- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 7/10 - Plug-in assemblages of components
Patent holdings for IPC class H05K 7/10
Total number of patents in this class: 949
10-year publication summary
|
127
|
72
|
69
|
74
|
41
|
39
|
39
|
31
|
20
|
16
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 47062 |
46 |
| Hewlett Packard Enterprise Development LP | 10732 |
25 |
| Samsung Electronics Co., Ltd. | 147131 |
24 |
| Foxconn Interconnect Technology Limited | 1103 |
23 |
| Dell Products L.P. | 14595 |
17 |
| Hon Hai Precision Industry Co., Ltd. | 4030 |
15 |
| Shinko Electric Industries Co., Ltd. | 1211 |
15 |
| TE Connectivity Solutions GmbH | 2819 |
15 |
| Lotes Co., Ltd. | 352 |
14 |
| Huawei Technologies Co., Ltd. | 113340 |
13 |
| Murata Manufacturing Co., Ltd. | 24650 |
13 |
| Apple Inc. | 55287 |
12 |
| International Business Machines Corporation | 61353 |
12 |
| Cisco Technology, Inc. | 19989 |
11 |
| Samsung Electro-mechanics Co., Ltd. | 5634 |
9 |
| Samsung Display Co., Ltd. | 35017 |
8 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
8 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 331 |
8 |
| Hewlett-Packard Development Company, L.P. | 25841 |
7 |
| Infineon Technologies AG | 8244 |
7 |
| Other owners | 647 |