- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/102 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
Patent holdings for IPC class H01L 27/102
Total number of patents in this class: 416
10-year publication summary
39
|
54
|
40
|
44
|
32
|
19
|
9
|
5
|
3
|
3
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Micron Technology, Inc. | 26209 |
55 |
Zeno Semiconductor, Inc. | 250 |
47 |
SanDisk 3D LLC | 276 |
44 |
Samsung Electronics Co., Ltd. | 145025 |
17 |
TC Lab, Inc. | 31 |
14 |
Macronix International Co., Ltd. | 2561 |
10 |
Nantero, Inc. | 176 |
10 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 42389 |
9 |
Murata Manufacturing Co., Ltd. | 24444 |
9 |
SK Hynix Inc. | 11285 |
8 |
Ovonyx Memory Technology, LLC | 412 |
7 |
Kioxia Corporation | 10286 |
7 |
Texas Instruments Incorporated | 19494 |
6 |
Sandisk Technologies Inc. | 4796 |
6 |
Renesas Electronics Corporation | 6046 |
5 |
Attopsemi Technology Co., Ltd | 69 |
5 |
GLOBALFOUNDRIES U.S. Inc. | 6429 |
5 |
Infineon Technologies AG | 8209 |
4 |
Rohm Co., Ltd. | 6429 |
4 |
HangZhou HaiCun Information Technology Co., Ltd. | 45 |
4 |
Other owners | 140 |