- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body
Patent holdings for IPC class H01L 23/482
Total number of patents in this class: 998
10-year publication summary
|
91
|
104
|
91
|
91
|
84
|
69
|
71
|
73
|
46
|
3
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46469 |
75 |
| Semiconductor Components Industries, L.L.C. | 5298 |
50 |
| Intel Corporation | 46569 |
36 |
| Rohm Co., Ltd. | 6657 |
34 |
| Infineon Technologies AG | 8301 |
32 |
| Samsung Electronics Co., Ltd. | 150751 |
22 |
| Mitsubishi Electric Corporation | 47267 |
22 |
| Renesas Electronics Corporation | 5903 |
21 |
| Toshiba Corporation | 12538 |
18 |
| Texas Instruments Incorporated | 19530 |
18 |
| Qualcomm Incorporated | 88424 |
15 |
| Wolfspeed, Inc. | 805 |
15 |
| Micron Technology, Inc. | 26981 |
14 |
| Murata Manufacturing Co., Ltd. | 25207 |
13 |
| Fuji Electric Co., Ltd. | 5310 |
13 |
| Infineon Technologies Americas Corp. | 926 |
13 |
| Cree, Inc. | 954 |
12 |
| Skyworks Solutions, Inc. | 3843 |
12 |
| NXP USA, Inc. | 4383 |
12 |
| Samsung Display Co., Ltd. | 37068 |
11 |
| Other owners | 540 |