- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/42 - Plated through-holes
Patent holdings for IPC class H05K 3/42
Total number of patents in this class: 1739
10-year publication summary
|
176
|
129
|
151
|
172
|
157
|
125
|
120
|
140
|
115
|
96
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ibiden Co., Ltd. | 1721 |
77 |
| Intel Corporation | 47129 |
49 |
| International Business Machines Corporation | 61471 |
44 |
| Samsung Electro-mechanics Co., Ltd. | 5654 |
40 |
| Shinko Electric Industries Co., Ltd. | 1212 |
40 |
| Avary Holding (Shenzhen) Co., Limited. | 304 |
40 |
| Unimicron Technology Corp. | 467 |
35 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 145 |
31 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 508 |
29 |
| Sumitomo Electric Industries, Ltd. | 15609 |
28 |
| Sumitomo Electric Printed Circuits, Inc. | 308 |
26 |
| Murata Manufacturing Co., Ltd. | 24741 |
24 |
| Kyocera Corporation | 13930 |
24 |
| LG Innotek Co., Ltd. | 7738 |
24 |
| Sanmina Corporation | 188 |
20 |
| Samsung Electronics Co., Ltd. | 147622 |
19 |
| Atotech Deutschland GmbH | 554 |
17 |
| Catlam LLC | 27 |
17 |
| Amphenol Corporation | 760 |
16 |
| MacDermid Enthone Inc. | 239 |
16 |
| Other owners | 1123 |