- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Patent holdings for IPC class H05K 3/06
Total number of patents in this class: 1478
10-year publication summary
130
|
147
|
131
|
142
|
119
|
119
|
147
|
83
|
67
|
45
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
FUJIFILM Corporation | 29350 |
84 |
Avary Holding (Shenzhen) Co., Limited. | 304 |
43 |
Hitachi Chemical Company, Ltd. | 2352 |
38 |
LG Innotek Co., Ltd. | 7635 |
30 |
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 145 |
26 |
JX Nippon Mining & Metals Corporation | 1489 |
26 |
Unimicron Technology Corp. | 468 |
26 |
Samsung Electro-mechanics Co., Ltd. | 5612 |
24 |
Resonac Corporation | 2790 |
24 |
Nitto Denko Corporation | 8230 |
23 |
Ibiden Co., Ltd. | 1703 |
23 |
Asahi Kasei Kabushiki Kaisha | 2666 |
20 |
LG Chem, Ltd. | 17620 |
18 |
International Business Machines Corporation | 61210 |
17 |
Boe Technology Group Co., Ltd. | 41047 |
16 |
MEC Company Ltd. | 82 |
16 |
Qing Ding Precision Electronics (Huaian) Co.,Ltd | 121 |
16 |
at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 489 |
15 |
Mitsubishi Gas Chemical Company, Inc. | 3461 |
15 |
3m Innovative Properties Company | 17849 |
14 |
Other owners | 964 |