- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
Patent holdings for IPC class H01L 23/482
Total number of patents in this class: 1004
10-year publication summary
|
91
|
104
|
91
|
91
|
83
|
68
|
69
|
68
|
46
|
21
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49324 |
74 |
| Semiconductor Components Industries, L.L.C. | 5259 |
50 |
| Rohm Co., Ltd. | 6919 |
36 |
| Intel Corporation | 46327 |
35 |
| Infineon Technologies AG | 8427 |
34 |
| Mitsubishi Electric Corporation | 48460 |
25 |
| Samsung Electronics Co., Ltd. | 159473 |
23 |
| Renesas Electronics Corporation | 5846 |
21 |
| Texas Instruments Incorporated | 19638 |
18 |
| Toshiba Corporation | 12727 |
17 |
| Qualcomm Incorporated | 93847 |
16 |
| Wolfspeed, Inc. | 923 |
15 |
| Micron Technology, Inc. | 27901 |
14 |
| Murata Manufacturing Co., Ltd. | 25998 |
13 |
| Fuji Electric Co., Ltd. | 5548 |
13 |
| Infineon Technologies Americas Corp. | 1937 |
13 |
| Infineon Technologies Canada Inc. | 100 |
13 |
| Cree, Inc. | 906 |
12 |
| Skyworks Solutions, Inc. | 3996 |
12 |
| NXP USA, Inc. | 4415 |
12 |
| Other owners | 538 |