Unimicron Technology Corp.

Taiwan, Province of China

Create a watch for Unimicron Technology Corp.
Total IP 467
Total IP incl. subs 476 (+ 9 for subs)
Total IP Rank # 2,826
IP Activity Score 3.3/5.0    307
IP Activity Rank # 2,310
IP AS incl. subs 2.9/5.0    309
Stock Symbol 3037 (twse)
ISIN TW0003037008
Market Cap. 225.5B  (TWD)
Industry Contract Manufacturers
Sector Technology
Dominant Nice Class Treatment of materials; recyclin...

Patents

Trademarks

465 1
0 0
1 0
0
 
Last Patent 2025 - Circuit board device
First Patent 2001 - Method of producing external con...
Last Trademark 2017 - UNIMICRON
First Trademark 2017 - UNIMICRON

Subsidiaries

4 subsidiaries with IP (9 patents, 0 trademarks)

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 Invention Stacked structure for circuit board. A stacked structure for circuit board includes a composite ...
Invention Circuit board and method of manufacturing the same. A circuit board and a method of manufacturin...
Invention Manufacturing method of circuit carrier. A manufacturing method of a circuit carrier includes th...
Invention Substrate structure. A substrate structure and a cutting method thereof are provided. The cuttin...
Invention Substrate structure and manufacturing method thereof. A substrate structure including a first su...
2024 Invention Electronic packaging structure. An electronic packaging structure including a first circuit stru...
Invention Manufacturing method of circuit board. A manufacturing method of the circuit board includes the ...
Invention Manufacturing method of package carrier. A manufacturing method of the package carrier includes ...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes an inorgani...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes a first sub...
Invention Manufacturing method of circuit board structure. A manufacturing method of a circuit board struc...
Invention Circuit board device. A circuit board device for transmitting signals at a frequency of 50 GHz t...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes a substrate...
Invention Package structure. Disclosed is a package structure including a circuit board, a co-packaged opt...
Invention Connector and manufacturing method thereof. A connector and a manufacturing method thereof. The ...
Invention Wiring board structure. A wiring board structure is provided, which includes a substrate, a firs...
Invention Package structure. A package structure includes a package substrate, a system on a chip (SoC), a...
Invention Vapor chamber structure and manufacturing method thereof. A vapor chamber structure includes a f...
Invention Probe card. A probe card includes an adapter plate, a guide plate, a plurality of probes, at lea...
Invention Probe card. A probe card includes an adapter plate, a guide plate and a plurality of probes. The...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a c...
2023 Invention Package substrate and manufacturing method thereof. A package substrate includes a core layer, a...
Invention Circuit board structure and fabrication method thereof. A circuit board structure includes a cor...
Invention Package structure and manufacturing method thereof. A package structure includes a package subst...
Invention Chip package structure and manufacturing method thereof. A chip package structure includes a fir...
Invention Integrated circuit package structure. An integrated circuit (IC) package structure includes a chi...
Invention Capacitive element, circuit carrier having the same and fabrication method thereof. A circuit ca...
Invention Electronic package module and method for fabrication of the same. An electronic package module i...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure and a manufac...
Invention Co-packaged structure for optics and electrics. A co-packaged structure for optics and electrics...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure including a f...
Invention Substrate structure and cutting method thereof. A substrate structure and a cutting method thereo...
Invention Inspection system and inspection method of bare circuit board. An inspection system and an inspec...
Invention Embedded inductor structure and manufacturing method thereof. The present invention includes an ...
Invention Circuit board structure and manufacturing method thereof. The invention provides a circuit board...
Invention Chip package structure and manufacturing method thereof. A chip package structure includes a pac...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a b...
2022 Invention Anti-diffusion substrate structure and manufacturing method thereof. An anti-diffusion substrate...
Invention Circuit board with low grain boundary density and forming method thereof. The present disclosure ...
Invention Circuit board structure and method for forming the same. A circuit board structure is provided. ...
Invention Transmission line device compriing first and second conductive lines on one level separated from ...
Invention Transmission device for suppressing glass fiber effect. A transmission device for suppressing the...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a ca...
Invention Package structure and method for manufacturing the same. A package structure includes a first su...
Invention Circuit board with embedded chip and method of manufacturing the same. The present disclosure pr...
Invention Circuit board assembly and manufacturing method thereof. This disclosure provides a circuit board...
Invention Circuit board structure and manufacturing method thereof. A manufacturing method for circuit boa...
2017 G/S Custom manufacture of printed circuit boards, electronic equipment and appliances for others Test...