Unimicron Technology Corp.

Taïwan, Province de Chine

 
Quantité totale PI 456
Quantité totale incluant filiales 465 (+ 9 pour les filiales)
Rang # Quantité totale PI 2 837
Note d'activité PI 3,3/5.0    319
Rang # Activité PI 2 247
Activité incl filiales 2,9/5.0    320
Symbole boursier 3037 (twse)
ISIN TW0003037008
Capitalisation 225.5B  (TWD)
Industrie Contract Manufacturers
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

454 1
0 0
1 0
0
 
Dernier brevet 2025 - Chip package structure and manuf...
Premier brevet 2001 - Method of producing external con...
Dernière marque 2017 - UNIMICRON
Première marque 2017 - UNIMICRON

Filiales

4 subsidiaries with IP (9 patents, 0 trademarks)

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Electronic packaging structure. An electronic packaging structure including a first circuit stru...
Invention Manufacturing method of circuit board. A manufacturing method of the circuit board includes the ...
Invention Manufacturing method of package carrier. A manufacturing method of the package carrier includes ...
Invention Manufacturing method of circuit board structure. A manufacturing method of a circuit board struc...
Invention Package structure. Disclosed is a package structure including a circuit board, a co-packaged opt...
Invention Connector and manufacturing method thereof. A connector and a manufacturing method thereof. The ...
Invention Vapor chamber structure and manufacturing method thereof. A vapor chamber structure includes a f...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a c...
2023 Invention Circuit board structure and fabrication method thereof. A circuit board structure includes a cor...
Invention Chip package structure and manufacturing method thereof. A chip package structure includes a fir...
Invention Integrated circuit package structure. An integrated circuit (IC) package structure includes a chi...
Invention Circuit board assembly. A circuit board assembly is provided and includes a first circuit board, ...
Invention Capacitive element, circuit carrier having the same and fabrication method thereof. A circuit ca...
Invention Manufacturing method of circuit board. Provided is a manufacturing method of circuit board, inclu...
Invention Electronic package module and method for fabrication of the same. An electronic package module i...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure and a manufa...
Invention Circuit board device. A circuit board device includes a transition region that includes a first ...
Invention Co-packaged structure for optics and electrics. A co-packaged structure for optics and electrics...
Invention Electronic packaging structure and manufacturing method thereof. An electronic packaging structu...
Invention Package structure and manufacturing method thereof. A package structure includes a circuit board...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure including a ...
Invention Substrate structure and cutting method thereof. A substrate structure and a cutting method thereo...
Invention Inspection system and inspection method of bare circuit board. An inspection system and an inspe...
Invention Embedded inductor structure and manufacturing method thereof. The present invention includes an ...
Invention Multi-layered resonator circuit structure and multi-layered filter circuit structure. A multi-la...
Invention Circuit board structure and manufacturing method thereof. The invention provides a circuit board...
Invention Chip package structure and manufacturing method thereof. A chip package structure includes a pac...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a b...
2022 Invention Anti-diffusion substrate structure and manufacturing method thereof. An anti-diffusion substrate...
Invention Circuit board with low grain boundary density and forming method thereof. The present disclosure...
Invention Circuit board structure and method for forming the same. A circuit board structure is provided. ...
Invention Transmission device. A transmission device includes a daisy chain structure composed of at least...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure includes a ca...
Invention Transmission device for suppressing glass fiber effect. A transmission device for suppressing the...
Invention Electronic device. An electronic device including a light-emitting element, an IC chip, a substra...
Invention Package structure and method for manufacturing the same. A package structure includes a first su...
Invention Circuit board with embedded chip and method of manufacturing the same. The present disclosure pr...
Invention Circuit board assembly and manufacturing method thereof. This disclosure provides a circuit boar...
Invention Circuit board structure and manufacturing method thereof. A manufacturing method for circuit boa...
Invention Printed circuit board and manufacturing method thereof. The present disclosure provides a printed...
Invention Package structure and manufacturing method thereof. A manufacturing method of a package structur...
Invention Method for manufacturing circuit board and stacked structure. A method for manufacturing a circu...
Invention Package structure and optical signal transmitter. A package structure includes a circuit board, a...
Invention Etching device and etching method. The present invention provides an etching device which compri...
Invention Circuit board and circuit board module with docking structure and manufacture method of the circu...
Invention Circuit board and manufacturing method thereof. The present disclosure provides a circuit board a...
Invention Connector and method for manufacturing the same. A connector includes a substrate, a coverlay and...
2017 P/S Custom manufacture of printed circuit boards, electronic equipment and appliances for others Test...