• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 27/06 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration

Patent holdings for IPC class H01L 27/06

Total number of patents in this class: 7382

10-year publication summary

738
694
732
747
699
577
586
532
519
261
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
43258
768
Semiconductor Energy Laboratory Co., Ltd.
11475
579
Fuji Electric Co., Ltd.
5194
338
International Business Machines Corporation
61433
254
Samsung Electronics Co., Ltd.
147501
234
Texas Instruments Incorporated
19455
214
Micron Technology, Inc.
26183
202
Intel Corporation
47143
176
Rohm Co., Ltd.
6480
159
Renesas Electronics Corporation
5987
158
Mitsubishi Electric Corporation
46397
148
GLOBALFOUNDRIES U.S. Inc.
6420
143
Monolithic 3D Inc.
308
142
Qualcomm Incorporated
86346
136
Infineon Technologies AG
8250
110
Denso Corporation
24431
99
United Microelectronics Corp.
4244
97
Infineon Technologies Austria AG
2166
93
Sony Semiconductor Solutions Corporation
10599
89
Toshiba Corporation
12472
88
Other owners 3155