- All sections
- H - Electricity
- H04N - Pictorial communication, e.g. television
- H04N 25/79 - Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
Patent holdings for IPC class H04N 25/79
Total number of patents in this class: 542
10-year publication summary
0
|
0
|
1
|
4
|
5
|
38
|
106
|
128
|
163
|
81
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Sony Semiconductor Solutions Corporation | 10547 |
202 |
Canon Inc. | 40216 |
73 |
Nikon Corporation | 7200 |
45 |
Samsung Electronics Co., Ltd. | 147131 |
44 |
Sony Group Corporation | 14002 |
26 |
Micron Technology, Inc. | 26138 |
11 |
Semiconductor Energy Laboratory Co., Ltd. | 11456 |
9 |
OmniVision Technologies, Inc. | 1557 |
9 |
Panasonic Intellectual Property Management Co., Ltd. | 31696 |
8 |
Sony Advanced Visual Sensing AG | 74 |
8 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
7 |
Semiconductor Components Industries, L.L.C. | 5270 |
6 |
Sony Corporation | 30979 |
4 |
FUJIFILM Corporation | 29489 |
4 |
Depuy Synthes Products, LLC | 2800 |
4 |
Beijing Ruisizhixin Technology Co., Ltd. | 15 |
4 |
Adeia Imaging LLC | 131 |
4 |
SK Hynix Inc. | 11428 |
3 |
Waymo LLC | 3135 |
3 |
Prophesee | 76 |
3 |
Other owners | 65 |