- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Patent holdings for IPC class H01L 23/10
Total number of patents in this class: 1490
10-year publication summary
114
|
106
|
139
|
137
|
104
|
86
|
89
|
87
|
87
|
44
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 42704 |
143 |
Mitsubishi Electric Corporation | 46093 |
73 |
Murata Manufacturing Co., Ltd. | 24526 |
34 |
Intel Corporation | 46962 |
33 |
Nippon Electric Glass Co., Ltd. | 2456 |
28 |
Fuji Electric Co., Ltd. | 5140 |
27 |
Samsung Electronics Co., Ltd. | 146092 |
25 |
Texas Instruments Incorporated | 19470 |
22 |
Kyocera Corporation | 13799 |
22 |
Advanced Semiconductor Engineering, Inc. | 1652 |
22 |
Infineon Technologies AG | 8221 |
21 |
Raytheon Company | 8389 |
21 |
International Business Machines Corporation | 61228 |
20 |
Semiconductor Components Industries, L.L.C. | 5251 |
20 |
Denso Corporation | 24282 |
15 |
Rohm Co., Ltd. | 6450 |
15 |
Qorvo US, Inc. | 2217 |
14 |
NXP USA, Inc. | 4299 |
14 |
Apple Inc. | 54844 |
13 |
Invensas Corporation | 613 |
13 |
Other owners | 895 |