- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/057 - ContainersSeals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body the leads being parallel to the base
Patent holdings for IPC class H01L 23/057
Total number of patents in this class: 218
10-year publication summary
|
26
|
28
|
28
|
20
|
17
|
11
|
10
|
10
|
8
|
10
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 5122 |
33 |
| Kyocera Corporation | 13721 |
24 |
| Mitsubishi Electric Corporation | 45899 |
19 |
| Infineon Technologies AG | 8210 |
13 |
| NXP USA, Inc. | 4292 |
7 |
| Apple Inc. | 54577 |
6 |
| Samsung Electronics Co., Ltd. | 144675 |
4 |
| Toshiba Corporation | 12317 |
4 |
| Robert Bosch GmbH | 42596 |
4 |
| International Business Machines Corporation | 61144 |
3 |
| Texas Instruments Incorporated | 19481 |
3 |
| Medtronic, Inc. | 9797 |
3 |
| Semiconductor Components Industries, L.L.C. | 5252 |
3 |
| Global Circuit Innovations Incorporated | 20 |
3 |
| MACOM Technology Solutions Holdings, Inc. | 820 |
3 |
| Vicor Corporation | 125 |
3 |
| Qualcomm Mems Technologies, Inc. | 628 |
2 |
| Siemens AG | 24552 |
2 |
| Renesas Electronics Corporation | 6050 |
2 |
| Samsung Electro-mechanics Co., Ltd. | 5560 |
2 |
| Other owners | 75 |