A measurement system includes a first measurement apparatus and a second measurement apparatus. Each apparatus includes a sensor that outputs a measurement signal, a wireless communication circuit that receives a trigger signal, and a synchronous sampling circuit. Each synchronous sampling circuit is configured to sample a both the trigger signal received and the measurement signal in synchronization with each other and output a synchronous trigger signal and a synchronous measurement signal. The wireless communication unit of each apparatus then transmits a signal pair including the synchronous trigger signal and the synchronous measurement signal.
A human body tracking device and a human body tracking method capable of improving the accuracy in tracking of a human body are implemented. The device includes a transmitter/receiver that transmits a radio wave and receives a reflected wave of the transmitted radio wave, and a processor that estimates a location of a human body on the basis of an intermediate frequency (IF) signal output from the transmitter/receiver. The processor is configured to execute a first detection process that detects coordinates of a moving object as first coordinates, a second detection process that detects coordinates of at least the human body in a stationary state as second coordinates, and a tracking process that tracks the human body on the basis of the first coordinates and the second coordinates.
G01S 13/72 - Radar-tracking systemsAnalogous systems for two-dimensional tracking, e.g. combination of angle and range tracking, track-while-scan radar
A61B 5/00 - Measuring for diagnostic purposes Identification of persons
A61B 5/05 - Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fieldsMeasuring using microwaves or radio waves
A61B 5/11 - Measuring movement of the entire body or parts thereof, e.g. head or hand tremor or mobility of a limb
G01S 7/41 - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisationTarget signatureTarget cross-section
G01S 13/56 - Discriminating between fixed and moving objects or between objects moving at different speeds for presence detection
3.
ACOUSTIC WAVE DEVICE AND ACOUSTIC WAVE FILTER DEVICE
An acoustic wave device includes a piezoelectric layer including first and second main surfaces, an IDT electrode on one of the first and second main surfaces, and including electrode fingers, a support facing the second main surface, and including an acoustic reflection portion at a portion closer to the second main surface of the piezoelectric layer, and a load film extending over a region that overlaps, when viewed in plan in the first direction, at least electrode fingers from a fourth one of the electrode fingers from a first outer end in an arrangement direction to a fourth one of the electrode fingers from a second outer end in the arrangement direction. d/p is less than or equal to about 0.5 where d denotes a thickness of the piezoelectric layer, and p denotes a center-to-center distance between adjacent two of the electrode fingers.
A measuring instrument is provided for inserting into an oral cavity with a narrow opening and that enables intraoral measurement in such a way as to relieve stress exerted on a probe part of the measuring instrument. The measuring device is configured to ensure that the probe part is accurately pressed against the oral mucosa of a person subjected to measurement. The measuring instrument includes a grip and a probe. The probe includes a measurement section and a joint forming a connection between the measurement section and grip. The measurement section is a tip region of the probe and provided with the sensor having an exposed measurement surface. A circuit board is disposed in the joint. The circuit board is an oscillation circuit board on which members forming an oscillation circuit are mounted. The oscillation circuit outputs an oscillatory signal corresponding to an electrical signal transmitted from the sensor.
An oxide material comprising: one or more selected from the group consisting of a nanofiber, a two-dimensional substance, or an amorphous substance of a material represented by: MQaOb wherein M is one or more elements selected from the group consisting of Groups 3, 4, 5, 6, and 7, Q is one or more elements selected from the group consisting of Groups 12, 13, 14, 15, and 16, and excluding O, a is 0 to 2, and b is more than 0 and 2 or less, wherein in a Raman spectrum, an average intensity of the oxide material at 745 to 765 cm−1 is smaller than an average intensity at 735 to 745 cm−1, and wherein a pore volume of the oxide material is 0.060 cc/g or more.
Provided is a high-frequency module with which it is possible to reduce the deterioration of the characteristics of an inductor provided inside a mounting substrate. A high-frequency module (1) comprises a mounting substrate (2), an electronic component (3), a resin layer (5), external connection terminals (6), an inductor (L1), and a partial shield electrode (7). The mounting substrate (2) includes a first main surface (2a) and a second main surface (2b) that oppose each other. The electronic component (3) is disposed on the first main surface (2a) of the mounting substrate (2). The resin layer (5) is provided on the first main surface (2a) of the mounting substrate (2) so as to cover at least a part of the electronic component (3). The plurality of external connection terminals (6) are provided to a main surface (5a) of the resin layer (5) on the side thereof that is opposite the mounting substrate (2) side. The inductor (L1) is provided inside the mounting substrate (2). The partial shield electrode (7) is provided inside or on the second main surface (2b) of the mounting substrate (2). In plan view from the thickness direction (D1) of the mounting substrate (2), the partial shield electrode (7) does not overlap the inductor (L1).
H03H 9/25 - Constructional features of resonators using surface acoustic waves
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
Unnecessary waves are suppressed while suppressing deterioration in the resonance characteristics of a main wave. A piezoelectric device disclosed herein comprises: a piezoelectric laminate having a thickness in a first direction and having an upper surface that is a surface on one side in the first direction and a lower surface that is a surface on the other side in the first direction; a support member provided on the lower surface side of the piezoelectric laminate; an upper electrode provided on the upper surface side of the piezoelectric laminate; and a lower electrode provided on the lower surface side of the piezoelectric laminate. The piezoelectric laminate has a plurality of piezoelectric layers including a single crystal. Each of the plurality of piezoelectric layers is different from the other piezoelectric layers adjacent in the first direction in terms of at least one of material, crystal structure, or polarization direction. The plurality of piezoelectric layers include at least one set of piezoelectric layers having the same material and crystal structure. In at least one of the sets of piezoelectric layers, the crystal orientation of one of the piezoelectric layers is different from the crystal orientation of the other piezoelectric layers.
This MEMS device (1) comprises a first lid substrate (40), device substrates (10, 20), and a second lid substrate (30) laminated in this order, and detects the capacitance formed by the device substrates (10, 20), wherein: the first lid substrate (40) includes a conductive part (Q10), and an insulating part (Q11) that electrically insulates the conductive part (Q10); the first lid substrate (40) includes a first metal layer (E1) and a second metal layer (E2) provided on the surface facing the device substrates (10, 20); the first metal layer (E1) is provided from the conductive part (Q10) to the insulating part (Q11); and the second metal layer (E2) is provided in at least a part of a region covering a boundary part (QB) between the conductive part (Q10) and the insulating part (Q11), at the device substrate (10, 20) side of the first metal layer (E1).
G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
9.
ANTENNA MODULE, COMMUNICATION DEVICE EQUIPPED WITH SAME, AND METHOD FOR MANUFACTURING ANTENNA MODULE
NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY (Japan)
Inventor
Saeki, Hiromasa
Katsumura, Kenji
Tamura, Masaya
Matsumoto, Kenjiro
Abstract
An antenna module (30) is provided with a transmission port (T1) and a reception port (T2), antenna elements (ANT1, ANT2) having the same resonant frequency, transmission lines (21, 22), a resistive circuit (R1), and a reactance circuit (LC1). The transmission line (21) is connected between the transmission port (T1) and the antenna element (ANT1). The transmission line (22) is connected between the reception port (T2) and the antenna element (ANT2). The resistive circuit (R1) is connected between the transmission line (21) and the transmission line (22). The reactance circuit (LC1) is connected in parallel to the resistive circuit (R1). A resistance value of the resistive circuit (R1) and a reactance value of the reactance circuit (LC1) are set so that a real part and an imaginary part of admittance between the transmission port (T1) and the reception port (T2) are cancelled out at the resonant frequency or in the vicinity of the resonant frequency.
In the present invention, a component region R is defined as a region where electronic components 20, which are built into a cavity 35 of a substrate 1 with a built-in electronic component, are enveloped by a line segment parallel to the X axis of a core material 30 and a line segment parallel to the Y axis of the core material 30. Where the length from one end of the main surface of the core material 30 to the component region R is X1, the length within the component region R is X2, and the length from the other end of the main surface of the core material 30 to the component region R is X3 in a straight line A-A' parallel to the X axis, in which the overlap with the component region R is longest and the sum of overlaps with the electronic components 20 is largest, and where the length from one end of the main surface of the core material 30 to the component region R is Y1, the length within the component region R is Y2, and the length from the other end of the main surface of the core material 30 to the component region R is Y3 in a straight line B-B' parallel to the Y axis, in which the overlap with the component region R is longest and the sum of overlaps with the electronic components 20 is largest, X2 < Y2 and X1 + X3 > Y1 + Y3 are satisfied or X2 > Y2 and X1 + X3 < Y1 + Y3 are satisfied.
This filter is provided with a filter body which is provided with a first end face on the upstream side of the flow of a fluid and a second end face on the downstream side of the flow of the fluid, and which has a plurality of through-holes that allow the first end face and the second end face to connect with each other. The plurality of through-holes each have a narrowed portion having an opening diameter smaller than the opening diameter of a first opening formed in the first end face and the opening diameter of a second opening formed in the second end face. The narrowed portion is disposed at a position closer to the first end surface than to the second end surface.
A first slave device and a second slave device to which different slave identifiers are added are connected to a serial bus. The second slave device includes a second storage unit including multiple registers and a second serial interface unit that receives a command in which the slave identifier of the second slave device is set via the serial bus and that sets a result of a process corresponding to the received command in at least one register in the second storage unit.
A semiconductor device that includes: a substrate; an insulating layer on the substrate; a first electrode layer on the insulating layer; a dielectric film on the first electrode layer; a second electrode layer on the dielectric film; a moisture-resistant film covering the first electrode layer and the second electrode layer; a first outer electrode passing through the moisture-resistant film and connected to the first electrode layer; and a second outer electrode passing through the moisture-resistant film and connected to the second electrode layer. The first electrode layer and the second electrode layer each comprise Al or an Al alloy. The outer electrodes each include a seed layer formed of Cu/Ti, Cu/Cr, or Cu/nichrome and a plating layer on the seed layer. The seed layer has a horizontal crystal grain size of 500 nm or less, and the plating layer has a horizontal crystal grain size of 500 nm or less.
A filter circuit includes an inductor formed by serially connecting wiring line groups formed on a plurality of conductive layers of the board through a via and a capacitor in which a first wiring line having one end of the inductor of the wiring line groups overlaps, as viewed in a direction orthogonal to a main surface of the board, a third wiring line that is formed on one of the conductive layers that is adjacent, in the direction orthogonal to the main surface of the board, to another of the conductive layers on which the first wiring line is formed and has one end electrically connected, through a via, to a second wiring line having another end of the inductor of the wiring line groups.
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
A multilayer ceramic capacitor includes a multilayer body and an outer electrode. The multilayer body includes dielectric layers and inner electrode layers alternately stacked with the dielectric layers. Ni in one of first and second inner electrode layers forms a solid solution with Pt, and Ni in the other of the first and second inner electrode layers forms no solid solution with Pt. The one of the first and second inner electrode layers in which Ni forms a solid solution with Pt are coupled to a cathode when the multilayer ceramic capacitor is mounted.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces, an upper electrode on the first main surface, a lower electrode on the second main surface, and a support facing the second main surface of the piezoelectric layer. The piezoelectric layer includes an opening extending through the piezoelectric layer in a thickness direction in a region overlapping the lower electrode and not overlapping the upper electrode. The acoustic wave device further includes an overlapping electrode on the lower electrode in a region overlapping the opening and made of the same material as the upper electrode.
Provided is a wire-wound coil component in which, when a terminal electrode made of a metal plate is fixed to a flange of a core using an adhesive, a protruding part of the adhesive can be clearly distinguished from the flange in appearance, thereby making it difficult to cause erroneous recognition in an appearance inspection. A flange (5) has an outer end surface (14) that extends in a direction orthogonal to an axial direction and that faces outward. A terminal electrode (9) includes a mounting piece (22) extending along the outer end surface (14). The terminal electrode (9) is fixed to the flange (5) by an adhesive (25) applied between the mounting piece (22) and the outer end surface (14). As viewed from the axial direction, the adhesive (25) has a protruding portion (26) that protrudes from the mounting piece (22) on the outer end surface (14), but the protruding portion (26) has a higher gloss than the outer end surface (14).
A metal layer embedded substrate 1 includes: a core part 10 having a first main surface 10a and a second main surface 10b facing each other in a thickness direction and including a metal layer 20; a first insulating layer 60A provided on the first main surface 10a of the core part 10; a second insulating layer 60B provided on the second main surface 10b of the core part 10; and a through conductor 70 provided at least on an inner wall surface of a through hole 71 penetrating the core part 10, the first insulating layer 60A, and the second insulating layer 60B in the thickness direction. In the through hole 71, a diameter P of a portion penetrating the metal layer 20 is larger than a diameter Q of a portion penetrating the first insulating layer 60A and a diameter R of a portion penetrating the second insulating layer 60B.
This vibration motor comprises a mover magnet, a first stator magnet and a second stator magnet, a cylindrical holder, a drive winding, and a case. The cylindrical holder has a through-hole that communicates between a first end surface and a second end surface, and opens to the first end surface and the second end surface. The cylindrical holder is provided with a first flange part, a second flange part, a first opening part, and a second opening part. The mover magnet is accommodated in the through-hole in a state of being capable of vibrating in a first direction parallel to the axis of the through-hole. The first stator magnet and the second stator magnet are disposed so as to sandwich the mover magnet therebetween in the first direction, and the magnetic poles thereof are positioned so as to repel the mover magnet. The center of the first stator magnet fitted into the first opening and the center of the second stator magnet fitted into the second opening are offset in the same direction from the center of the through-hole.
B06B 1/04 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with electromagnetism
abb wherein M is one or more elements selected from the group consisting of Groups 3, 4, 5, 6, and 7, Q is one or more elements (except for O) selected from the group consisting of Groups 12, 13, 14, 15, and 16, a is 0 or more and 2 or less, and b is more than 0 and 2 or less; and a metal organic framework portion, wherein a pore volume with a pore size of 2.0 to 10 nm is 0.2 cm3/g or more, and a specific surface area is 210 m2/g or more.
H01G 11/24 - Electrodes characterised by structural features of the materials making up or comprised in the electrodes, e.g. form, surface area or porosityElectrodes characterised by the structural features of powders or particles used therefor
H01G 11/30 - Electrodes characterised by their material
H01G 11/36 - Nanostructures, e.g. nanofibres, nanotubes or fullerenes
Provided is a multilayer ceramic capacitor that can achieve both an improved high-temperature reliability and prevention of deterioration in capacitance. A multilayer ceramic capacitor according to the present invention comprises: a first outer layer part 121 disposed at the side of one first surface F1 in a stacking direction for an inner layer part 11; and a third outer layer part 123 disposed at the side of one third surface F3 in a first direction that is orthogonal to the stacking direction for the inner layer part 11. The first outer layer part 121 contains Mn, and the third outer layer part contains Mg. In cross sections parallel to the stacking direction and the first direction, the Mn content in inner dielectric layers decreases from the first surface F1 side toward the center in the stacking direction of the inner layer part 11, and the Mg content in internal dielectric layers decreases from the third surface side toward the center in the first direction of the inner layer part 11.
An acoustic wave filter includes a longitudinally coupled resonator acoustic wave filter including n IDT electrodes, and first and second reference-potential wiring lines each connected to a reference potential. The longitudinally coupled resonator acoustic wave filter includes first and second areas. The first area includes a first-end-positioned IDT electrode to a center-positioned IDT electrode in a direction in which the IDT electrodes are arranged side by side. The second area includes the center-positioned IDT electrode to a second-end-positioned IDT electrode in the direction in which the IDT electrodes are arranged side by side. Each of the IDT electrodes includes a first comb-shaped electrode and a second comb-shaped electrode interdigitated with each other. In each of the IDT electrodes, one of the first comb-shaped electrode and the second comb-shaped electrode is connected to the signal potential, and the other is connected to the reference potential.
A laminated film that includes: a porous resin layer having a first molded body of first liquid crystal polymer fibers; a first adhesive layer on the porous resin layer; a metal layer on the first adhesive layer on a side thereof opposite to the porous resin layer as viewed from the first adhesive layer; and a second adhesive layer on the porous resin layer on a side thereof opposite to the first adhesive layer as viewed from the porous resin layer.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
B32B 38/00 - Ancillary operations in connection with laminating processes
24.
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic circuit device is provided that includes a chip component, a circuit board, and a coating resin. The chip component is mounted on the circuit board, and a mounting surface of the circuit board is coated with the coating resin. A surface of an element substrate, a surface of an insulator layer, and a surface of the coating resin form a continuous surface. The electronic circuit device includes an insulator exposed portion where there is no element substrate due to exposure of the insulator layer when viewed in a stacking direction of the element substrate and the insulator layer. At least a part of a coil opening by a coil conductor is in a region of the insulator exposed portion.
An acoustic wave device includes a piezoelectric layer including first and second major surfaces, an IDT electrode on one of the first and second major surfaces, and including electrode fingers arranged in an arrangement direction, and a support facing the second major surface, and including an acoustic reflection portion facing the second major surface. The electrode fingers include a first electrode finger at an outermost position in the arrangement direction and a second electrode finger adjacent thereto. A product of a width, height, and density of one of the first and second electrode fingers is greater than a product of a width, height, and density of a central electrode finger. When the thickness of the piezoelectric layer is denoted by d and a center-to-center distance between adjacent electrode fingers is denoted by p, d/p is less than or equal to about 0.5.
An acoustic wave device includes a piezoelectric layer including a first main surface and a second main surface facing the first main surface in a first direction, an IDT electrode on at least one of the first main surface and the second main surface of the piezoelectric layer and including electrode fingers arranged in an arrangement direction, a reflector adjacent to the IDT electrode in the arrangement direction of the electrode fingers, a support that faces the second main surface of the piezoelectric layer and includes an acoustic reflection portion on a side of the second main surface of the piezoelectric layer, and a load film provided in a region overlapping with the reflector in a plan view from the first direction. When a thickness of the piezoelectric layer is d and a distance between centers of the adjacent electrode fingers is p, d/p is about 0.5 or less.
In a multilayer ceramic capacitor, a first internal electrode layer includes a first end surface-side exposed portion exposed to a first end surface side, a second internal electrode layer includes a second end surface-side exposed portion exposed to a second end surface side, and oxide films in the first and second end surface-side exposed portions. The oxide films include first and second oxide films respectively in the first and second end surface-side exposed portions. The first oxide films are provided at both ends in a width direction of the first end surface-side exposed portion, and the second oxide films are provided at both ends in the width direction of the second end surface-side exposed portion.
A multilayer electronic component includes a multilayer ceramic capacitor and an interposer. End portions of an interposer substrate in a width or length direction and end portions of joint electrodes in the width or length direction are located at a same or substantially a same position in the width direction. The joint electrodes have a plane-symmetric shape centered about an interposer symmetry plane which, in a middle of the width direction or the length direction, extend in the length or width direction and in the stacking direction. The multilayer ceramic capacitor has a plane-symmetric shape centered about a capacitor symmetry plane which, in the middle of the width direction or the length direction, extends in the length or width direction and in the stacking direction. The interposer symmetry plane and the capacitor symmetry plane are on the same or substantially the same plane.
A multilayer ceramic capacitor includes a multilayer body including first and second external electrodes respectively on third and fourth surfaces thereof. A dimension of the multilayer body in a first direction is shorter than a dimension of the multilayer body in a second direction. The multilayer body includes first and second internal electrodes respectively exposed on the third and fourth surfaces, and inner dielectric layers. The inner dielectric layers include at least Ca, Sr or Zr, and Li as main components. Li segregation exists in at least one of the first and second external electrodes, and a size of Li segregation in the at least one of the first and second external electrodes is larger than a size of Li segregation in the inner dielectric layers.
C04B 35/48 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zirconium or hafnium oxides or zirconates or hafnates
H01G 4/012 - Form of non-self-supporting electrodes
A sensor device is provided that includes an object; a metamaterial on the object to enhance transmission of acoustic waves through the object; a transducer that emits acoustic waves to the object and the metamaterial; and a receiver that receives the acoustic waves through the object and the metamaterial.
In this multilayer ceramic capacitor (1), a first external electrode (40A) is disposed on a first end surface (LS1). A second external electrode (40B) is disposed on a second end surface (LS2). Each of the first external electrode (40A) and the second external electrode (40B) has a Ni-plated layer (61A, 61B) and a Sn-plated layer (62A, 62B) positioned on the Ni-plated layer (61A, 61B). Each of the first external electrode (40A) and the second external electrode (40B) has a groove (63) extending in the lamination direction (T). A metal containing Ni is exposed on the bottom surface of the groove (63).
The present disclosure provides a vibration device and an imaging device capable of suppressing local application of a large vibration stress to a light-transmitting body if foreign matter adhering to a surface of the light-transmitting body is removed by vibrating the light-transmitting body. A vibration device (10) comprises: a light-transmitting body that transmits light of a prescribed wavelength; an internal vibration body (3) that contacts the light-transmitting body and vibrates the light-transmitting body; a piezoelectric element (5) provided to the internal vibration body (3); and an external vibration body (2) in which a holding part that holds the light-transmitting body has a cylindrical shape, and which covers the internal vibration body (3). In the portion of the internal vibration body (3) that contacts the light-transmitting body, the percentage of a value obtained by subtracting 1 from a ratio of a displacement amount of a second portion on an outer side to a displacement amount of a first portion on an inner side is 2.5% or less.
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
Provided is an inductor in which the binding strength in the vicinity of a boundary between a metal magnetic body and an internal conductor is increased. An inductor 1 according to the present disclosure comprises an element body 10 in which a metal magnetic layer ML containing metal magnetic particles DP and an internal conductor CL are laminated, wherein: the metal magnetic particles DP contain iron as a main component; a boundary vicinity region BR is provided toward the metal magnetic layer including a boundary between the metal magnetic layer ML and the internal conductor CL; and in the boundary vicinity region BR, the content ratio of a main component of the internal conductor CL to iron is 0.01-1.0.
Provided are a composite metal magnetic body having favorable insulation properties and a favorable L-value, an inductor, and a method of manufacturing an inductor. A composite metal magnetic body CP according to the present disclosure comprises metallic magnetic particles DP containing Fe and Si, and an oxide film OL coating the metallic magnetic particles DP, a plurality of metallic magnetic particles DP being bonded by the oxide film OL, wherein the metallic magnetic particles DP contain 511 to 1493 ppm of phosphorus, 23 to 4747 ppm of chromium, and 7 to 95 ppm of sodium with respect to the Fe and Si content in the metallic magnetic particles DP.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
35.
POWDER PROCESSING DEVICE AND POWDER PROCESSING SYSTEM
The present invention is capable of reducing a remaining amount of unprocessed powder and shortening powder processing time. This powder processing device comprises: a mesh part to which powder after processing is discharged; a wall part other than the mesh part; a rotary body which rotates around a shaft; and a spatula which is attached to the rotary body and rotates while in contact with the mesh part and the wall part. The shaft of the rotary body extends horizontally, and the spatula slides on the mesh part to press the powder against the mesh part.
The present invention achieves a planar array antenna having increased flexural strength. Provided is a planar array antenna 110 in which a plurality of radiating elements are arranged along one direction on a dielectric substrate. The planar array antenna 110 comprises a common ground conductor plate 113 which is provided so as to be shared by the plurality of radiating elements. Planar antenna regions 110a, which respectively correspond to the radiating elements 111, have a common ground conductor plate 113 that is provided in parallel in the arrangement direction of the plurality of radiating elements 111 and a pair of ground conductor patterns 112a, 112b that are connected via a via conductor VI. A first dummy pattern DP1a, DP1b is provided between ground conductor patterns 112a, 112b which are adjacent to each other in the arrangement direction.
H01Q 21/08 - Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along, or adjacent to, a rectilinear path
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
37.
COMPOSITE METAL MAGNETIC BODY, INDUCTOR, AND METHOD FOR MANUFACTURING COMPOSITE METAL MAGNETIC BODY
The present disclosure provides a composite metal magnetic body that further reduces deterioration of oxide films covering metal magnetic particles, an inductor, and a method for manufacturing the composite metal magnetic body. According to the present disclosure, composite metal magnetic bodies CP1-CP3 have metal magnetic particles DP and oxide films OL that cover the metal magnetic particles DP, and in each of the composite metal magnetic bodies CP1-CP3, a plurality of the metal magnetic particles DP are bonded to each other via the oxide films OL. Each oxide film OL comprises: an inner oxide film OLi that is in contact with the metal magnetic particle DP and has Si as a main component; and an outer oxide film OLo that is located outside the inner oxide film OLi, has an element that is more easily oxidized than Fe as a main component, and is an oxide containing Si.
H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/16 - Metallic particles coated with a non-metal
H01F 17/04 - Fixed inductances of the signal type with magnetic core
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
38.
COMPOSITE METAL MAGNETIC BODY, INDUCTOR, AND METHOD OF PRODUCING COMPOSITE METAL MAGNETIC BODY
Provided are a composite metal magnetic body, an inductor, and a method of producing a composite metal magnetic body that further reduce degradation of an oxide film covering metallic magnetic particles. A composite metal magnetic body CP1, CP2 of the present disclosure comprises metallic magnetic particles DP and an oxide film OL covering the metallic magnetic particles DP, a plurality of metallic magnetic particles DP being bonded together via the oxide film OL, wherein the oxide film OL comprises an inside oxide film OLi that is in contact with the metallic magnetic particles DP and composed mainly of Si, and an outside oxide film OLo that is located on the outside of the inside oxide film OLi and contains either Al or Ti, and Zr.
H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/16 - Metallic particles coated with a non-metal
H01F 17/04 - Fixed inductances of the signal type with magnetic core
H01F 37/00 - Fixed inductances not covered by group
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
According to the present disclosure, a first diode circuit includes one diode or a plurality of diodes connected in series, and an anode-side end is connected to an input node or an output node of a power amplifier or an inter-stage node of a cascode connection circuit of a power amplifier including a plurality of cascode-connected transistors. A drain of a first transistor, which is an NMOSFET, is connected to a cathode-side end of the first diode circuit, and a power supply voltage is applied to the drain via a first resistance element. A first feedback voltage and a first reference voltage generated on the basis of the power supply voltage of the first transistor and the voltage of the cathode-side end of the first diode circuit are input to a first operational amplifier, and a first control voltage generated on the basis of the difference between the first feedback voltage and the first reference voltage is applied to a gate of the first transistor. A control circuit is configured to change the first reference voltage input to the first operational amplifier.
H03F 1/52 - Circuit arrangements for protecting such amplifiers
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
In the present invention, a high-frequency signal is input into a first transistor. A plurality of second transistors are cascode-connected to the first transistor. A bias circuit supplies a bias to each of the plurality of second transistors. A power supply wiring applies a voltage-variable power supply voltage to a cascode connection circuit including the first transistor and the plurality of second transistors. The bias circuit includes at least one voltage regulator, and supplies a bias voltage, which is generated on the basis of the voltage of the power supply wiring and the voltage of a voltage control node of which the voltage is controlled by the voltage regulator, to at least one of the plurality of second transistors.
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
H03F 1/52 - Circuit arrangements for protecting such amplifiers
This film capacitor comprises a capacitor element 10 which includes an element body 20 having a first end surface 21 and a second end surface 22 positioned at both ends in a length direction and a side surface 23 connecting the first end surface 21 and the second end surface 22, a first external electrode 31 provided on the first end surface 21 of the element body 20, and a second external electrode 32 provided on the second end surface 22 of the element body 20, a first lead-out terminal 61 which comprises a first resin member 71 disposed so as to surround a part of the outer periphery of the first lead-out terminal 61, and which is connected to the first external electrode 31, a second lead-out terminal 62 which comprises a second resin member 72 disposed so as to surround a part of the outer periphery of the second lead-out terminal 62, is connected to the second external electrode 32, and is routed to the first external electrode 31 side along the side surface 23 of the element body 20, and an exterior body 40 which is made of a laminate film 40 including a resin layer, seals the capacitor element 10 such that the resin layer is disposed around the capacitor element 10, and has a welded portion 42 where a first part 42 and a second part 42, which are parts of the resin layer located in opposing positions, are welded together, wherein: the welded portion includes a first lead-out port 51, which is a part where the first part and the second part are welded to each other with the first resin member 71 interposed therebetween, and a second lead-out port 52, which is a part where the first part and the second part are welded to each other with the second resin member 72 interposed therebetween; the first external electrode 31 and the second lead-out terminal 62 are insulated from each other by the second resin member 72; and the tip end of the first lead-out terminal 61 and the tip end of the second lead-out terminal 62 project from the same side edge of the exterior body 40.
Disclosed is a carbon dioxide adsorption material which internally contains an amine compound in pores of a porous material. The carbon dioxide adsorption material has a peak pore diameter of not less than 0.4 nm but less than 10 nm, a peak pore volume of 0.003 cm3/g/nm or more, and an average pore diameter of 1 nm to 30 nm inclusive.
B01J 20/22 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising organic material
B01D 53/14 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by absorption
B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
B01J 20/30 - Processes for preparing, regenerating or reactivating
Provided is a multilayer ceramic capacitor that makes it possible to improve high-temperature load reliability by suppressing insulation deterioration due to dielectric layers. A multilayer ceramic capacitor 10 according to the present invention comprises: a multilayer body that includes a plurality of dielectric layers and a plurality of internal electrode layers; and an external electrode that is provided on an outer surface of the multilayer body, and is electrically connected to the plurality of internal electrode layers at a portion in which the plurality of internal electrode layers are exposed in the multilayer body. The internal electrode layers include a plurality of first internal electrode layers and a plurality of second internal electrode layers that are exposed on different surfaces of the multilayer body, and the external electrode includes a first external electrode that is electrically connected to the first internal electrode layers and a second external electrode that is electrically connected to the second internal electrode layers. The internal electrode layers contain Ni as a main component, and an interface region that contains at least one oxide of Zn, Fe, Sb, In, Mn, Ge, Sn, Mo, W, Ga, Cr, or V is disposed in the vicinity of the interface between a first internal electrode layer and a dielectric layer and in the vicinity of the interface between a second internal electrode layer and a dielectric layer.
Provided are a multilayer ceramic capacitor and a method for using the multilayer ceramic capacitor that make it possible to improve high-temperature load reliability by suppressing insulation deterioration due to dielectric layers. A multilayer ceramic capacitor 10 according to the present invention comprises: a multilayer body that includes a plurality of dielectric layers and a plurality of internal electrode layers; and an external electrode that is provided on an outer surface of the multilayer body and is electrically connected to the plurality of internal electrode layers at a portion in which the plurality of internal electrode layers are exposed in the multilayer body. The internal electrode layers include a plurality of first internal electrode layers and a plurality of second internal electrode layers that are exposed on different surfaces of the multilayer body, and the external electrode includes a first external electrode that is electrically connected to the first internal electrode layers and a second external electrode that is electrically connected to the second internal electrode layers. The internal electrode layers have Ni as a main component, and a polarity based on an application direction of a voltage that is applied between the first external electrode and the second external electrode is determined so that the first internal electrode layers are positive electrodes and the second internal electrode layers are negative electrodes. An interface region that contains at least one metal of Pd, Os, Sb, Pt, Ir, Au, and Zn is disposed in the vicinity of the interface between a first internal electrode layer and a dielectric layer.
Provided are a multilayer ceramic capacitor that achieves an increase in high-temperature load reliability through a reduction in insulation deterioration due to dielectric layers, and a method for using the multilayer ceramic capacitor. A multilayer ceramic capacitor 10 according to the present invention comprises: a multilayer body including a plurality of dielectric layers and a plurality of internal electrode layers; and external electrodes provided on outer surfaces of the multilayer body and electrically connected to the plurality of internal electrode layers at portions where the plurality of internal electrode layers are exposed on the multilayer body. The internal electrode layers include a plurality of first internal electrode layers and a plurality of second internal electrode layers that are exposed on different surfaces of the multilayer body, and the external electrodes include a first external electrode electrically connected to the first internal electrode layers and a second external electrode electrically connected to the second internal electrode layers. The internal electrode layers contain Ni as a main component, and have polarities defined on the basis of the direction in which voltage is applied between the first external electrode and the second external electrode, such that the first internal electrode layers serve as positive electrodes and the second internal electrode layers serve as negative electrodes. First interface regions containing at least one metal selected from Pd, Os, Sb, Pt, Ir, Au, and Zn are provided in the vicinity of interfaces between the first internal electrode layers and the dielectric layers. Second interface regions containing at least one metal selected from Ge, Cu, and Ag are provided in the vicinity of interfaces between the second internal electrode layers and the dielectric layers.
Provided is a solid-state battery that comprises a positive electrode part that includes a positive electrode active material, a negative electrode part that includes a negative electrode active material, and a solid electrolyte part. At least one of the positive electrode part and the solid electrolyte part includes a first solid electrolyte. The solid-state battery also comprises an interposing layer that is interposed between the positive electrode active material and the first solid electrolyte and contacts both the positive electrode active material and the first solid electrolyte. The first solid electrolyte includes Li, M, S, and O and has at least a crystal phase that has a tetragonal crystal structure. M is one or more elements that are selected from group 14 and group 15 and include at least Sn. The molar ratio of O to M is 0.1–3.0. The thickness of the interposing layer is less than 500 nm.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
C01B 17/98 - Other compounds containing sulfur and oxygen
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
H01M 4/36 - Selection of substances as active materials, active masses, active liquids
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
A solid-state battery according to one embodiment of the present disclosure provides a sulfide solid electrolyte that contains at least Li, Sn, S, and O, and has a tetragonal crystal structure.
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
H01B 1/10 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances sulfides
The present disclosure provides a solid electrolyte having higher ion conductivity both before and after exposure to the atmosphere. The present disclosure relates to a solid electrolyte containing, in a portion thereof, a glassy substance having an NZSP composition containing Na, Zr, Si, P, and O.
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
C03C 10/04 - Silicate or polysilicate crystalline phase, e.g. mullite, diopside, sphene, plagioclase
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 10/054 - Accumulators with insertion or intercalation of metals other than lithium, e.g. with magnesium or aluminium
Provided is a multilayer ceramic capacitor which has further improved reliability. When the crystal particles (50) included in a dielectric layer of a multilayer ceramic capacitor (1) are divided into a first region (51) in which the rare earth element concentration is less than a first value and a second region (52) in which said concentration is equal to or greater than the first value, the first region (51) is surrounded by the second region (52), a rare earth element-concentrated region (53) is present in the second region (52), and the second region (52) is present between the rare earth element-concentrated region (53) and a grain boundary (30) of the crystal particles (50).
A transport device (10) is provided with a transport body (20), a supply unit, a drive unit, a discharge unit, a downstream guide unit (110), and a removal unit (120). The discharge unit is located on the downstream side (C2) with respect to the supply unit on a circulation path (CR) and is capable of discharging an object being transported to the outside on the positive direction (R1) side of a placement surface (21). The downstream guide unit (110) is arranged so as to face the placement surface (21), and is located, on the circulation path (CR), on the downstream side (C2) with respect to the discharge unit and on the upstream side (C1) with respect to the supply unit. If the placement surface (21) is viewed in plan view, a downstream guide edge unit (DE) intersects the circulation path (CR) and extends so as to face farther towards the negative direction (R2) side the farther it moves in the traveling direction of the circulation path (CR). The removal unit (120) is capable of collecting the object being transported located at the end of the downstream guide edge unit (DE) on the negative direction (R2) side.
A multilayer ceramic capacitor 1 is provided with: an element body 10 that comprises a plurality of dielectric ceramic layers 20 and a plurality of internal electrode layers 30 which are stacked in the thickness direction T; and external electrodes 11, 12 that are provided on a surface of the element body 10 and are electrically connected to the internal electrode layers 30. The dielectric ceramic layers 20 contain a perovskite oxide as a main component. The perovskite oxide contains at least one of barium (Ba), calcium (Ca), and strontium (Sr), at least one of titanium (Ti) and zirconium (Zr), and at least one of rare earth elements (Re). With respect to Re/(Ti + Zr) ratio of each pixel of an element mapping image in terms of atom% of the dielectric ceramic layer 20 obtained by scanning transmission electron microscopy-energy dispersive X-ray spectroscopy analysis (STEM-EDS analysis), if the range of 0 ≤ Re/(Ti + Zr) < 2 is divided by a section width of 0.002, the number of pixels belonging to each section is counted, and the frequency of the number of pixels is converted to a relative frequency so that the cumulative frequency of the range of 0 ≤ Re/(Ti + Zr) < 2 becomes 1, the concentration ratio variation of the Re/(Ti + Zr) ratio is defined by the following a1 to a4. a1: The section to which the arithmetic mean of the Re/(Ti + Zr) ratios in the dielectric ceramic layer (hereinafter referred to as the concentration ratio arithmetic mean of Re/(Ti + Zr) ratios) belongs is defined as the mean concentration ratio belonging section of Re/(Ti + Zr) ratio. a2: The relative frequency corresponding to a half of the relative frequency of the mean concentration ratio belonging section of Re/(Ti + Zr) ratio is defined as the half value of the Re/(Ti + Zr) ratio. a3: The value obtained by multiplying the number of successive sections (excluding the section of 0 ≤ Re/(Ti + Zr) < 0.002) extending to the right and left with the mean concentration ratio belonging section of Re/(Ti + Zr) ratio as the point of origin among the sections in which the relative frequency is not less than the half value of the Re/(Ti + Zr) ratio by the section width of 0.002 is defined as the half-value width of the Re/(Ti + Zr) ratio. a4: The value obtained by dividing the half-value width of the Re/(Ti + Zr) ratio by the concentration ratio arithmetic mean of Re/(Ti + Zr) ratios is defined as the concentration ratio variation of the Re/(Ti + Zr) ratio. In addition, with respect to (Ba + Ca + Sr)/(Ti + Zr) ratio of each pixel of an element mapping image in terms of atom% of the dielectric ceramic layer obtained by STEM-EDS analysis, if the range of 0.3 ≤ (Ba + Ca + Sr)/(Ti + Zr) < 2.3 is divided by a section width of 0.02, the number of pixels belonging to each section is counted, and the frequency of the number of pixels is converted to a relative frequency so that the cumulative frequency of the range of 0.3 ≤ Re/(Ti + Zr) < 2.3 becomes 1, the concentration ratio variation of the (Ba + Ca + Sr)/(Ti + Zr) ratio is defined by the following b1 to b4. b1: The section to which the arithmetic mean of the (Ba + Ca + Sr)/(Ti + Zr) ratios in the dielectric ceramic layer (hereinafter referred to as the concentration ratio arithmetic mean of (Ba + Ca + Sr)/(Ti + Zr) ratios) belongs is defined as the mean concentration ratio belonging section of (Ba + Ca + Sr)/(Ti + Zr) ratio. b2: The relative frequency corresponding to a half of the relative frequency of the mean concentration ratio belonging section of (Ba + Ca + Sr)/(Ti + Zr) ratio is defined as the half value of the (Ba + Ca + Sr)/(Ti + Zr) ratio. b3: The value obtained by multiplying the number of successive sections extending to the right and left with the mean concentration ratio belonging section of (Ba + Ca + Sr)/(Ti + Zr) ratio as the point of origin among the sections in which the relative frequency is not less than the half value of the (Ba + Ca + Sr)/(Ti + Zr) ratio
CERAMIC POWDER FOR MULTILAYER CERAMIC CAPACITOR, METHOD FOR PRODUCING CERAMIC POWDER FOR MULTILAYER CERAMIC CAPACITOR, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR
This ceramic powder for a multilayer ceramic capacitor is composed of a perovskite-type oxide. The perovskite-type oxide contains barium (Ba), titanium (Ti), and a rare earth (Re) element, and may additionally contain at least one of calcium (Ca) and strontium (Sr). The ceramic powder for a multilayer ceramic capacitor has a BET specific surface area of 4.0 m2/g to 21.0 m2/g, and has a Re/Ti weight concentration ratio distribution in which the arithmetic mean value μ is 0.02-0.08 wt% and the variation σ is 0.15 or less.
Provided is a multilayer ceramic capacitor having further improved reliability. A multilayer ceramic capacitor 1 comprises: a laminate 2 including a dielectric layer 5 and an internal electrode layer 6; and a plurality of external electrodes provided on the surface of the laminate 2 and connected to a part of the internal electrode layer 6, wherein the titanium concentration at an interface 50 between the dielectric layer 5 and the internal electrode layer 6 is higher than the titanium concentration of the dielectric layer 5.
The present invention comprises a part (110) to be vibrated, and at least one vibrator (120). The at least one vibrator (120) is bonded to the part (110) to be vibrated and vibrates the part (110) to be vibrated. The at least one vibrator (120) is configured by laminating a piezoelectric element (121), a pair of resin layers (125, 126) that sandwich the piezoelectric element (121) therebetween, and a pair of metal layers (127, 128) that sandwich the piezoelectric element (121) and the pair of resin layers (125, 126) therebetween. The at least one vibrator (120) vibrates the part (110) to be vibrated in a resonance mode.
Provided is a solid electrolyte having a NASICON-type crystal structure and containing sodium (Na), zirconium (Zr), silicon (Si), phosphorus (P), and oxygen (O). A portion of Zr is substituted by one or more elements selected from the group consisting of vanadium (V), niobium (Nb), tantalum (Ta), bismuth (Bi), tungsten (W), and molybdenum (Mo).
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 10/054 - Accumulators with insertion or intercalation of metals other than lithium, e.g. with magnesium or aluminium
H01B 1/06 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances
C04B 35/447 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on phosphates
H01B 1/08 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances oxides
H01M 4/131 - Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 10/054 - Accumulators with insertion or intercalation of metals other than lithium, e.g. with magnesium or aluminium
In a secondary battery, a first end face of an electrode wound body and a first electrode current collector plate are joined to each other by one or more first joint parts. The one or more first joint parts each have a meander shape in a plan view. The meander shape includes multiple first linear parts and multiple first turning parts. In each of the one or more first joint parts, a length in a winding direction of the electrode wound body from an a-th one to an (a+1)th one of the first turning parts counted from a winding center of the electrode wound body is longer than a length in the winding direction from a first one to a second one of the first turning parts, of corresponding one of the first joint parts, counted from the winding center.
A plated metal film is formed on a wire placement surface of a terminal electrode. The plated metal film includes a nickel layer serving as a base and a tin layer as a surface layer. The wire extends along the wire placement surface and is bonded to the wire placement surface, in a connection portion between the wire and the wire placement surface, by a bonding member that contains a metal, such as tin, derived from the plated metal film. A fillet that contains a metal, such as tin, derived from the plated metal film is formed so as to fill in the gap between the wire and the wire placement surface at the end of the wire placement surface from which the wire extends toward a winding core portion.
A filter device is provided that includes a acoustic resonator having a substrate; a piezoelectric layer coupled to the substrate by one or more intermediate layers; and a conductor pattern on a surface of the piezoelectric layer, the conductor pattern including a pair of busbars having a plurality of interleaved fingers extending therefrom to form an interdigital transducer (IDT). The filter device further includes a dielectric capacitor electrically coupled in series to the acoustic resonator. The dielectric capacitor includes a dielectric layer on a surface of a first busbar of the pair of busbars and at least one metal layer on a surface of the dielectric layer, such that the dielectric layer is between the first busbar and the at least one metal layer to form the dielectric capacitor.
An electrical device having a capacitor including: a bottom electrode; a dielectric structure extending conformally on the bottom electrode and comprising dielectric layers, wherein the dielectric structure extends only within a central region of the bottom electrode; a top electrode extending conformally on the dielectric structure; and a passivation layer extending on the bottom electrode within a peripheral region of the bottom electrode, the peripheral region surrounding the dielectric structure and extending up to lateral edges of the electrical device, and wherein: the lateral edges of each of the dielectric layers are covered at least by the passivation layer.
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
An electronic stethoscope includes a casing, a sound sensor that is provided at the casing and that obtains a sound of an organism and converts the sound of the organism into an electrical signal, light-emitting elements that are provided in the casing and that have respective light-emitting surfaces that emit light beams; and a light-guiding member that guides the light beams of the light-emitting elements to outside of the casing. The light-guiding member has an inner surface that includes light-receiving portions that face the light-emitting surfaces and upon which the light beams L of the light-emitting elements are incident, and an outer surface that is exposed to the outside of the casing by extending along an outer peripheral surface of the casing, and that radiates to the outside of the casing the light beams that are incident upon the outer surface through the light-receiving portions.
A61B 90/00 - Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups , e.g. for luxation treatment or for protecting wound edges
A multiplexer includes a common connection terminal, and transmitting and receiving filters commonly connected to the common connection terminal. The transmitting and receiving filters each include a resonator. The resonators of the transmitting and receiving filters share a piezoelectric substrate. The resonator located closest to the common connection terminal in terms of a circuit configuration of the transmitting filter defines a series-arm resonator. The resonator located closest to the common connection terminal in terms of a circuit configuration of the receiving filter defines a longitudinally coupled resonator acoustic wave filter. The series-arm resonator of the transmitting filter includes an IDT electrode including a plurality of electrode fingers. The first longitudinally coupled resonator acoustic wave filter of the receiving filter includes a plurality of IDT electrodes each including a plurality of electrode fingers.
A radio-frequency circuit includes first filter having a pass band including the transmit band of communication band A and a second filter having a pass band including the receive band of communication band B. The communication bands A and B are usable for simultaneous communication. The transmit band of the communication band A includes a sub-band X that overlaps the receive band of the communication band B and a sub-band Y that does not overlap the receive band of the communication band B. The receive band of the communication band B includes the sub-band X and a sub-band Z that does not overlap the transmit band of the communication band A. The pass band of the first filter is switchable between a first pass band including the sub-band X and the sub-band Y and a second pass band, narrower than the first pass band, including the sub-band Y.
An acoustic wave device includes a piezoelectric layer including first and second main surfaces facing in a first direction, an IDT electrode on at least one of the first or second main surface and including electrode fingers arranged in an arrangement direction, a support facing the second main surface and including an acoustic reflection portion, and a protective film on at least one of the first or second main surface. In a region that overlaps, in plan view in the first direction, a first of the electrode fingers outermost in the arrangement direction, the protective film includes a surface of a first step where a side surface of the protective film is exposed in a direction intersecting an extending direction of the first electrode finger. When d is a thickness of the piezoelectric layer and p is a center-to-center distance between adjacent electrode fingers, d/p is about 0.5 or less.
A capacitor mounting board includes a substrate, (M×N) power lands, and (M−1)×(N−1) capacitors each in a region surrounded by (2×2) adjacent power lands. Each of the capacitors includes first and second main surfaces, first and third side surfaces, and second and fourth side surfaces. Each of the capacitors is at least on the first main surface, includes electrode terminals, has a rectangular or substantially rectangular shape at the first and second main surfaces, and is arranged such that an edge of the first capacitor main surface on the first capacitor side surface side and an edge of the first capacitor main surface on the third capacitor side surface side are inclined at about 45±5 degrees with respect to a straight line extending in a first direction on the second main surface of the substrate.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
67.
MAGNETIC MATERIAL, MAGNETIC MATERIAL MANUFACTURING METHOD, AND INDUCTOR
A magnetic material has magnetic powder containing a first magnetic particle and a second magnetic particle smaller in particle diameter than the first magnetic particle, and a resin. At least part of an outer peripheral surface of the first magnetic particle has a binding layer that contains a silane coupling agent.
H01F 1/147 - Alloys characterised by their composition
H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
H01F 3/08 - Cores, yokes or armatures made from powder
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
A multilayer ceramic capacitor (1), wherein a first external electrode (40A) and a second external electrode (40B) have first grooves (72A3, 72B3) extending in a layer stacking direction (T). In the first grooves (72A3, 72B3), a first base electrode layer (50A) and a second base electrode layer (50B) are directly connected to a first plating layer (70A) and to a second plating layer (70B). One end of each of the first grooves (72A3, 72B3) is open on a first main surface (TS1) side, and the other end of each of the first grooves (72A3, 72B3) terminates within a first end face (LS1) or within a second end face (LS2).
The present invention provides a composite metal magnetic body having insulation characteristics and an L value that are suitable, an inductor, and a method for manufacturing the inductor. A composite metal magnetic body CP according to the present disclosure comprises metal magnetic particles DP containing Fe and Si, and an oxide film OL covering the metal magnetic particles DP, wherein a plurality of the metal magnetic particles DP are bonded to one another via the oxide film OL. In relation to the content of Fe and Si in the metal magnetic particles DP, the metal magnetic particles DP contain phosphorus in the range of 23-392 ppm, chromium in the range of 24-4739 ppm, and calcium in the range of 22-968 ppm.
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
The purpose of the present invention is to provide an active clamp circuit of a power amplifier including a bias circuit. A first diode circuit includes a plurality of diodes connected in multiple stages, and an anode-side end thereof is connected to an output node of the power amplifier. A base or a gate of a clamp transistor is connected to a cathode-side end of the first diode circuit, and a collector or a drain is connected to a bias circuit, such that a bias current of the power amplifier is suppressed. A control circuit generates a reference voltage having a variable voltage value. A voltage regulator is connected to an emitter or a source of the clamp transistor and maintains the voltage of the emitter or the source of the clamp transistor at a voltage based on the reference voltage.
An antenna module (100) comprises: a first substrate (131) having a first main surface (11) and a second main surface (12) facing each other; a second substrate (132) disposed on the second main surface (12) side; a third substrate (133) disposed between the first substrate (131) and the second substrate (132); a patch antenna (141) disposed on the first substrate (131) along the first main surface (11); a first dipole antenna (151) disposed so as to intersect the first main surface (11); and a second dipole antenna disposed on the third substrate (133) along the surface of the third substrate (133) facing the second main surface (12). The first dipole antenna (151) has a first element (1511) and a second element (1512). The first element (1511) is disposed across the first substrate (131) and the third substrate (133), and the second element (1512) is disposed across the second substrate (132) and the third substrate (133).
H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
H01P 5/10 - Coupling devices of the waveguide type for linking lines or devices of different kinds for coupling balanced lines or devices with unbalanced lines or devices
H01Q 9/16 - Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
H01Q 21/29 - Combinations of different interacting antenna units for giving a desired directional characteristic
72.
POWER CONVERSION DEVICE AND PROGRAM FOR POWER CONVERSION DEVICE
This power conversion device comprises a first rectifier circuit, a first snubber circuit, a second rectifier circuit, a second snubber circuit, and a control unit. The first snubber circuit has a first snubber capacitor and a first snubber switch. The second snubber circuit has a second snubber capacitor and a second snubber switch. The control unit controls the first snubber switch and the second snubber switch so that the first snubber switch and the second snubber switch are periodically turned on and off in synchronization repeatedly regardless of the inter-terminal voltage of the first snubber capacitor and the inter-terminal voltage of the second snubber capacitor.
H02M 7/12 - Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
According to the present invention, a high-frequency signal is input to a first transistor. At least one second transistor is cascode-connected to the first transistor. A bias circuit supplies a bias to the second transistor. Power supply wiring applies a voltage-variable power supply voltage to a cascode connection circuit including the first transistor and the second transistor. The bias circuit includes a voltage regulator and a first resistor voltage divider circuit. The first resistor voltage divider circuit supplies a bias voltage, divided on the basis of the output voltage of a voltage control node of which the voltage is being controlled by the voltage regulator and the power supply voltage of the power supply wiring, to the second transistor.
H03F 1/22 - Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
H03F 1/02 - Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
74.
SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SOLID ELECTROLYTIC CAPACITOR
This solid electrolytic capacitor comprises a sheet laminate, a first resin, a second resin, and an external electrode. The sheet laminate is formed by alternately stacking a plurality of flat-film capacitor elements and a plurality of flat-film cathodic electrode foils. The first resin is disposed in an interlayer space between the plurality of flat-film capacitor elements and the plurality of flat-film cathodic electrode foils in the sheet laminate. The second resin encapsulates the sheet laminate. The external electrode is connected to the sheet laminate. Each of the flat-film capacitor elements further comprises a flat-film anodic electrode foil, a dielectric layer formed on the surface of the anodic electrode foil, a third resin formed on the surface of the dielectric layer, and a solid electrolyte layer formed in an area defined by the third resin. The first resin is in contact with the external electrode, the second resin, the flat-film capacitor elements, and the flat-film cathodic electrode foils.
Provided are a multilayer ceramic capacitor that can improve high temperature loading reliability by suppressing insulation degradation due to a dielectric layer, and a method for using the multilayer ceramic capacitor. A multilayer ceramic capacitor 10 according to the present invention comprises: a laminate that comprises a plurality of dielectric layers and a plurality of internal electrode layers; and an external electrode that is provided on the outer surface of the laminate and that is electrically connected to the plurality of internal electrode layers at a portion where the plurality of internal electrode layers are exposed on the laminate. The internal electrode layers have a plurality of first internal electrode layers and a plurality of second internal electrode layers that are exposed on different surfaces of the laminate. The external electrode has a first external electrode that is electrically connected to the first internal electrode layers and a second external electrode that is electrically connected to the second internal electrode layers. The internal electrode layers have Ni as the main component thereof. An interface region that contains an oxide of at least one element from among Zn, Fe, Sb, In, Mn, Ge, Sn, Mo, W, Ga, Cr, and V is disposed near the interface between a first internal electrode layer and a dielectric layer.
Provided are a multilayer ceramic capacitor capable of improving high-temperature load reliability by suppressing insulation deterioration caused by a dielectric layer, and a method of using the multilayer ceramic capacitor. A multilayer ceramic capacitor 10 according to the present invention comprises: a multilayer body including a plurality of dielectric layers and a plurality of internal electrode layers; and an external electrode provided on the outer surface of the multilayer body and electrically connected to the plurality of internal electrode layers at a portion where the plurality of internal electrode layers are exposed in the multilayer body. The internal electrode layers include a plurality of first internal electrode layers and a plurality of second internal electrode layers exposed on different surfaces of the multilayer body. The external electrode includes a first external electrode electrically connected to the first internal electrode layers and a second external electrode electrically connected to the second internal electrode layers. The internal electrode layers have Ni as the main component thereof. In the internal electrode layers, the polarity based on the application direction of a voltage applied between the first external electrode and the second external electrode is determined such that the first internal electrode layers serve as a positive electrode and the second internal electrode layers serve as a negative electrode. An interface region containing at least one metal of Ge, Cu, Ag, Ir, Pt, and Au is disposed in the vicinity of an interface between the second internal electrode layer and the dielectric layer.
A touch sensor comprises: a piezoelectric film that has a first main surface and a second main surface arranged in the vertical direction; a plurality of signal electrodes that are provided on the first main surface; and a reference electrode that is provided on the second main surface and overlaps each of the plurality of signal electrodes as seen in the vertical direction. The piezoelectric film includes a piezoelectric body that is stretched in a stretching direction. The signal electrodes each have a dead zone in which an electric charge generated in the signal electrode becomes zero. The plurality of signal electrodes are arranged at intervals from each other along a lateral direction that is orthogonal to the vertical direction and/or a longitudinal direction that is orthogonal to both the vertical direction and the lateral direction. The stretching direction is parallel to the lateral direction or the longitudinal direction.
G06F 3/0354 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H10N 30/30 - Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
An actuator (10) comprises a piezoelectric element (21), a plate member (31), and a support body (ST1). The piezoelectric element (21) has a surface (F211) and a surface (F212) facing each other. The plate member (31) has a surface (F311) and a surface (F312) facing each other, and the surface (F312) is disposed on the surface (F211). The plate member (31) is fixed to the support body (ST1) within a predetermined distance range in a direction from the outer edges of the surface (F311) and the surface (F312) toward the inside. The inner peripheral surface (FiST1) of the support body (ST1) is circular. The plate member (31) is provided with a slot (313). The slot (313) is disposed at a position closer to the center of the plate member (31) than a portion fixed to the support body (ST1). The slot (313) is configured from a recess that is recessed from the surface (F311) or the surface (F312), or a penetration part that penetrates between the surface (F311) and the surface (F312).
An underwater environment sensor according to the present invention comprises a component measurement sensor, a position detection sensor, a movement detection sensor, an underwater disposition detection sensor, and a recording unit. The component measurement sensor measures an underwater to-be-measured component. The position detection sensor detects the two-dimensional position, of the component measurement sensor, in a planar direction in the atmosphere, and generates first position information. The movement detection sensor detects movement of the component measurement sensor that is underwater, and generates movement information. The underwater disposition detection sensor detects that the component measurement sensor is disposed underwater. The recording unit records a measurement result of the component to be measured, the first position information, and the movement information. The component measurement sensor starts measuring the component to be measured from an underwater disposition timing at which underwater disposition is detected. The recording unit records the first position information immediately before the underwater disposition timing. The recording unit records the movement information and the measurement result of the component to be measured starting from the underwater disposition timing.
G01C 21/20 - Instruments for performing navigational calculations
G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
Provided is an elastic wave device capable of suppressing deterioration of resonance characteristics. This elastic wave device comprises: a support member having a support substrate and an acoustic multilayer film; a piezoelectric layer having a thickness in a first direction; a functional electrode provided on at least one of the upper side and the lower side of the piezoelectric layer; a first electrode provided on at least one of the upper side and the lower side of the piezoelectric layer and having a first potential; a second electrode provided on at least one of the upper side and the lower side of the piezoelectric layer and having a second potential different from the first potential; and a protection part provided on the upper side of the support substrate. The acoustic multilayer film includes a high acoustic impedance layer and a low acoustic impedance layer. The first electrode and the second electrode are adjacent to each other. In plan view from the first direction, a non-piezoelectric region in which the piezoelectric layer is not provided is present between the first electrode and the second electrode. In the non-piezoelectric region, the protection part covers the surface of at least one low acoustic impedance layer.
Provided is a conductive paste capable of greater suppression of blister generation. This conductive paste contains copper powder, glass powder, acrylic resin, and a solvent, wherein a shrinkage temperature T1 of the copper powder is 350°C or more, a thermal decomposition end temperature T2 of the acrylic resin in the conductive paste is 310°C-385°C, and the difference (T2−T3) between the thermal decomposition end temperature T2 and a thermal decomposition start temperature T3 of the acrylic resin in the conductive paste is 159°C or more. In other words, the difference (T2−T1) between the thermal decomposition end temperature T2 and the shrinkage temperature T1 is 35°C or less, and the difference (T2−T3) between the thermal decomposition end temperature T2 and the thermal decomposition start temperature T3 of the acrylic resin in the conductive paste is 159°C or more.
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
Provided are a conductive paste enabling suppression of occurrence of blisters while allowing a lower sintering temperature, and a method for manufacturing a multilayer ceramic capacitor using the conductive paste. The conductive paste contains: a surface-treated copper powder including a copper powder and a surface treatment agent layer covering the surface of the copper powder; a binder; and a glass powder. The sintering completion temperature T1 of the surface-treated copper powder is 700°C or lower. The difference (T1-T2) between the sintering completion temperature T1 and the temperature T2 at which the surface treatment agent layer degreases is between 100°C and 350°C (both inclusive). The temperature T3 at which the weight reduction rate of the binder is maximized is lower than the temperature T2.
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
A multilayer ceramic capacitor 1 comprises: an element body 10 including a plurality of dielectric ceramic layers 20 and a plurality of internal electrode layers 30 laminated in the thickness direction T; and external electrodes 11, 12 provided on the surface of the element body 10 and electrically connected to the internal electrode layers 30. The element body 10 includes an effective part 10B in which the plurality of internal electrode layers 30 overlap each other in the thickness direction T with the dielectric ceramic layers 20 interposed therebetween. The dielectric ceramic layers 20 include crystal particles 40 composed of a perovskite composite oxide. The perovskite composite oxide includes a rare earth element (Re) and barium (Ba), and further includes at least one of calcium (Ca) and strontium (Sr) and at least one of titanium (Ti) and zirconium (Zr). In the dielectric ceramic layer 20 located in the effective part 10B, when a region surrounded by grain boundaries 41 of the crystal particles 40 is defined as a grain 42, the rare earth element (Re) exists in a state of a solid solution in at least a central region of the grain 42. In the peak intensities measured by an X-ray diffraction method with respect to the dielectric ceramic layer 20 located in the effective part 10B, when Ic is defined as the peak intensity on the (400) plane corresponding to a cubic perovskite composite oxide and It is defined as the peak intensity on the (004) plane corresponding to a tetragonal perovskite composite oxide, 1
A multilayer ceramic capacitor 1 comprises: a base body 10 including a plurality of dielectric ceramic layers 20 and a plurality of internal electrode layers 30 stacked in the thickness direction T; and external electrodes 11, 12 provided on a surface of the base body 10 and electrically connected to the internal electrode layers 30. The dielectric ceramic layers 20 contain a perovskite-type oxide as a main component. The perovskite-type oxide includes at least one of barium (Ba), calcium (Ca), and strontium (Sr), at least one of titanium (Ti) and zirconium (Zr), and at least one rare earth element (Re). As concerns a Re/(Ti + Zr) ratio of each pixel in an element mapping image converted into atom% obtained by scanning transmission electron microscope-energy dispersive X-ray spectroscopy (STEM-EDS analysis) of the dielectric ceramic layers 20, when the range of 0 ≤ Re/(Ti + Zr) < 2 is divided by a section width of 0.002, the number of pixels belonging to each section is counted, and a frequency of the number of pixels is converted into a relative frequency so that a cumulative frequency of 0 ≤ Re/(Ti + Zr) < 2 is 1, an arithmetic mean of the Re/(Ti + Zr) ratio in the dielectric ceramic layers 20 (hereinafter, the concentration ratio arithmetic mean) is 0.03-0.10, a relative frequency in the initial section of 0 ≤ Re/(Ti + Zr) < 0.002 is 0.010 or less, and asymmetry of a frequency distribution of the Re/(Ti + Zr) ratio defined as ((A − X) + 0.001)/((Y − A) − 0.001) is 1.00 or less, where A is a starting point of a section at which the cumulative frequency first exceeds 0.5, X is a starting point of a section at which the cumulative frequency first exceeds 0.05, and Y is a starting point of a section where the cumulative frequency first exceeds 0.95, starting from the relative frequency in the initial section of 0 ≤ Re/(Ti + Zr) < 0.002.
A multilayer ceramic capacitor 1 comprises: an element 10 that includes a plurality of dielectric ceramic layers 20 and a plurality of internal electrode layers 30, which are layered in a thickness direction T; and external electrodes 11, 12 that are provided to a surface of the element 10 and are electrically connected to the internal electrode layers 30. The dielectric ceramic layers 20 include a perovskite-type oxide as a main component. The perovskite-type oxide includes at least one element among barium (Ba), calcium (Ca), and strontium (Sr), at least one element among titanium (Ti) and zirconium (Zr), and at least one rare earth element (Re). Regarding the Re/(Ti+Zr) ratios of each pixel of an atom%-converted elemental mapping image that is obtained by STEM-EDS analysis (scanning transmission electron microscopy-energy-dispersive X-ray spectroscopy) of the dielectric ceramic layers 20, when the range 0≤Re/(Ti+Zr)<2 is divided using an interval width of 0.002, the number of pixels belonging to each interval is counted, and the frequency of the number of pixels is converted to the relative frequency such that the cumulative frequency of 0≤Re/(Ti+Zr)<2 is 1, a Re/(Ti+Zr) low-frequency ratio, which results from combining the total relative frequency of the Re(Ti+Zr) intervals in which the relative frequency is greater than 0.005 and less than 0.03 in the range 0.002≤Re/(Ti+Zr)<2, and the relative frequency in the range 0≤Re/(Ti+Zr)<0.002, is 0.380 or less.
This multilayer ceramic capacitor 1 is provided with: an element body 10 including a plurality of dielectric ceramic layers 20 and a plurality of internal electrode layers 30 stacked in a thickness direction T; and external electrodes 11, 12 provided on the surface of the element body 10, the external electrodes 11, 12 being electrically connected to the internal electrode layers 30. The dielectric ceramic layer 20 contains a perovskite type oxide as a main component. The perovskite type oxide contains at least one of barium (Ba), calcium (Ca), and strontium (Sr), at least one of titanium (Ti) and zirconium (Zr), and at least one of rare earth elements (Re). For a Re/(Ti+Zr) ratio of each pixel of an element mapping image converted to atom%, obtainable by STEM-EDS analysis (scanning transmission electron microscope-energy dispersive X-ray spectroscopic analysis) of the dielectric ceramic layer 20, if the range of 0≤Re/(Ti+Zr)˂2 is divided by a section width 0.002, the number of pixels belonging to each section is enumerated, and the frequency of the number of pixels is converted to a relative frequency so that the cumulative frequency of 0≤Re/(Ti+Zr)˂2 becomes 1, then: the arithmetic mean of the Re/(Ti+Zr) ratio in the dielectric ceramic layer (hereinafter referred to as a "concentration ratio arithmetic mean") is 0.03 to 0.10 inclusive; a value obtained by dividing a starting point of a section in which the cumulative frequency exceeds 0.1 for the first time, starting from the relative frequency of a first section 0≤Re/(Ti+Zr)˂0.002, by the concentration ratio arithmetic mean (hereinafter referred to as a "10% cumulative frequency ratio to the concentration ratio arithmetic mean") is 0.50 or more; and a value obtained by dividing a starting point of a section in which the cumulative frequency exceeds 0.9 for the first time, starting from the relative frequency of the first section 0≤Re/(Ti+Zr)˂0.002, by the concentration ratio arithmetic mean (hereinafter referred to as a "90% cumulative frequency ratio to the concentration ratio arithmetic mean") is 1.30 or less.
Provided is an elastic wave device that improves resonance characteristics in a high-order mode. The elastic wave device comprises: a piezoelectric laminate having a first main surface and a second main surface on the opposite side from the first main surface in a first direction; an electrode provided on at least one among the first main surface and the second main surface of the piezoelectric laminate; and a support member provided on the second main surface side of the piezoelectric laminate and having an acoustic reflection part on the second main surface side of the piezoelectric laminate. At least a portion of the electrode is disposed so as to overlap the acoustic reflection part in a plan view in the first direction. The piezoelectric laminate comprises: a first piezoelectric layer having the second main surface; an intermediate layer laminated on the first piezoelectric layer; and a second piezoelectric layer laminated on the intermediate layer. At least one among the material and the polarization direction of the intermediate layer is different from that of the first piezoelectric layer. At least one among the material and the polarization direction of the intermediate layer is different from that of the second piezoelectric layer.
Described are concepts, circuits, systems and techniques directed toward N-phase control techniques useful in the design and control of supply generators configured for use in a wide variety of power management applications including, but not limited to mobile applications.
A tracker circuit is provided that includes a voltage generation circuit configured to generate multiple discrete voltages based on an input voltage; and a supply modulator configured to select a voltage from among the multiple discrete voltages, and to output the selected voltage in parallel to a first power amplifier and a second power amplifier. The first power amplifier is connected to an antenna and configured to amplify a millimeter-wave signal, and the second power amplifier is connected to an antenna different from the antenna and configured to amplify the millimeter-wave signal.
An electronic component that can suppress occurrence of problems such as electrochemical migration. An electronic component includes an insulator where a plurality of insulating substrates, each being provided with a side electrode and an inner electrode, are placed upon each other; and outer electrodes that are electrically connected to the side electrodes and that are provided at side surfaces of the insulator. The plurality of insulating substrates are each further provided with dummy electrodes that are disposed on a corresponding one of two sides of the side electrode with an insulating portion being interposed therebetween when viewed from a placement direction. The outer electrodes are electrically connected to the dummy electrodes at the side surfaces of the insulator.
H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
A ceramic substrate that includes: a base body including a ceramic layer; at least one inner conductor in the base body; a terminal electrode including a first electrode in contact with an outer surface of the base body and a second electrode covering a surface of the first electrode; and an insulating layer covering at least a portion of an outer periphery of the first electrode, the ceramic substrate including a section where the first electrode, the insulating layer, and the second electrode overlap in a thickness direction, the first electrode having a non-conductive component content of from 3% by weight to 40% by weight, the second electrode having a non-conductive component content of from 0% by weight to 10% by weight, and the non-conductive component content of the first electrode being equal to or greater than the non-conductive component content of the second electrode.
A resin laminated board includes resin layers laminated on one another and conductors located outside and inside the laminated resin layers. The resin layers include a first resin layer, a second resin layer, and a third resin layer sequentially laminated on one another. The conductors include first conductor layers, second conductor layers, and interlayer connection conductors. The first conductor layers are located at a lower main surface of the first resin layer. The second conductor layers or the interlayer connection conductors that overlap a portion of the first resin layer when viewed in a thickness direction of the third resin layer are located at the third resin layer. The second resin layer is a thermoplastic resin, and a melting point of the second resin layer is lower than a melting point of the first resin layer. At least the second resin layer includes air bubbles.
A multilayer ceramic component in which an external electrode has a thickness that does not inhibit ease of mounting. This multilayer ceramic component includes external electrodes. The external electrodes each include: a base film that extends to a first main surface and a second main surface and in contact with the internal electrode layers; an inner plating film in contact with the base film; and an outer plating film in contact with the inner plating film. The base film has a thickness that is 1.4 to 3.0 times the film thickness of the inner plating film and is 1.4 to 3.0 times the film thickness of the outer plating film. The film thickness of the base film is 0.4 to 0.6 times the total film thickness of the base film, the inner plating film and the outer plating film.
A secondary battery is provided and includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes a solvent. The solvent includes an anisole compound represented by Formula (1), and a content of the anisole compound in the solvent is 30 wt % or greater.
An antenna module includes dielectric substrates, ground electrodes, radiation electrodes, and a feed line. The dielectric substrates are flat. A third dielectric substrate is connected to rear surfaces of the first and second dielectric substrates and is rigid. A first radiation electrode is disposed at the first dielectric substrate closer to a top surface with respect to a first ground electrode. A second radiation electrode is disposed at the second dielectric substrate closer to a top surface with respect to a second ground electrode. A third ground electrode is disposed at a third dielectric substrate to electrically connect the first and second ground electrodes. The feed line is disposed at the third dielectric substrate to transmit a high-frequency signal from the first dielectric substrate to the second dielectric substrate. A normal direction of the first dielectric substrate and a normal direction of the second dielectric substrate differ from each other.
A multilayer ceramic capacitor includes a first opposing portion of a first internal electrode layer including a first high coverage region towards an outside of a laminate in a lamination direction with respect to a first extraction portion with a higher coverage than a coverage of the first extraction portion, and a second opposing portion including a second high coverage region towards an outside of the laminate in the lamination direction with respect to a second extraction portion with a higher coverage than a coverage of the second extraction portion.
A filter device includes a multilayer body, an input terminal, a ground terminal, first and second terminals, and first and second filter circuits. The first filter circuit includes first and second coils connected to in series between the input terminal and the first terminal. The filter circuit includes a third coil connected between the ground terminal and a signal path coupling the input terminal and the second terminal, and a fourth coil between the second terminal and the ground terminal. Each of the first coil and the fourth coil have a winding axis in a direction that extends in a stacking direction. Each of the second coil and the third coil has a winding axis in a direction that intersects the stacking direction. In plan view in the stacking direction, at least part of the first coil and the fourth coil are in between the second and the third coil.
H03H 7/46 - Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
H03H 1/00 - Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a glass transition temperature modifier. The glass transition temperature modifier contains a compound having a structure represented by general formula (1) below
wherein (In general formula (1), R1 is a C1-C12 hydrocarbon group. In general formula (1), R2 is a C1-C12 hydrocarbon group other than a benzene ring. In general formula (1), R3 is a hydrogen atom or a C1-C12 hydrocarbon group).
C08K 5/11 - EstersEther-esters of acyclic polycarboxylic acids
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
C08J 3/20 - Compounding polymers with additives, e.g. colouring
A composition contains an inorganic powder, a binder resin, and a plasticizer. The plasticizer contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a plasticizer. The plasticizer contains a compound having a structure represented by general formula (1) below
A composition contains an inorganic powder, a binder resin, and a plasticizer. The plasticizer contains a compound having a structure represented by general formula (1) below
wherein (In general formula (1), R1 is a C1-C12 hydrocarbon group. In general formula (1), R2 is a C1-C12 hydrocarbon group. In general formula (1), R3 is a hydrogen atom, a hydroxy group, a carboxy group, a C2-C12 ester group, a C2-C12 acyl group, a C2-C12 acyloxy group, or a C1-C12 alkoxy group. In general formula (1), X is a single bond or a C1-C12 hydrocarbon group. In general formula (1), R4 is a hydrogen atom, a C2-C12 acyl group, or a C1-C12 hydrocarbon group. In general formula (1), R5 is a hydrogen atom or a C1-C12 hydrocarbon group).
C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
B32B 27/22 - Layered products essentially comprising synthetic resin characterised by the use of special additives using plasticisers
A multilayer inductor includes terminal electrodes, a coil conductor, and an extended conductor. The terminal electrodes are on respective end surfaces of a multilayer body and extend onto side surfaces adjoining the end surfaces. The coil conductor is inside the multilayer body and includes loop-segment conductors. The extended conductor is extended from an end portion of the coil conductor and connected to the terminal electrode, and includes outside and inside via-conductors that penetrate through non-conductive layers in the thickness direction thereof to extend parallel to each other. The outside and inside via-conductors are connected, in parallel, to each other and also connected to the terminal electrode at the end surface. As the multilayer body is viewed through in the lamination direction of the non-conductive layers, all parts of the outside via-conductor overlap the loop-segment conductors, and the inside via-conductor is inside an inner periphery of the loop-segment conductors.
