- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
Patent holdings for IPC class H01L 27/06
Total number of patents in this class: 7382
10-year publication summary
738
|
694
|
732
|
747
|
699
|
577
|
586
|
532
|
519
|
261
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
768 |
Semiconductor Energy Laboratory Co., Ltd. | 11475 |
579 |
Fuji Electric Co., Ltd. | 5194 |
338 |
International Business Machines Corporation | 61433 |
254 |
Samsung Electronics Co., Ltd. | 147501 |
234 |
Texas Instruments Incorporated | 19455 |
214 |
Micron Technology, Inc. | 26183 |
202 |
Intel Corporation | 47143 |
176 |
Rohm Co., Ltd. | 6480 |
159 |
Renesas Electronics Corporation | 5987 |
158 |
Mitsubishi Electric Corporation | 46397 |
148 |
GLOBALFOUNDRIES U.S. Inc. | 6420 |
143 |
Monolithic 3D Inc. | 308 |
142 |
Qualcomm Incorporated | 86346 |
136 |
Infineon Technologies AG | 8250 |
110 |
Denso Corporation | 24431 |
99 |
United Microelectronics Corp. | 4244 |
97 |
Infineon Technologies Austria AG | 2166 |
93 |
Sony Semiconductor Solutions Corporation | 10599 |
89 |
Toshiba Corporation | 12472 |
88 |
Other owners | 3155 |