- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
Patent holdings for IPC class H01L 23/535
Total number of patents in this class: 2792
10-year publication summary
|
272
|
412
|
351
|
307
|
252
|
247
|
327
|
320
|
223
|
160
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46182 |
612 |
| Samsung Electronics Co., Ltd. | 149198 |
345 |
| International Business Machines Corporation | 61747 |
214 |
| Micron Technology, Inc. | 26591 |
135 |
| GLOBALFOUNDRIES U.S. Inc. | 6419 |
126 |
| Intel Corporation | 46471 |
82 |
| Kioxia Corporation | 10455 |
74 |
| SK Hynix Inc. | 11690 |
71 |
| United Microelectronics Corp. | 4311 |
71 |
| Yangtze Memory Technologies Co., Ltd. | 2967 |
63 |
| Nanya Technology Corporation | 2664 |
50 |
| Renesas Electronics Corporation | 5925 |
46 |
| Sandisk Technologies Inc. | 5034 |
42 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1750 |
32 |
| Qualcomm Incorporated | 87720 |
31 |
| Macronix International Co., Ltd. | 2535 |
31 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1034 |
25 |
| Texas Instruments Incorporated | 19498 |
21 |
| Rohm Co., Ltd. | 6561 |
21 |
| Changxin Memory Technologies, Inc. | 4928 |
19 |
| Other owners | 681 |