind as the constituent material of the surface layer. Durometer hardness of the base layer is higher than durometer hardness of the surface layer. The braid is formed by knitting a wire (14a) so as to have an opening (14b). At least a part of the surface layer is in contact with the outer peripheral surface via the opening.
The present invention provides a heat dissipation sheet laminate which is not susceptible to the occurrence of breakage during the pick-up of a heat dissipation sheet, and which is excellent in terms of bonding workability. This heat dissipation sheet laminate 1 sequentially comprises an embossed film 5, a heat dissipation sheet 4, a release film 3 and an adhesive sheet 2 in this order. The release film 3 can be separated from the adhesive sheet 2 and the heat dissipation sheet 4. A plurality of individualized pieces of the release film 3 are arranged on the adhesive sheet 2. A plurality of individualized pieces of the heat dissipation sheet 4 are respectively arranged on the individualized pieces of the release film 3. The release film 3 partially has a non-lamination region 31 on which the heat dissipation sheet 4 is not superposed. The adhesive sheet 2 is half-cut together with the release film 3.
The present invention provides an electromagnetic shielding film demonstrating excellent bending resistance over a long period of time. This electromagnetic shielding film includes a protective layer, a conductive adhesive layer, and a metal vapor-deposited layer provided between the protective layer and the conductive adhesive layer, the electromagnetic shielding film being characterized by having a tensile elastic modulus of 2.1 GPa to 4.0 GPa and an elongation at break of less than 3.0%.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
Provided is a laminate having a sufficiently high peelability of an adhesive layer and low manufacturing cost. A laminate according to the present invention is characterized by comprising: a protective layer having a first main surface that is not subjected to release treatment; and an adhesive layer that contains an adhesive component and a filler and is laminated so as to be in contact with the first main surface, wherein the filler has a bulk density of 7-23 mL/g, and when the weight of the adhesive component included in the adhesive layer is 100 parts by weight, the adhesive layer contains 2-75 parts by weight of the filler.
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
This electroconductive composition contains an epoxy compound, an imidazole compound, a phenolic curing agent, and electroconductive particles. In the epoxy compound, the content ratio of a naphthalene skeleton-containing epoxy resin is 10-30 mass%, the content ratio of a glycidyl amine-based epoxy resin is 40-90 mass%, and the content ratio of a reactive diluent, which has 1-2 glycidyl ether functional groups in an aliphatic hydrocarbon chain, is 10 mass% or less. The imidazole compound contains at least one compound selected from the group consisting of 2-undecylimidazole, 2-heptadecylimidazole, 4-methyl-2-phenylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole. Relative to 100 parts by mass of the epoxy compound, the content of the imidazole compound is 3-10 parts by mass and the content of the phenolic curing agent is 10-20 parts by mass. The content of the electroconductive particles is 82-90 mass% of the electroconductive composition.
Provided is an electromagnetic wave shielding film in which swelling is unlikely to occur between a ground circuit and an adhesive layer, even when a shielded printed wiring board, in which the adhesive layer of the electromagnetic wave shielding film and the ground circuit of the printed wiring board have been brought into contact, has been used for a long period of time in a high temperature, high humidity environment. The electromagnetic wave shielding film according to the present invention comprises an adhesive layer and a first protective layer disposed on the adhesive layer, and is characterized in that: the first protective layer contains a urethane-based resin having an acid value of 2000-4000 g/eq, and silica particles: and the adhesive layer contains a urethane-based resin having an acid value of 2000-4000 g/eq, an imidazole-based compound, and a phosphorus-containing flame retardant.
Provided is a bonding wire provided with a covering layer employing Au as a principal component on a surface of a core material employing Ag as a principal component, the bonding wire being capable of forming an FAB having a good shape with high sphericity. A bonding wire W according to the present invention has a core material 10 that contains Ag as a principal component and a covering layer 12 that is provided on a surface of the core material 10 and that contains Au as a principal component, wherein: the core material 10 contains one or more types of materials selected from the group consisting of Au, Pd, and In; the ratio of the film thickness of the covering layer 12 with respect to the diameter of the core material 10 is 0.0014 to 0.0048; and the ratio of the specific resistance of the core material 10 with respect to the specific resistance of the covering layer 12 is 85% to 115%.
A mask jig, by which a film having stable quality can be efficiently formed on a surface of a substrate, includes a main body portion and a mask cover. The main body portion includes a first surface and a second surface located opposite to the first surface. The mask cover is disposed on the second surface side of the main body portion so as to overlap with the main body portion, and includes a third surface and a fourth surface located opposite to the third surface. The mask cover is composed of an imide-based resin.
An electromagnetic wave shielding film includes: a protective layer; a shield layer laminated on the protective layer; and an adhesive layer laminated on the shield layer. Conductive bumps are formed on a side of the adhesive layer of the shield layer. The conductive bumps are positioned on a tessellation of one kind of polygon at vertices of respective polygons, and the conductive bumps are arranged such that, with respect to each of the conductive bumps, when drawing line segments connecting respective conductive bumps and nearest conductive bumps at a nearest position and drawing a straight line passing through one line segment among the drawn line segments, the straight line has a portion that does not overlap with the other line segments.
An object of the present disclosure is to provide a conductive adhesive layer in which the connection stability between objects that are conductive members is excellent, and the connection stability is maintained even when the conductive adhesive layer is subjected to high temperature. The conductive adhesive layer is a conductive adhesive layer including a binder component and conductive particles, wherein the conductive particles include conductive particles A having a median diameter of 100% or more of a thickness of the conductive adhesive layer, and conductive particles B having a median diameter of 1 to 50% of the median diameter of the conductive particles A, a content of the conductive particles is 110 to 900 parts by mass based on 100 parts by mass of the binder component, and a mass ratio of the conductive particles A to the conductive particles B is 0.1 to 7.2.
The present invention provides: an electromagnetic wave-shielding film in which the interlayer adhesion between an adhesive layer and a shield layer is unlikely to be destroyed even if the film is heated through reflow or the like; and a manufacturing method for the electromagnetic wave-shielding film. The present invention pertains to an electromagnetic wave-shielding film comprising a conductive adhesive layer, and a shield layer laminated on the conductive adhesive layer, the film being characterized in that the conductive adhesive layer contains at most 50 wt% of a conductive filler, and the specific surface area of the conductive filler is at most 0.9 m2/g.
An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A1) including one or more island-shaped metal layer fragments. Each opening (A1) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).
Provided is a conductive adhesive sheet that has excellent connection stability even containing conductive particles in a small proportion. The inventive conductive adhesive sheet contains a binder component and conductive particles. The conductive particles are distributively arranged. Assume that all the conductive particles are regularly arranged; and that an optional region of the conductive adhesive sheet is viewed in plan view so that a distribution number Np of the distributed conductive particles be 9 to 25, a condition: 1.5X≤Y≤100X is met, where X represents the average of equivalent circle diameters of the distributed conductive particles; and Y represents the center-to-center distance between adjacent two of the distributed conductive particles, which are regularly arranged in the plan view. The ratio N/Np is 1.0 to 100.0, where N represents the number of the primary particles in the optional region. When optional three unique regions including the optional region are viewed in plan view so that the distribution number Np in each region be 9 to 25, the ratio Ng/Np is 0.8 to 1.0, where Ng represents the distribution number of conductive particles present in two or more of the three regions.
An electromagnetic wave shielding film includes: a protective layer; a shield layer laminated on the protective layer; and an adhesive layer laminated on the shield layer, a plurality of conductive bumps formed on a side of the adhesive layer of the shield layer, in a plan view of the shield layer from the side of the adhesive layer, the conductive bumps being positioned on a tessellation of two or more kinds of polygons at vertices thereof, with the conductive bumps being arranged such that, with respect to each of them, when drawing line segments connecting the respective conductive bumps and nearest conductive bumps at a nearest position and drawing a straight line passing through one drawn line segment, the straight line has a portion that does not overlap with the other line segments.
Provided are a masking jig, a film formation method, and a film formation device that enable efficient formation of a film with consistent quality on the surface of a substrate. A masking jig is used in a thermal spraying method, and includes a body portion. The body portion includes a first surface and a second surface. The second surface is located on a side opposite to the first surface. The body portion has a through hole formed therethrough extending from the first surface to the second surface. The second surface includes inclined surfaces having inclination angles θ1 and θ2 of larger than or equal to 30° and smaller than 90° with respect to the first surface. An open end of the through hole in the second surface is formed in the inclined surfaces.
B05B 7/14 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
B05B 12/20 - Masking elements, i.e. elements defining uncoated areas on an object to be coated
It is an object of the present invention to provide a thermally conductive sheet that is excellent in thermally conductive property, has insulation property, has a low permittivity, and is excellent in designability. The thermally conductive sheet 1 comprises a binder component 11, titanium oxide, titanium nitride, and a thermally conductive filler 12 other than these, and a ratio of the titanium oxide to the total of the titanium oxide and the titanium nitride is 20 to 90% by mass. An L* value of a surface of the thermally conductive sheet 1 in the L*a*b* color system is preferably 41 or less. The total content of the titanium oxide and the titanium nitride is preferably 0.3 to 10.0 parts by mass based on the total amount 100 parts by mass of the thermally conductive filler 12.
The present invention provides an electromagnetic shielding film in which the interlayer adhesion between an adhesive layer and a metal foil is unlikely to be destroyed even if the film is heated with reflow etc. The present invention relates to an electromagnetic wave shielding film characterized in that: the electromagnetic wave shielding film contains an adhesive layer including a resin, and a metal foil laminated on the adhesive layer; the moisture-vapor transmission of the metal foil is 0.40 g/(m2·day) or more; and the moisture content of the adhesive layer is 1.00% by weight of less.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
The present invention provides an electroconductive adhesive layer which is capable of exhibiting sufficient adhesion strength to various adherends even if compression bonding is performed at low temperatures for a short period of time. This electroconductive adhesive layer (1) contains a binder component (11) and metal particles A (12a) that have a melting point of 170°C or less; and the metal particles A (12a) protrude from the surface. It is preferable that this electroconductive adhesive layer (1) additionally contains metal particles B (12b) which can be alloyed with the metal particles A (12a); and it is also preferable that this electroconductive adhesive layer (1) additionally contains solder particles C (12c). In addition, it is preferable that the metal particles A (12a) are spherical.
09 - Scientific and electric apparatus and instruments
Goods & Services
Power distribution or control machines and apparatus; rotary
converters; phase modifiers; electrical connectors; electric
cable adapters; electrical adapters; electrical sockets,
plugs and electric connections; connections, electric;
electrical terminals; electric wires and cables; flexible
flat cables, electric; wire connectors [electricity]; cable
connectors; splices for electrical transmission lines;
electric cable connectors; connections for electric lines.
Provided is a double-sided pressure-sensitive adhesive sheet which exhibits repairability when bonded to an adherend and with which adhesive strength after bonding can be intentionally improved by carrying out a heat treatment or a pressing treatment. A double-sided pressure-sensitive adhesive sheet 3 has a pressure-sensitive adhesive layer 2 on both surfaces of a base material 1. The pressure-sensitive adhesive layer 2 contains a binder component, a metal oxide and a black pigment. If the total amount of the binder component, the metal oxide and the black pigment is taken to be 100 mass%, the mass ratio of the metal oxide and the black pigment is 36.5:0.4 to 37.5:0.1. In addition, it is preferable for the metal oxide to be titanium oxide, for a release film to be layered on at least one of the pressure-sensitive adhesive layers 2, and for the L* value, as measured from the release film side, to be 40-75.
An electroconductive composition comprising: 100 parts by mass of a binder component comprising 40-70 parts by mass of a solid bisphenol type epoxy resin and 30-60 parts by mass of one or more liquid epoxy resins including at least one resin selected from the group consisting of alicyclic epoxy resins and rubber-modified epoxy resins; 1,400-2,500 parts by mass of electroconductive particles (B); 60-120 parts by mass of a blocked isocyanate hardener (C); and a solvent (D).
This conductive coating contains, with respect to 100 parts by mass of a binder component (A) containing an epoxy resin: 1200-3200 parts by mass of metal particles (B); 70-200 parts by mass of a block isocyanate curing agent (C); 5-50 parts by mass of a curing agent (D) that is at least one selected from the group consisting of an amine-based curing agent and an imidazole-based curing agent; and 100-1,500 parts by mass of a solvent (E).
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
This conductive paste contains, with respect to (A) 100 parts by mass of a binder component containing 5-60 parts by mass of a solid epoxy resin and 40-95 parts by mass of a liquid epoxy resin in a range not exceeding a total amount of 100 parts by mass: (B) 770-4300 parts by mass of spherical high-melting-point metal particles having a melting point of at least 800°C; (C) 1510-5400 parts by mass of spherical low-melting-point metal particles having a melting point of at most 240°C; (D) 10-150 parts by mass of a curing agent; and (E) 30-200 parts by mass of a flux.
Metalworking machines and tools; metal surface treatment
machines and tools; spray coating machines and apparatus;
spray guns for coating and parts and fittings therefor;
spray nozzles for coating machines and apparatus; powder
coating spray guns and parts and fittings therefor; plastic
surface treatment machines and apparatus; semiconductor
manufacturing machines; surface treatment machines for
semiconductor wafers and integrated circuits; surface
treatment machines for the use in manufacturing
semiconductors; thin film deposition equipment for
semiconductors, metal, insulators, plastics, ceramics and
glass; ceramic surface treatment machines and apparatus;
parts and fittings for industrial surface treatment
equipment for metal, plastics, ceramics and glass; parts and
fittings for industrial surface treatment apparatus for the
use in modifying the surface of metal, plastics, ceramics
and glass; parts and fittings for thick film disposition
apparatus for the surface of metal, plastics, ceramics and
glass; parts and fittings for cold spray equipment, namely,
nozzles, nozzle tips, nozzle holders, nozzle connectors for
the use in industrial surface treatment for metal, plastics,
ceramics and glass.
63.
MASKING JIG, FILM FORMATION METHOD, AND FILM FORMATION DEVICE
A masking jig (1) is used in thermal spraying. The masking jig (1) comprises a body part (11). The body part (11) includes a first surface (11a) and a second surface (11b). The second surface (11b) is positioned on the reverse side from the first surface (11a). A through hole (12) is formed in the body part (11) reaching from the first surface (11a) to the second surface (11b). In the through hole (12), a first through hole (12a) formed so as to open the first surface (11a), and a second through hole (12b) formed so as to open the second surface (11b) run together. A second width (X2), which is the width in a direction along the first surface (11a) of the second through hole (12b), is greater than a first width (X1), which is the width in a direction along the first surface (11a) of the first through hole (12a). The body part (11) is formed by an imide resin.
C23C 24/04 - Impact or kinetic deposition of particles
B05B 7/16 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating the material to be sprayed
B05B 12/20 - Masking elements, i.e. elements defining uncoated areas on an object to be coated
C23C 4/02 - Pretreatment of the material to be coated, e.g. for coating on selected surface areas
Metalworking machines and tools; metal surface treatment
machines and tools; spray coating machines and apparatus;
spray guns for coating and parts and fittings therefor;
spray nozzles for coating machines and apparatus; powder
coating spray guns and parts and fittings therefor; plastic
surface treatment machines and apparatus; semiconductor
manufacturing machines; surface treatment machines for
semiconductor wafers and integrated circuits; surface
treatment machines for the use in manufacturing
semiconductors; thin film deposition equipment for
semiconductors, metal, insulators, plastics, ceramics and
glass; ceramic surface treatment machines and apparatus;
parts and fittings for industrial surface treatment
equipment for metal, plastics, ceramics and glass; parts and
fittings for industrial surface treatment apparatus for the
use in modifying the surface of metal, plastics, ceramics
and glass; parts and fittings for thick film disposition
apparatus for the surface of metal, plastics, ceramics and
glass; parts and fittings for cold spray equipment, namely,
nozzles, nozzle tips, nozzle holders, nozzle connectors for
the use in industrial surface treatment for metal, plastics,
ceramics and glass.
65.
ELECTROCONDUCTIVE ADHESIVE AND ELECTROMAGNETIC SHIELD FILM
Provided is an electroconductive adhesive which has both a high creep resistance at high temperatures and high adhesivity. This electroconductive adhesive is a sheet-type electroconductive adhesive comprising: electroconductive particles; a resin composition; a first main surface; and a second main surface opposing the first main surface. The conductive adhesive is characterized in that: the storage elastic modulus thereof at 65°C is 1.6×104Pa or more; and the arithmetic roughness Ra of the first main surface is 4 μm or less.
09 - Scientific and electric apparatus and instruments
Goods & Services
Electric power distribution apparatus; rotary converters; phase modifiers; electrical connectors; electric cable adapters; electrical adapters; electrical sockets, plugs and electric connections; connections, electric; electrical terminal boxes; electric wires and cables; flexible flat cables, electric; wire connectors for electricity; cable connectors; splices for electrical transmission lines; electric cable connectors; connections for electric lines
This coil (100A) comprises an electric wire (1) that is wound around a center axis (2) once or multiple times in a spiral manner. The electric wire (1) includes a conductor (10) having a long narrow cross-sectional shape (11) in a plane that includes the center axis (2). The cross-sectional shape (11) is curved so that a first end (12) and a second end (13) in the longitudinal direction are spaced away from the center axis (2). Consequently, loss is reduced in the coil comprising the electric wire that is wound once or multiple times in a spiral manner.
This masking jig (1) is used in a thermal spraying method. The masking jig (1) is provided with a body part (11). The body part (11) includes a first surface (11a) and a second surface (11b). The second surface (11b) is positioned on the reverse side from the first surface (11a). A body through hole (12) is formed in the body part (11) reaching from the first surface (11a) to the second surface (11b). The masking jig (1) is further provided with a mounting member (14) that can be mounted in/detached from the body through hole (12). A member through hole (15) penetrating in a first direction linking the first surface (11a) and the second surface (11b) when the mounting member (14) is inserted into the body through hole (12) is formed in the mounting member (14). The mounting member (14) is formed from an imide-based resin.
C23C 24/04 - Impact or kinetic deposition of particles
B05B 12/24 - Masking elements, i.e. elements defining uncoated areas on an object to be coated made at least partly of flexible material, e.g. sheets of paper or fabric
Provided is a flexible heat dissipating sheet having excellent electromagnetic shielding properties and heat dissipating properties. This heat dissipating sheet 1 includes an electrically conductive adhesive layer 2, and heat dissipating films 3, 4 respectively formed on opposite sides of the electrically conductive adhesive layer 2, wherein the electrically conductive adhesive layer 2 contains an electrically conductive filler and a binder component, and the heat dissipating films 3, 4 contains a thermally conductive filler and a binder component. The size of an uneven shape formed between the heat dissipating film 3 and at least one surface of the electrically conductive adhesive layer 2 is preferably 1-50 μm. A dendrite-shaped and/or flake-shaped material is preferably included as the electrically conductive filler.
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/373 - Cooling facilitated by selection of materials for the device
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
09 - Scientific and electric apparatus and instruments
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Electronic control apparatus for machines; apparatus for
processing electronic payments; electronic communication
apparatus; electronic control apparatus; heat dissipation
sheets being structural parts or components of electronic
control apparatus for machines; heat dissipation sheets
being structural parts or components of apparatus for
processing electronic payments; heat dissipation sheets
being structural parts or components of electronic
communication apparatus; heat dissipation sheets being
structural parts or components of electronic control
apparatus; computers; computer peripheral devices; heat
dissipation sheets being structural parts or components of
computers; heat dissipation sheets being structural parts or
components of computer peripheral devices; semi-conductor
elements; heat dissipation sheets being structural parts or
components of semi-conductor elements; electronic circuits;
heat dissipation sheets being structural parts or components
of electronic circuits; integrated circuits; heat
dissipation sheets being structural parts or components of
integrated circuits; chips [integrated circuits]; heat
dissipation sheets being structural parts or components of
chips [integrated circuits]; printed circuit boards; heat
dissipation sheets being structural parts or components of
printed circuit boards; laboratory apparatus and
instruments; heat dissipation sheets being structural parts
or components of laboratory apparatus and instruments;
photographic machines and instruments; cinematographic
machines and apparatus; optical machines and apparatus; heat
dissipation sheets being structural parts or components of
photographic machines and instruments; heat dissipation
sheets being structural parts or components of
cinematographic machines and apparatus; heat dissipation
sheets being structural parts or components of optical
machines and apparatus; measuring or testing machines and
instruments; heat dissipation sheets being structural parts
or components of measuring or testing machines and
instruments; power distribution or control machines and
apparatus; phase modifiers; heat dissipation sheets being
structural parts or components of power distribution or
control machines and apparatus; heat dissipation sheets
being structural parts or components of phase modifiers;
personal digital assistants; heat dissipation sheets being
structural parts or components of personal digital
assistants; electronic circuits and CD-ROMs recorded with
programs for hand-held games with liquid crystal displays;
heat dissipation sheets being structural parts or components
of electronic circuits and CD-ROMs recorded with programs
for hand-held games with liquid crystal displays; game
programs for arcade video game machines; heat dissipation
sheets being structural parts or components of game programs
for arcade video game machines; solar batteries; batteries
and cells; heat dissipation sheets being structural parts or
components of solar batteries; heat dissipation sheets being
structural parts or components of batteries and cells;
consumer video game programs; heat dissipation sheets being
structural parts or components of consumer video game
programs; telecommunication machines and apparatus; heat
dissipation sheets being structural parts or components of
telecommunication machines and apparatus. Electrical insulating materials; thermal insulating
materials, not for buildings; silicone rubber; thermal
conductive silicone gels being silicone semi-worked
products; plastic sheets for heat dissipation purposes for
use in manufacture; plastic sheets for cooling purposes for
use in manufacture; semi-processed silicones being thermally
conductive insulators in sheet form; thermally conductive
insulators made of silicone, in sheet form; silicone
semi-worked products for thermal conductive sheets; thermal
conductive artificial resin in sheet form; thermal
conductive polymer resin in sheet form.
Provided is an electromagnetic shielding film having both sufficiently high concealment characteristics and anti-scratch characteristics for a surface of a protective layer. This electromagnetic shielding film comprises a protective layer having a first main surface and a second main surface opposing the first main surface, and a shield layer disposed on the second main surface of the protective layer, the electromagnetic shielding film being characterized in that the developed surface area ratio Sdr of the interface of the first main surface is 75.0-250%.
Provided is a biological electrode including a polarizable electrode layer; and a non-polarizable electrode layer layered on the polarizable electrode layer. The non-polarizable electrode layer includes a first silver layer layered on the polarizable electrode layer; a polymer layer layered on the first silver layer; and a second silver layer layered on the polymer layer, and at least the second silver layer includes silver chloride.
Metalworking machines and machine tools; metal surface treatment machines and machine tools; spray coating machines and apparatus; spray guns for coating and parts and fittings therefor; machine parts, namely, spray nozzles for coating machines and apparatus; powder coating spray guns and parts and fittings therefor; plastic surface treatment machines and apparatus; thin film deposition equipment for metal, insulators, plastic, ceramics and glass, namely, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns; ceramic surface treatment machines and apparatus; parts and fittings for industrial surface treatment equipment in the nature of nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns for metal, plastics, ceramics and glass; parts and fittings for industrial surface treatment machines for the use in modifying the surface of metal, plastics, ceramics and glass; parts and fittings for thick film disposition machines for the surface of metal, plastics, ceramics and glass; parts and fittings for cold spray equipment in the nature of power-operated sprayers, pneumatic blow guns and powder coating spray guns, namely, nozzles, nozzle tips, nozzle holders, nozzle connectors for the use in industrial surface treatment for metal, plastics, ceramics and glass
Metalworking machines and machine tools; metal surface treatment machines and machine tools; spray coating machines and apparatus; spray guns for coating and parts and fittings therefor; machine parts, namely, spray nozzles for coating machines and apparatus; powder coating spray guns and parts and fittings therefor; plastic surface treatment machines and apparatus; thin film deposition equipment for metal, insulators, plastic, ceramics and glass, namely, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns; ceramic surface treatment machines and apparatus; parts and fittings for industrial surface treatment equipment in the nature of nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for power-operated sprayers, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for pneumatic blow guns, nozzles, nozzle tips, nozzle holders and nozzle connectors as parts for powder coating spray guns for metal, plastics, ceramics and glass; parts and fittings for industrial surface treatment machines for the use in modifying the surface of metal, plastics, ceramics and glass; parts and fittings for thick film disposition machines for the surface of metal, plastics, ceramics and glass; parts and fittings for cold spray equipment in the nature of power-operated sprayers, pneumatic blow guns and powder coating spray guns, namely, nozzles, nozzle tips, nozzle holders, nozzle connectors for the use in industrial surface treatment for metal, plastics, ceramics and glass
75.
Shield printed wiring board with ground member and ground member
A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided. A shielded printed wiring board with a ground member of the present invention is a shielded printed wiring board with a ground member, including: a substrate film formed by sequentially stacking a base film, a printed circuit including a ground circuit, and an insulating film; a shielding film including a shielding layer and a protective layer laminated on the shielding layer, the shielding film covering the substrate film such that the shielding layer is closer to the substrate film than the protective layer is; and a ground member arranged on the protective layer of the shielding film, the ground member including an external connection member having a first main surface and a second main surface opposite to the first main surface, and having electroconductivity, electroconductive particles disposed on the first main surface side, and an adhesive resin for fixing the electroconductive particles to the first main surface, wherein circularity of the cross sections of the electroconductive particles in the cross section of the ground member is 0.35 or more, and the electroconductive particles are penetrating the protective layer of the shielding film and connected to the shielding layer of the shielding film, and the external connection member of the ground member is electrically connectable to an external ground.
H01R 4/04 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
76.
Electromagnetic wave shielding film and shielded printed wiring board
An electromagnetic wave shielding film that can be thinned, and has high peel strength, electroconductivity, shielding properties, and flex resistance and conformability to a step is provided. An electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition, wherein the electroconductive particles contain flaky electroconductive particles and spherical electroconductive particles, the average particle size of the spherical electroconductive particles is 1 to 10 μm, the content of the flaky electroconductive particles and the spherical electroconductive particles in the electroconductive adhesive layer is 70 to 80% by weight, the weight ratio of the flaky electroconductive particles to the spherical electroconductive particles, [flaky electroconductive particles]/[spherical electroconductive particles], is 6/4 to 8/2, and the thickness of the electroconductive adhesive layer is 5 to 20 μm.
A nozzle (2b) used in a thermal spraying method such as cold spraying comprises a nozzle pipe (23) through which a powder (10), which serves as a film-forming raw material, and a working gas pass. The nozzle pipe (23) has an inner peripheral surface where the surface roughness Sa has a D10 cumulative particle size distribution of the powder (10) of not more than 25%.
C23C 24/04 - Impact or kinetic deposition of particles
B05B 7/16 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating the material to be sprayed
Provided is a double-sided adhesive sheet which has excellent film processability and excellent adhesiveness. This double-sided adhesive sheet 3 comprises a substrate layer 1 and adhesive layers 2 including a heat-curable resin and superposed respectively on both surfaces of the substrate layer 1, wherein the substrate layer 1 has a modulus of 50-200 GPa. The double-sided adhesive sheet 3 has a modulus of 2-195 GPa. The heat-curable resin preferably includes a modified epoxy resin. The modulus of the substrate layer 1 is preferably 50-100 GPa. The substrate layer 1 has a thickness of preferably 2-40 μm.
Provided is a conductive adhesive layer having sufficiently high heat dissipation properties in the thickness direction while maintaining electromagnetic wave shielding properties. This conductive adhesive layer comprises a binder component and conductive particles, and is characterized in that: the conductive particles include first particles and second particles having a median diameter smaller than that of the first particles; the second particles are flaky particles obtained by covering the core particles with a metal layer; and the ratio of the mass of the conductive particles to the mass of the conductive adhesive layer is 60 to 90 mass%.
Provided is an electromagnetic shield film in which the interlayer adhesion between an adhesive layer and a shield layer is unlikely to break down even upon heating with reflow etc. An electromagnetic shield film according to the present invention comprises an adhesive layer and a shield layer that is laminated on the adhesive layer, said electromagnetic shield film being characterized in that: the adhesive layer contains resin and porous inorganic particles; and the pore volume of the porous inorganic particles is more than 0.44 mL/g but not more than 1.80 mL/g.
Provided is a conductive composition that can form a cured product having excellent conductive properties and adhesion to an adherend even at a lower curing temperature than is conventional. A conductive composition according to the present invention contains an epoxy compound, an imidazole compound, an amine adduct-based latent curing agent, an alkanolamine and/or aliphatic polyamine, and a metal powder, wherein: the epoxy equivalent of the epoxy compound is 100-300 g/eq; the mixed proportion of the metal powder in the conductive composition is 75-91 mass%; the imidazole compound includes an imidazole compound having a phenyl group; and 10-40 parts by mass of the imidazole compound, at least 3 parts by mass of the amine adduct-based latent curing agent, and at least 0.5 parts by mass of the alkanolamine and/or aliphatic polyamine are included relative to 100 parts by mass of the epoxy compound.
A powder charging component (1) comprises a first component (10) including a bottom section (11) and an outer frame (12), and a second component (15). The bottom section (11) has a bottom section hole (11CV) formed therein. The outer frame (12) extends from the outer periphery of the bottom section (11) in a first direction that intersects the bottom section (11). The second component (15) can be attached to the bottom section (11) so as to be surrounded by the outer frame (12). The second component (15) includes a leading end section (15A) with width in a planar view. The leading end section (15A) extends in the first direction and has a cylindrical part in which a first cavity (15CV) is formed.
B01J 4/00 - Feed devicesFeed or outlet control devices
B05C 19/06 - Storage, supply or control of the application of particulate materialRecovery of excess particulate material
B05D 1/02 - Processes for applying liquids or other fluent materials performed by spraying
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B65B 69/00 - Unpacking of articles or materials, not otherwise provided for
B05B 7/16 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating the material to be sprayed
Provided is a thermally-conductive electrical conducting layer excelling in thermal conductivity in the thickness direction. The thermally-conductive electrical conducting layer (1) comprises a binder component (11) and electrically-conductive particles (12). The electrically-conductive particles (12) comprise: electrically-conductive particles A (12a) having a thermal conductivity of 20 W/mK or more and a median diameter that is larger than the thickness (T) of the thermally-conductive electrical conducting layer (1); and electrically-conductive particles B (12b) having a median diameter that is smaller than the thickness (T) of the thermally-conductive electrical conducting layer (1). The resistivity of the thermally-conductive electrical conducting layer (1) is 2.0×10-5 Ω·m or more.
H01B 5/16 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
Provided is an electromagnetic wave shield film from which static electricity that has accumulated during manufacture or transfer can be readily dissipated. An electromagnetic wave shield film of the present invention is characterized by comprising a protection layer disposed in an outermost layer, and a shield layer laminated on the inside of the protection layer, the protection layer having a surface resistivity of 1.0×105to 2.0×1012 Ω/□, and the protection layer includes a binder resin and carbon particles having an average particle diameter of 0.1-15 μm.
Provided is an electromagnetic wave shield film that has high volatile component permeability but also has sufficient high-frequency electromagnetic wave shielding characteristics. This electromagnetic wave shield film is formed by layering, in order, a protection layer, a metal vapor deposition layer, an electroplating layer, and a conductive adhesive layer. The electromagnetic wave shield film is characterized in that a plurality of through holes are formed in the electroplating layer, the through holes being filled with an insulating resin.
Provided is an electroconductive resin composition capable of forming a shield layer having exceptional adhesiveness to an object being coated even when exposed to high temperature and having exceptional shielding properties for the surface of the the object being coated. The electroconductive resin composition contains, per 100 parts by mass of a binder component (A), 4,000-15,000 parts by mass of metal particles (B), 1-20 parts by mass of a curing agent (C), and 300-4,000 parts by mass of a solvent (D). The binder component (A) contains 10-60 mass% of a rubber-modified epoxy resin (A1) and 40-90 mass% of an acrylic compound (A2). The metal particles (B) contain 2,000-13,500 parts by mass of metal particles (B1) that are silver powder and/or silver-coated copper powder and have an average particle size of 1-20 μm, and 400-7,500 parts by mass of metal particles (B2) that are spherical silver powder having an average particle size of 100-500 nm. The mass ratio [(B1):(B2)] of the metal particles (B1) and the metal particles (B2) is 5:5-9:1.
Provided is an electromagnetic wave shield film that does not readily accumulate volatile components between a metal layer and a conductive adhesive layer and has sufficiently high shielding properties for electromagnetic waves in the high-frequency band. This electromagnetic wave shield film is characterized by being formed by layering, in order, a protection layer, an isotropic conductive adhesive layer, a metal layer, and a conductive adhesive layer, the metal layer having an opening part.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
The present invention provides a conductive paste which is capable of forming a cured product that achieves high conductivity and long-term reliability at the same time. The present invention provides a conductive paste which contains, per 100 parts by mass of a liquid epoxy compound, 1,700 parts by mass to 3,300 parts by mass of metal particles that include high melting point metal particles (B1) which contain silver and/or copper and have a melting point of 800°C or higher, low melting point metal particles (B2) which are formed of an alloy having a melting point of 130°C to 150°C, and low melting point metal particles (B3) which are formed of an alloy of two or more metals selected from the group consisting of tin, silver, copper, bismuth and indium, and have a melting point of 200°C to 240°C, 1 part by mass to 30 parts by mass of a curing agent, and 20 parts by mass to 200 parts by mass of a flux.
09 - Scientific and electric apparatus and instruments
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Electromagnetic interference shielding films being
structural parts or components of cellular phones;
electromagnetic interference shielding films being
structural parts or components of smartphones;
electromagnetic interference shielding films being
structural parts or components of tablet computers;
electromagnetic interference shielding films being
structural parts or components of computers; electromagnetic
interference shielding films being structural parts or
components of event recorders; electromagnetic interference
shielding films being structural parts or components of
navigational instruments for vehicles; electromagnetic
interference shielding films being structural parts or
components of Global Positioning System [GPS] apparatus;
electromagnetic interference shielding films being
structural parts or components of camcorders;
electromagnetic interference shielding films being
structural parts or components of printed circuit boards;
electromagnetic interference shielding films being
structural parts or components of flexible printed circuits;
electromagnetic interference shielding films being
structural parts or components of telecommunication machines
and apparatus; electromagnetic interference shielding films
being structural parts or components of computers and their
peripherals; electromagnetic interference shielding films
being structural parts or components of electron tubes;
electromagnetic interference shielding films being
structural parts or components of semi-conductor elements;
electromagnetic interference shielding films being
structural parts or components of electronic circuits, not
including those recorded with computer programs;
electromagnetic interference shielding films being
structural parts or components of computer program;
electromagnetic interference shielding films being
structural parts or components of personal digital
assistants; electromagnetic interference shielding materials
being structural parts or components of telecommunication
machines and apparatus; electromagnetic interference
shielding materials being structural parts or components of
computers and their peripherals; electromagnetic
interference shielding materials being structural parts or
components of electron tubes; electromagnetic interference
shielding materials being structural parts or components of
semi-conductor elements; electromagnetic interference
shielding materials being structural parts or components of
electronic circuits, not including those recorded with
computer programs; electromagnetic interference shielding
materials being structural parts or components of computer
program; electromagnetic interference shielding materials
being structural parts or components of personal digital
assistants; cellular phones; smartphones; tablet computers;
computers; event recorders; navigation apparatus for
vehicles [on-board computers]; Global Positioning System
[GPS] apparatus; camcorders; printed circuit boards;
flexible printed circuits; semi-conductors; parts of
semi-conductors; telecommunication machines and apparatus;
computers and their peripherals; electron tubes;
semi-conductor elements; electronic circuits, not including
those recorded with computer programs; computer program;
personal digital assistants. Electrical insulating materials; adhesive tapes, other than
stationery and not for medical or household purposes;
electromagnetic interference shielding plastic films;
electromagnetic interference shielding films;
electromagnetic interference shielding materials; adhesive
conductive plastic films; adhesive electromagnetic
interference shielding films; plastic substances,
semi-processed; plastic film, other than for wrapping;
plastic semi-worked products.
This bonding wire contains 0.005-2.0 mass% of In, a total of 0.005-2.0 mass% one or both of Au and Pd, a total of 5-500 ppm by mass of one or both elements selected from Bi and Cu, and a total of 0-500 ppm by mass of one or more elements selected from the group consisting of Ca, Mg, Ge, Y, Nd, Sm, Gd, La and Ce, with the remainder comprising Ag. Due to this configuration, it is possible to achieve excellent long-term reliability and achieve a good circular shape when a FAB is brought into contact with an electrode and crushed.
Provided is a transfer film that transfers recesses and projections to a protective layer of an electromagnetic wave shield film, thereby successfully imparting a matte effect to the surface of the protective layer, and that can be used to produce an electromagnetic wave shield film in which cracks do not easily occur in the protective layer during thermocompression bonding. This transfer film is provided with a matte effect transfer layer having a matte effect transfer surface, and is characterized in that the matte effect transfer layer comprises a resin filler.
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
The present invention provides an electromagnetic wave shield film that is not easily damaged even when placed on a high step-height substrate. The electromagnetic wave shield film comprises a protective layer and an isotropic conductive adhesive layer laminated on the protective layer, wherein the protective layer contains a protective layer filler, the isotropic conductive adhesive layer contains a resin component, a conductive filler, and a non-conductive filler, the ratio of the weight of the conductive filler to the weight of the non-conductive filler (the weight of the conductive filler/the weight of the non-conductive filler) is 15.0-23.0, and the ratio of the total weight of the conductive filler and the non-conductive filler to the weight of the protective layer filler ((the weight of the conductive filler + the weight of the non-conductive filler)/the weight of the protective layer filler) is 1.9-2.2.
A conductive composition is provided that can be spray coated to form a shielding layer having good shielding capability against 100 MHz to 40 GHz electromagnetic waves, and having desirable adhesion to a package with good laser mark visibility. A method of production of a shielded package with such a conductive composition is also provided. A conductive composition includes at least: (A) a (meth)acrylic resin having a weight average molecular weight of 1,000 or more and 400,000 or less; (B) a monomer having a glycidyl group and/or a (meth)acryloyl group within the molecule; (C) a granular resin component having an average particle diameter of 10 nm to 700 nm; (D) a conductive filler having an average particle diameter of 10 to 500 nm; (E) a scale-like conductive filler having an average particle diameter of 1 to 50 μm; (F) a radical polymerization initiator; and (G) an epoxy resin curing agent, the granular resin component (C) being present in a proportion of 3 to 27 mass % in a resin component containing the acrylic resin (A), the monomer (B), and the granular resin component (C), the conductive filler (D) and the conductive filler (E) being present in an amount of 2,000 to 12,000 parts by mass in total relative to 100 parts by mass of the resin component, the radical polymerization initiator (F) being present in an amount of 0.5 to 40 parts by mass relative to 100 parts by mass of the resin component, and the epoxy resin curing agent (G) being present in an amount of 0.5 to 40 parts by mass relative to 100 parts by mass of the resin component.
C09D 133/10 - Homopolymers or copolymers of methacrylic acid esters
C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
H01L 23/552 - Protection against radiation, e.g. light
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
94.
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
Provided is an electromagnetic wave shielding film that exhibits a high peel strength and connection reliability by its electroconductive adhesive layer and that can suppress the generation of cracking in an insulating layer laminated on the electroconductive adhesive layer. The electromagnetic wave shielding film according to the present invention comprises an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition, and an insulating layer laminated on the electroconductive adhesive layer, and is characterized in that the electroconductive particles comprise higher-melting-point electroconductive particles and lower-melting-point electroconductive particles having a melting point lower than that of the higher-melting-point electroconductive particles; in that the higher-melting-point electroconductive particles contain high-melting-point flake particles and high-melting-point spherical particles; and in that the content of the high-melting-point flake particles is 60-80 wt% with reference to the total content of the high-melting-point flake particles plus the high-melting-point spherical particles plus the lower-melting-point electroconductive particles.
Provided is a biological electrode including: a polarizable electrode layer; and a non-polarizable electrode layer laminated on the polarizable electrode layer, in which the non-polarizable electrode layer includes a resin, silver, and silver chloride supported by silica, a content of the silver is 150 to 300 mass parts based on 100 mass parts of the resin, a ratio between the silver and the silver chloride is 97:3 to 95:5, and the non-polarizable electrode layer has a thickness of 3 to 5 μm.
This film-forming device used in thermal spraying comprises: a spray gun including a nozzle (2b); a powder supply unit that supplies powder to the spray gun as a film-forming material; and a gas supply unit that supplies an operating gas to the spray gun. The nozzle (2b) includes: a stainless steel pipe (23) serving as a nozzle pipe; a ceramic pipe (22) connected to the stainless steel pipe (23) on the upstream side through which the operating gas flows; and a nozzle holder (21) into which the ceramic pipe (22) is inserted. The nozzle holder (21) includes a first section (21A) extending in a first direction in which the operating gas flows within the nozzle holder (21). The film-forming device further comprises piping (5) connecting the powder supply unit and the first section (21A). Piping (5A), which is a section of the piping (5) connected to the first section (21A), extends in a second direction intersecting the first direction.
C23C 24/04 - Impact or kinetic deposition of particles
B05B 7/04 - Spray pistolsApparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
B05B 7/16 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating the material to be sprayed
Provided is an electromagnetic wave shield film having sufficiently high bending resistance. The electromagnetic wave shield film according to the present invention is characterized by including a protection layer, a metal layer, and an adhesive layer that are sequentially laminated, wherein the ratio ([repulsive force Y])/[repulsive force X]) of the repulsive force Y of the adhesive layer in an adhesive layer repulsive force measurement test to the repulsive force X of a laminate, which is composed of the protection layer and the metal layer, in a laminate repulsive force measurement test is 0.77 or greater.
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
98.
SPRAY NOZZLE, NOZZLE TIP PART, AND THERMAL SPRAYING DEVICE
Provided is a spray nozzle that makes it possible to reduce a difference in film thickness in a film. A spray nozzle (1) for use in a cold spray device (100) includes: a nozzle main body (15) that has a first path (20) through which a film material and a carrier gas pass; and a nozzle tip section (16) that is provided at a tip section of the nozzle main body (15) and has a second path (21) which communicates with the first path (20), the second path (21) being broadened at a position apart from a cross-sectional center (P) of the second path (21).
Even in a case where a spray nozzle of a solid phase particle deposition device is in motion, flying solid phase particles are efficiently collected. An attachment (1) includes: an engagement part (2) to be engaged with a spray nozzle (130) of a cold spray device (1); and an opening part (3) connected to the engagement part (2) and having at least one opening (3a, 3b) to be connected to a collection section (20) that is configured to collect solid phase particles (30b) which are sprayed through the spray nozzle (130) onto a base material (170) and are not involved in formation of a film on the base material (170).
B05B 14/10 - Arrangements for collecting, re-using or eliminating excess spraying material the excess material being particulate
C23C 24/04 - Impact or kinetic deposition of particles
B05B 1/28 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for shielding the discharged liquid or other fluent material, e.g. to limit area of sprayNozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with integral means for catching drips or collecting surplus liquid or other fluent material
B05B 12/32 - Shielding elements, i.e. elements preventing overspray from reaching areas other than the object to be sprayed
Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.
