- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/367 - Cooling facilitated by shape of device
Patent holdings for IPC class H01L 23/367
Total number of patents in this class: 6430
10-year publication summary
|
477
|
504
|
603
|
663
|
661
|
654
|
618
|
590
|
702
|
566
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43854 |
581 |
| Intel Corporation | 47239 |
361 |
| Samsung Electronics Co., Ltd. | 147983 |
322 |
| Mitsubishi Electric Corporation | 46590 |
188 |
| International Business Machines Corporation | 61596 |
180 |
| Micron Technology, Inc. | 26255 |
121 |
| Infineon Technologies AG | 8257 |
109 |
| Huawei Technologies Co., Ltd. | 114320 |
108 |
| Fuji Electric Co., Ltd. | 5214 |
98 |
| Denso Corporation | 24562 |
95 |
| Qualcomm Incorporated | 86867 |
89 |
| Semiconductor Components Industries, L.L.C. | 5275 |
78 |
| Monolithic 3D Inc. | 312 |
71 |
| Rohm Co., Ltd. | 6511 |
65 |
| Advanced Semiconductor Engineering, Inc. | 1670 |
64 |
| NXP USA, Inc. | 4318 |
64 |
| Texas Instruments Incorporated | 19456 |
59 |
| Murata Manufacturing Co., Ltd. | 24829 |
54 |
| Qorvo US, Inc. | 2255 |
54 |
| Siemens AG | 24353 |
53 |
| Other owners | 3616 |