- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/22 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate using similar magnetic field effects
Patent holdings for IPC class H01L 27/22
Total number of patents in this class: 3722
10-year publication summary
|
364
|
399
|
430
|
598
|
667
|
432
|
198
|
158
|
35
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 146346 |
398 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
396 |
| International Business Machines Corporation | 61257 |
285 |
| Kioxia Corporation | 10293 |
282 |
| SK Hynix Inc. | 11368 |
177 |
| TDK Corporation | 6748 |
148 |
| United Microelectronics Corp. | 4229 |
119 |
| Integrated Silicon Solutions, (Cayman) Inc. | 221 |
115 |
| Intel Corporation | 47005 |
113 |
| GLOBALFOUNDRIES Singapore Pte. Ltd. | 803 |
96 |
| Everspin Technologies, Inc. | 483 |
95 |
| Micron Technology, Inc. | 26238 |
90 |
| Sony Corporation | 31036 |
88 |
| Qualcomm Incorporated | 85434 |
83 |
| Avalanche Technology, Inc. | 303 |
70 |
| Sandisk Technologies Inc. | 4809 |
48 |
| Toshiba Corporation | 12345 |
45 |
| Tohoku University | 2785 |
43 |
| Allegro Microsystems, LLC | 1336 |
33 |
| GLOBALFOUNDRIES U.S. Inc. | 6432 |
31 |
| Other owners | 967 |