- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/485 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
Patent holdings for IPC class H01L 23/485
Total number of patents in this class: 1926
10-year publication summary
|
160
|
164
|
236
|
211
|
145
|
134
|
121
|
104
|
75
|
39
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42804 |
397 |
| Samsung Electronics Co., Ltd. | 146346 |
147 |
| International Business Machines Corporation | 61257 |
106 |
| Intel Corporation | 47005 |
99 |
| Qualcomm Incorporated | 85434 |
39 |
| United Microelectronics Corp. | 4229 |
36 |
| Texas Instruments Incorporated | 19460 |
34 |
| Renesas Electronics Corporation | 6009 |
34 |
| GLOBALFOUNDRIES U.S. Inc. | 6432 |
34 |
| Micron Technology, Inc. | 26238 |
29 |
| NXP B.V. | 1929 |
23 |
| Monolithic 3D Inc. | 308 |
21 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10912 |
19 |
| IBM United Kingdom Limited | 4345 |
16 |
| Infineon Technologies AG | 8225 |
15 |
| Parabellum Strategic Opportunities Fund LLC | 199 |
15 |
| Samsung Display Co., Ltd. | 34798 |
14 |
| Huawei Technologies Co., Ltd. | 112690 |
13 |
| Advanced Semiconductor Engineering, Inc. | 1653 |
13 |
| Nanya Technology Corporation | 2468 |
13 |
| Other owners | 809 |