Unimicron Technology Corp.

Taïwan, Province de Chine


Commandez votre montre hebdomadaire Unimicron Technology Corp.
Quantité totale PI 508
Quantité totale incluant filiales 518 (+ 10 pour les filiales)
Rang # Quantité totale PI 2 672
Note d'activité PI 3,3/5.0    280
Rang # Activité PI 2 564
Activité incl filiales 2,9/5.0    283
Symbole boursier 3037 (twse)
ISIN TW0003037008
Capitalisation 225.5B  (TWD)
Industrie Contract Manufacturers
Secteur Technology
Classe Nice dominante Traitement de matériaux; recycla...

Brevets

Marques

504 3
0 0
1 0
0
 
Dernier brevet 2026 - Circuit board and manufacturing ...
Premier brevet 2001 - Method of producing external con...
Dernière marque 2026 - UMTC
Première marque 2017 - UNIMICRON

Filiales

4 subsidiaries with IP (10 patents, 0 trademarks)

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2026 P/S Integrated circuits; Printed circuit boards; Circuit boards provided with integrated circuits; Ph...
P/S Custom manufacture of printed circuit boards, electronic equipment and appliances for others Test...
Invention Circuit board, manufacturing method thereof, and electronic device. A circuit board, including a...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure and a manufa...
2025 Invention Method for manufacturing package structure. A package structure includes a first substrate, a se...
Invention Manufacturing method of package structure. A manufacturing method of a package structure include...
Invention Substrate structure. A substrate structure includes a first substrate and a second substrate. Th...
Invention Substrate structure. A substrate structure includes a first substrate and a second substrate bon...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes a first sub...
Invention Metal substrate and surface treatment method. A metal substrate and a surface treatment method. ...
Invention Substrate structure. A substrate structure including a first circuit portion, a second circuit p...
Invention Package carrier structure and manufacturing method thereof. A package carrier structure and a ma...
Invention Substrate structure. A substrate structure including a dielectric substrate, an adhesion promoti...
Invention Substrate structure. A substrate structure includes a first substrate, a second substrate, a plu...
Invention Substrate structure. A substrate structure includes a first substrate, a second substrate, a thi...
Invention Circuit board and method of circuit plating thereof. A circuit board and a method of circuit pla...
Invention Stacked structure for circuit board. A stacked structure for circuit board includes a composite ...
Invention Substrate structure. A substrate structure includes a base and at least one build-up structure l...
Invention Substrate structure. A substrate structure includes a coreless substrate and a first build-up st...
Invention Waveguide structure, circuit board and manufacturing method of circuit board. The disclosure pro...
Invention Circuit board and method of manufacturing the same. A circuit board and a method of manufacturin...
Invention Circuit board and manufacturing method thereof. A circuit board and a manufacturing method there...
Invention Manufacturing method of circuit carrier. A manufacturing method of a circuit carrier includes th...
Invention Manufacturing method for circuit board structure. A manufacturing method for a circuit board str...
Invention Substrate structure. A substrate structure and a cutting method thereof are provided. The cuttin...
Invention Substrate structure and manufacturing method thereof. A substrate structure including a first su...
Invention Substrate structure and manufacturing method thereof. A substrate structure, including a core su...
Invention Metallized glass substrate and method for manufacturing the same. A metallized glass substrate i...
Invention Load control probe device and load control method. A load control probe device includes a probe ...
2024 Invention Circuit board structure. A circuit board structure includes a substrate, a first coaxial conduct...
Invention Circuit board measurement kit and circuit board measurement method. A circuit board measurement ...
Invention Manufacturing method of circuit board. Disclosed is a manufacturing method of a circuit board in...
Invention Circuit board structure. A circuit board structure is provided. The circuit board structure incl...
Invention Circuit board and method for fabricating the same. A circuit board and a method for fabricating ...
Invention Substrate structure with waveguide inside of via and manufacturing method thereof. A substrate s...
Invention Circuit board structure and method for manufacturing the same. A circuit board structure include...
Invention Substrate structure. A substrate structure is provided. The substrate structure includes a subst...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes an inorgani...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes a first subs...
Invention Circuit board structure and manufacturing method thereof. A circuit board structure and a manufac...
Invention Collapse-free circuit structure with low capacitance effect. A collapse-free circuit structure wi...
Invention Circuit board device. A circuit board device for transmitting signals at a frequency of 50 GHz to...
Invention Substrate structure and manufacturing method thereof. A substrate structure includes a substrate...
Invention Package structure and manufacturing method thereof. A package structure includes a circuit board...
Invention Wiring board structure. A wiring board structure is provided, which includes a substrate, a first...
Invention Probe card. A probe card includes an adapter plate, a guide plate, a plurality of probes, at lea...
Invention Probe card. A probe card includes an adapter plate, a guide plate and a plurality of probes. The ...
2023 Invention Package substrate and manufacturing method thereof. A package substrate includes a core layer, a...
Invention Package structure and manufacturing method thereof. A package structure includes a package substr...