- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
Patent holdings for IPC class H10B 80/00
Total number of patents in this class: 2330
10-year publication summary
|
0
|
0
|
0
|
0
|
0
|
3
|
145
|
715
|
966
|
482
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 153845 |
905 |
| Micron Technology, Inc. | 27285 |
192 |
| Kioxia Corporation | 10709 |
130 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47319 |
122 |
| SK Hynix Inc. | 12154 |
107 |
| Yangtze Memory Technologies Co., Ltd. | 3156 |
86 |
| Intel Corporation | 46680 |
68 |
| Sandisk Technologies Inc. | 5366 |
56 |
| Qualcomm Incorporated | 90221 |
44 |
| JPMorgan Chase Bank, N.A., AS The Agent | 2697 |
35 |
| Monolithic 3D Inc. | 330 |
29 |
| Advanced Micro Devices, Inc. | 6008 |
25 |
| Adeia Semiconductor Bonding Technologies Inc. | 550 |
22 |
| International Business Machines Corporation | 62220 |
20 |
| Nanya Technology Corporation | 2850 |
19 |
| Cxmt Corporation | 356 |
19 |
| Mediatek Inc. | 5398 |
16 |
| Huawei Technologies Co., Ltd. | 120098 |
15 |
| Etron Technology, Inc. | 182 |
15 |
| Changxin Memory Technologies, Inc. | 4924 |
15 |
| Other owners | 390 |