- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 23/28
Total number of patents in this class: 2207
10-year publication summary
|
140
|
163
|
210
|
183
|
177
|
131
|
154
|
97
|
77
|
93
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 24829 |
216 |
| Mitsubishi Electric Corporation | 46590 |
174 |
| STATS ChipPAC Pte. Lte. | 1553 |
96 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43854 |
94 |
| Rohm Co., Ltd. | 6511 |
91 |
| Intel Corporation | 47239 |
65 |
| Denso Corporation | 24562 |
48 |
| Samsung Electronics Co., Ltd. | 147983 |
43 |
| Texas Instruments Incorporated | 19456 |
38 |
| Infineon Technologies AG | 8257 |
38 |
| Panasonic Corporation | 20030 |
34 |
| Fuji Electric Co., Ltd. | 5214 |
31 |
| Advanced Semiconductor Engineering, Inc. | 1670 |
30 |
| Micron Technology, Inc. | 26255 |
28 |
| Shindengen Electric Manufacturing Co., Ltd. | 825 |
24 |
| Renesas Electronics Corporation | 5969 |
20 |
| Hitachi Automotive Systems, Ltd. | 3955 |
19 |
| Sony Semiconductor Solutions Corporation | 10700 |
19 |
| Amkor Technology Singapore Holding Pte.ltd. | 504 |
17 |
| Siliconware Precision Industries Co., Ltd. | 610 |
15 |
| Other owners | 1067 |