Unimicron Technology Corp.

Taïwan, Province de Chine

Commandez votre montre hebdomadaire Unimicron Technology Corp.
Quantité totale PI 484
Quantité totale incluant filiales 493 (+ 9 pour les filiales)
Rang # Quantité totale PI 2 752
Note d'activité PI 3,3/5.0    299
Rang # Activité PI 2 355
Activité incl filiales 2,9/5.0    301
Symbole boursier 3037 (twse)
ISIN TW0003037008
Capitalisation 225.5B  (TWD)
Industrie Contract Manufacturers
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

482 1
0 0
1 0
0
 
Dernier brevet 2026 - Circuit board and method for fab...
Premier brevet 2001 - Method of producing external con...
Dernière marque 2017 - UNIMICRON
Première marque 2017 - UNIMICRON

Filiales

4 subsidiaries with IP (9 patents, 0 trademarks)

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Substrate structure and manufacturing method thereof. A substrate structure includes a first sub...
Invention Substrate structure. A substrate structure includes a first substrate, a second substrate, a plu...
Invention Substrate structure. A substrate structure includes a first substrate, a second substrate, a thi...
Invention Circuit board and method of circuit plating thereof. A circuit board and a method of circuit pla...
Invention Stacked structure for circuit board. A stacked structure for circuit board includes a composite ...
Invention Circuit board and method of manufacturing the same. A circuit board and a method of manufacturin...
Invention Manufacturing method of circuit carrier. A manufacturing method of a circuit carrier includes th...
Invention Substrate structure. A substrate structure and a cutting method thereof are provided. The cuttin...
Invention Substrate structure and manufacturing method thereof. A substrate structure including a first su...
2024 Invention Electronic packaging structure. An electronic packaging structure including a first circuit stru...
Invention Manufacturing method of circuit board. A manufacturing method of the circuit board includes the ...
Invention Manufacturing method of package carrier. A manufacturing method of the package carrier includes ...
Invention Circuit board and method for fabricating the same. A circuit board and a method for fabricating ...
Invention Substrate structure with waveguide inside of via and manufacturing method thereof. A substrate s...
Invention Circuit board structure and method for manufacturing the same. A circuit board structure include...
Invention Substrate structure. A substrate structure is provided. The substrate structure includes a subst...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes an inorgani...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure and a manufa...
Invention Manufacturing method of circuit board structure. A manufacturing method of a circuit board struc...
Invention Collapse-free circuit structure with low capacitance effect. A collapse-free circuit structure w...
Invention Circuit board device. A circuit board device for transmitting signals at a frequency of 50 GHz t...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes a substrate...
Invention Package structure and manufacturing method thereof. A package structure includes a circuit board...
Invention Package structure. Disclosed is a package structure including a circuit board, a co-packaged opt...
Invention Connector and manufacturing method thereof. A connector and a manufacturing method thereof. The ...
Invention Wiring board structure. A wiring board structure is provided, which includes a substrate, a firs...
Invention Package structure. A package structure includes a package substrate, a system on a chip (SoC), a...
Invention Probe card. A probe card includes an adapter plate, a guide plate, a plurality of probes, at lea...
Invention Probe card. A probe card includes an adapter plate, a guide plate and a plurality of probes. The ...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a c...
2023 Invention Package substrate and manufacturing method thereof. A package substrate includes a core layer, a...
Invention Circuit board structure and fabrication method thereof. A circuit board structure includes a cor...
Invention Package structure and manufacturing method thereof. A package structure includes a package subst...
Invention Chip package structure and manufacturing method thereof. A chip package structure includes a fir...
Invention Capacitive element, circuit carrier having the same and fabrication method thereof. A circuit ca...
Invention Electronic package module and method for fabrication of the same. An electronic package module i...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure and a manufac...
Invention Co-packaged structure for optics and electrics. A co-packaged structure for optics and electrics ...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure including a f...
Invention Substrate structure and cutting method thereof. A substrate structure and a cutting method thereo...
Invention Inspection system and inspection method of bare circuit board. An inspection system and an inspec...
Invention Embedded inductor structure and manufacturing method thereof. The present invention includes an ...
Invention Circuit board structure and manufacturing method thereof. The invention provides a circuit board...
Invention Chip package structure and manufacturing method thereof. A chip package structure includes a pac...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a b...
2022 Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a ca...
2017 P/S Custom manufacture of printed circuit boards, electronic equipment and appliances for others Test...