- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/46 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids
Patent holdings for IPC class H01L 23/46
Total number of patents in this class: 461
10-year publication summary
|
19
|
32
|
32
|
36
|
55
|
28
|
43
|
45
|
56
|
51
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 61734 |
24 |
| Intel Corporation | 46445 |
21 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46069 |
20 |
| Frore Systems Inc. | 109 |
20 |
| Adeia Semiconductor Bonding Technologies Inc. | 404 |
16 |
| Fuji Electric Co., Ltd. | 5243 |
13 |
| Denso Corporation | 24755 |
12 |
| Hyundai Motor Company | 22753 |
11 |
| Kia Corporation | 10482 |
11 |
| Raytheon Company | 8396 |
9 |
| Mitsubishi Electric Corporation | 46870 |
8 |
| Siemens AG | 24337 |
5 |
| Toyota Motor Corporation | 33378 |
5 |
| Micron Technology, Inc. | 26502 |
5 |
| Robert Bosch GmbH | 43034 |
5 |
| Google LLC | 43044 |
5 |
| Samsung Electronics Co., Ltd. | 148924 |
4 |
| Infineon Technologies AG | 8279 |
4 |
| Rohm Co., Ltd. | 6553 |
4 |
| Danfoss Silicon Power GmbH | 168 |
4 |
| Other owners | 255 |