- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/373 - Cooling facilitated by selection of materials for the device
Patent holdings for IPC class H01L 23/373
Total number of patents in this class: 5923
10-year publication summary
|
446
|
509
|
537
|
586
|
493
|
520
|
502
|
473
|
593
|
513
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43854 |
266 |
| Mitsubishi Electric Corporation | 46590 |
209 |
| Fuji Electric Co., Ltd. | 5214 |
182 |
| Intel Corporation | 47239 |
172 |
| Samsung Electronics Co., Ltd. | 147983 |
145 |
| Infineon Technologies AG | 8257 |
125 |
| Denka Company Limited | 2630 |
115 |
| Mitsubishi Materials Corporation | 2470 |
114 |
| Semiconductor Components Industries, L.L.C. | 5275 |
100 |
| International Business Machines Corporation | 61596 |
98 |
| Rohm Co., Ltd. | 6511 |
86 |
| Micron Technology, Inc. | 26255 |
78 |
| Siemens AG | 24353 |
75 |
| Denso Corporation | 24562 |
72 |
| Sekisui Chemical Co., Ltd. | 3472 |
57 |
| Shin-Etsu Chemical Co., Ltd. | 5708 |
56 |
| Texas Instruments Incorporated | 19456 |
55 |
| Toshiba Corporation | 12516 |
53 |
| Huawei Technologies Co., Ltd. | 114320 |
51 |
| Qorvo US, Inc. | 2255 |
49 |
| Other owners | 3765 |