- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/18 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
Patent holdings for IPC class H01L 23/18
Total number of patents in this class: 176
10-year publication summary
|
24
|
20
|
18
|
17
|
15
|
13
|
11
|
13
|
17
|
6
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47211 |
25 |
| Samsung Electronics Co., Ltd. | 153573 |
14 |
| Intel Corporation | 46638 |
14 |
| Infineon Technologies AG | 8383 |
10 |
| Texas Instruments Incorporated | 19615 |
7 |
| Micron Technology, Inc. | 27266 |
6 |
| Mitsubishi Electric Corporation | 47556 |
6 |
| Fuji Electric Co., Ltd. | 5383 |
5 |
| Advanced Semiconductor Engineering, Inc. | 1701 |
4 |
| Nanya Technology Corporation | 2849 |
4 |
| International Business Machines Corporation | 62182 |
3 |
| Shinko Electric Industries Co., Ltd. | 1221 |
3 |
| Amkor Technology Singapore Holding Pte. Ltd | 462 |
3 |
| Amkor Technology Singapore Holding Pte.ltd. | 492 |
3 |
| 3m Innovative Properties Company | 17511 |
2 |
| Samsung Display Co., Ltd. | 37753 |
2 |
| Renesas Electronics Corporation | 5871 |
2 |
| Semiconductor Components Industries, L.L.C. | 5262 |
2 |
| The Board of Trustees of the University of Illinois | 2739 |
2 |
| ams International AG | 443 |
2 |
| Other owners | 57 |